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Vishay General Semiconductor - Diodes Division T6N30AHM3/I

Part No.:
T6N30AHM3/I
Manufacturer:
Vishay General Semiconductor - Diodes Division
Category:
TVS Diodes
Package:
2-VDFN
Datasheet:
AetrixT6N30AHM3/I.pdf
Description:
LOW-PROFILE VERSION 600 W UNI-DI
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:14,000

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Product details

Overview

T6N30AHM3/I from Vishay General Semiconductor is a unidirectional surface-mount PAR® Transient Voltage Suppressor in DFN3820A package, rated for 30 V nominal breakdown voltage (VBR), 25.6 V stand-off voltage (VWM), and 600 W peak pulse power (10/1000 μs). It delivers 14.5 A peak pulse current and clamps to 41.4 V at IPPM, with AEC-Q101 qualification and 185 °C junction temperature capability for automotive sensor line protection.

For engineers reviewing the T6N30AHM3/I datasheet, T6N30AHM3/I pinout, T6N30AHM3/I application, or T6N30AHM3/I equivalent, this device is selected for high-reliability transient suppression in space-constrained automotive ECUs where low-profile side-wettable flanks enable AOI-compatible assembly and TJ = 185 °C operation ensures robustness under under-hood thermal stress.

Technical Context

This TVS diode employs passivated anisotropic rectifier technology optimized for low-leakage, stable clamping across temperature. Its unidirectional configuration supports DC-biased signal and power rail protection, with VBR temperature coefficient of +0.088 %/°C enabling predictable voltage shift over -65 °C to +185 °C operating range.

The DFN3820A package provides low thermal resistance (RθJM = 5 °C/W typical) and meets MSL Level 1 (260 °C peak reflow), while its side-wettable flanks support automated optical inspection-critical for zero-defect automotive manufacturing flow.

Key Specifications

ParameterValue and Actual Design Meaning
VBR (Nominal)30.0 V - Stable breakdown threshold at 1 mA test current; defines minimum clamping onset voltage under transient stress.
VWM25.6 V - Maximum continuous reverse working voltage; ensures no conduction during normal system operation.
PPPM (10/1000 μs)600 W - Sustains high-energy transients (e.g., ISO 7637-2 Pulse 1/2a) without failure in automotive load-dump scenarios.
IPPM14.5 A - Peak surge current handling capacity; determines survivability against lightning-induced or inductive-switching spikes.
VC at IPPM41.4 V - Clamped voltage during max surge; limits downstream IC/MOSFET stress below safe operating thresholds.
TJ max+185 °C - Enables placement near heat sources (e.g., power stages) in engine control modules without derating.
ESD immunity±30 kV (contact/air) per IEC 61000-4-2 - Protects sensor interfaces from human-body-model ESD events in assembly and field use.

Pinout & Package

Package: DFN3820A - 2-terminal, leadless, halogen-free, RoHS-compliant surface-mount package with side-wettable flanks (0.88 mm height, 3.95 mm × 2.18 mm footprint); anode connected to exposed thermal pad, cathode marked by color band.

Pin/TerminalCircuit RoleDesign Meaning
Anode (thermal pad)Common reference and heat sink nodeElectrically tied to PCB ground plane; primary thermal path to board; must be soldered to ≥20 mm² copper pour for RθJM ≤ 6.5 °C/W.
Cathode (marked side)Transient current return pathConnected to protected line (e.g., CAN_H, LIN, sensor supply); conducts surge current to ground when V > VBR.

Key Features

FeatureDesign Value
AEC-Q101 qualifiedValidated for automotive-grade reliability including HTOL, TC, HAST, and ESD stress-enables direct use in ASIL-B systems without additional qualification.
Side-wettable flanksEnables 100 % automated optical inspection of solder joint integrity on both terminals-eliminates X-ray requirement in Tier-1 production lines.
Junction passivationReduces IR leakage to ≤1.0 μA at VWM and ≤6.0 μA at TJ = 150 °C-preserves signal integrity on low-power sensor analog inputs.
Low-profile height (0.88 mm)Permits integration beneath connectors or in stacked PCB assemblies where Z-height is constrained to <1.0 mm.

