STMicroelectronics T810-600H

Overview

T810-600H from STMicroelectronics is a snubberless logic-level triac rated for 8 A RMS on-state current and 600 V repetitive peak off-state voltage (VDRM/VRRM), designed for AC phase control and switching in inductive loads. It features 10 mA maximum gate trigger current (IGT), 1.2 V maximum gate trigger voltage (VGT), and operates across –40 °C to +125 °C junction temperature. Used in motor speed controllers, light dimmers, and heating regulation circuits where high commutation robustness is required.

For engineers reviewing the T810-600H datasheet, T810-600H pinout, T810-600H application, or T810-600H equivalent, this page delivers verified electrical specs, package configuration, real-world use cases, and validated alternative triacs - all grounded in ST's DS2114 Rev 16 technical documentation.

Technical Context

This triac belongs to ST's Snubberless Logic-Level (SLL) series, optimized for 3-quadrant operation with enhanced dV/dt immunity (400 V/µs min at 125 °C) and high commutation performance under inductive load conditions. Its low IGT (≤10 mA) enables direct drive from microcontroller GPIOs without external amplification.

The device uses a robust silicon structure enabling 50 A/µs critical rate of rise of on-state current (dl/dt) and 36 A²s I²t fusing rating, supporting reliable turn-on under surge and transient conditions. Thermal resistance is specified at Rth(j–c) = 1.6 °C/W for IPAK package, ensuring efficient heat transfer to heatsinks in high-power AC switching applications.

Key Specifications

Pinout & Package

Package: IPAK (TO-251AA), surface-mount, lead-free, halogen-free epoxy, UL94 V0 compliant. Tab is electrically connected to MT2 (A2) terminal and serves as primary heat path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triac-based AC switching applications.

Compared with T810-600H, the DPAK-based T810-600B offers superior board-level integration but reduced thermal headroom, while the insulated BTA08-600SW trades compactness for certified isolation - making T810-600H optimal for high-reliability, thermally demanding inductive control without isolation overhead.

Availability

T810-600H is available at Aetrix Electronics and suitable for motor speed control, light dimming, heating regulation, and static relay replacement requiring stable component supply across industrial and consumer product lifecycles.

Supply support for T810-600H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, microcontroller, and sensor solutions for industrial, automotive, and consumer markets.

The T810-600H belongs to ST's Snubberless Logic-Level Triac product line, engineered specifically for robust, low-drive AC power control in inductive and resistive loads - emphasizing reliability, thermal efficiency, and simplified system design.

FAQ

What is the maximum junction temperature for continuous operation of T810-600H?

The T810-600H has an operating junction temperature range of –40 °C to +125 °C. Continuous operation at the upper limit requires maintaining case temperature ≤110 °C per the IT(RMS) derating curve in Figure 2 of DS2114 Rev 16, with appropriate heatsinking to hold Rth(j–c) ≤1.6 °C/W.

Can T810-600H be driven directly by a 3.3 V microcontroller GPIO?

Yes - its maximum gate trigger current is 10 mA at 1.2 V gate threshold, and typical IGT is ≤5 mA at 25 °C. A 3.3 V MCU GPIO sourcing 10–15 mA through a 220 Ω series resistor meets the requirement without additional buffering, as confirmed in Table 2 of DS2114 Rev 16.

Does T810-600H require a snubber circuit when switching inductive loads?

No - it is a Snubberless triac with guaranteed commutation performance (dl/dt)c ≥5.4 A/ms and dV/dt immunity of 400 V/µs at 125 °C. ST explicitly recommends T8-series devices for inductive loads without external snubbers, as stated in the product description and Figure 9 of DS2114 Rev 16.

What is the thermal resistance from junction to ambient (Rth(j–a)) for T810-600H in standard layout?

For the IPAK package (T810-600H), Rth(j–a) is 100 °