Applications

Automotive Sensor ProtectionCAN Bus Line Protection

Use Scenario: Protecting analog output sensors (e.g., pressure, temperature) in engine control units from load dump and alternator ripple transients.

IC Role / Device Role / Timing Role: Unidirectional TVS placed between sensor VDD and chassis ground to clamp overvoltage before it reaches ASIC input pins.

Use Value: Maintains VWM = 25.6 V margin above 12 V nominal supply while clamping to 41.4 V-prevents latch-up or gate oxide damage in 3.3 V/5 V sensor interface ICs.

Use Scenario: Safeguarding high-speed CAN FD transceivers (e.g., TJA1044) against ESD and coupled surges on differential bus lines.

IC Role / Device Role / Timing Role: Paired unidirectional TVS devices (one per line) referenced to common ground, absorbing common-mode transients without distorting signal edges.

Use Value: 41.4 V clamping voltage stays well below CAN transceiver absolute maximum ratings (typically ±40 V common-mode), preserving signal integrity up to 5 Mbps.

Power Rail Surge SuppressionInfotainment Display Interface Protection

Use Scenario: Shielding 5 V/3.3 V power rails feeding ADAS camera modules from ISO 7637-2 Pulse 5a (load dump) events.

IC Role / Device Role / Timing Role: TVS placed at power entry point upstream of LDO regulators to absorb energy before it propagates into sensitive imaging SoCs.

Use Value: 600 W peak pulse rating handles 12 V system load dump surges (up to 60 V, 100 ms) with minimal voltage overshoot due to fast response (<1 ns).

Use Scenario: Guarding MIPI DSI/CSI data lanes in digital instrument clusters against ESD during connector mating/unmating.

IC Role / Device Role / Timing Role: Low-capacitance TVS (CJ ≈ 100 pF at 0 V) placed inline on each differential pair to shunt ESD without degrading 1.5 Gbps eye diagram.

Use Value: Junction capacitance remains stable across bias (measured at 1 MHz), minimizing signal attenuation and jitter on high-speed serial links.

Equivalent & Alternatives

The following parts are listed as comparable options for similar unidirectional TVS protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SMAJ30ADO-214AC package (SMA), higher RθJA (≈200 °C/W), VBR = 33.3–36.8 V, IPPM = 13.9 A, VC = 48.4 VLarger footprint (4.5 × 2.7 mm vs. 3.95 × 2.18 mm), no side-wettable flanks, not AEC-Q101 qualifiedSelect when cost sensitivity outweighs AOI requirements and board space permits larger package.
SMCJ33A-QDO-214AB (SMC) package, AEC-Q101 qualified, VBR = 36.7–40.6 V, IPPM = 12.3 A, VC = 53.3 V, RθJA ≈ 15 °C/WHigher clamping voltage (53.3 V), larger size (7.1 × 6.2 mm), better thermal dissipation but incompatible with fine-pitch automated placementChoose for higher-energy surge environments where 53.3 V clamping is acceptable and thermal management prioritizes heatsink mounting.

Compared with SMAJ30A and SMCJ33A-Q, the T6N30AHM3/I offers superior board-level integration via DFN3820A's compact AOI-ready form factor, tighter VBR tolerance (±5 %), and lower clamping voltage (41.4 V), making it optimal for next-generation automotive electronics where space, reliability, and manufacturability are co-constrained.

Availability

T6N30AHM3/I is available at Aetrix Electronics and suitable for automotive sensor protection, CAN bus line hardening, and power rail surge suppression requiring stable component supply across extended temperature ranges and high-volume production cycles.

Supply support for T6N30AHM3/I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay General Semiconductor designs and manufactures discrete semiconductors-including diodes, MOSFETs, and TVS devices-with emphasis on high-reliability, automotive-qualified components meeting stringent AEC-Q standards.

The T6N30AHM3/I belongs to Vishay's PAR® (Protected Anisotropic Rectifier) TVS family, engineered specifically for automotive-grade transient suppression where high-temperature stability, low-profile packaging, and process-controlled passivation are mandatory for under-hood deployment.

FAQ

What is the breakdown voltage tolerance for T6N30AHM3/I?

The T6N30AHM3/I has a breakdown voltage tolerance of ±5 %, with VBR specified from 28.5 V (min) to 31.5 V (max) at 1 mA test current. This tight tolerance ensures consistent clamping behavior across production lots and simplifies design margining for automotive safety-critical circuits where predictable overvoltage response is required.

Is T6N30AHM3/I compatible with lead-free reflow processes?

Yes, the T6N30AHM3/I is fully compatible with lead-free reflow processes, meeting J-STD-020 MSL Level 1 with a maximum peak temperature of 260 °C. Its matte tin-plated terminals and halogen-free molding compound ensure reliable solder joint formation and long-term intermetallic stability in high-volume SMT assembly lines.

How does the DFN3820A package of T6N30AHM3/I support automated optical inspection?

The DFN3820A package of T6N30AHM3/I features side-wettable flanks-exposed metal on the vertical sidewalls of the terminals-that reflect light uniformly during AOI. This enables high-confidence detection of solder fillet shape, volume, and bridging defects without requiring X-ray, reducing inspection cost and cycle time in automotive-tier production.

What is the maximum junction temperature rating for T6N30AHM3/I?

The T6N30AHM3/I is rated for a maximum junction temperature of +185 °C, validated per AEC-Q101 stress testing. This allows placement in high-temperature zones such as near power converters or within engine control modules, where ambient temperatures exceed 125 °C and thermal derating margins must be preserved.

Does T6N30AHM3/I meet IEC 61000-4-2 ESD immunity requirements?

Yes, the T6N30AHM3/I achieves ±30 kV contact discharge and ±30 kV air discharge per IEC 61000-4-2, verified in characterization. This level of ESD robustness protects downstream circuitry in automotive infotainment and body control modules during handling, assembly, and end-user interaction without requiring supplemental protection.

T6N30AHM3/I Specifications

Product attributes
Attribute value
Manufacturer:
Vishay General Semiconductor - Diodes Division
Package/Case:
2-VDFN
Series:
PAR®
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
1
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
25.6V
Voltage - Breakdown (Min):
28.5V
Voltage - Clamping (Max) @ Ipp:
41.4V
Current - Peak Pulse (10/1000µs):
14.5A
Power - Peak Pulse:
600W
Power Line Protection:
No
Applications:
-
Capacitance @ Frequency:
-
Operating Temperature:
-65°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
DFN3820A

T6N30AHM3/I FAQ

1.How can I place an order for T6N30AHM3/I through Aetrix?

Please submit a Request for Quotation (RFQ) for T6N30AHM3/I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for T6N30AHM3/I reliable?

The price and inventory of T6N30AHM3/I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for T6N30AHM3/I is usually 5 days.

3.What payment methods are accepted for T6N30AHM3/I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for T6N30AHM3/I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for T6N30AHM3/I?

T6N30AHM3/I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your T6N30AHM3/I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for T6N30AHM3/I?

For technical support, including T6N30AHM3/I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your T6N30AHM3/I requirements.

6.How does Aetrix verify that T6N30AHM3/I is sourced from the original manufacturer or authorized distributors?

All T6N30AHM3/I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that T6N30AHM3/I meets industry standards.

7.What is the process for return or replacement of T6N30AHM3/I?

All T6N30AHM3/I units undergo pre-shipment inspection (PSI). If there is an issue with T6N30AHM3/I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The T6N30AHM3/I part is unused and in its original packaging.

Return procedure for T6N30AHM3/I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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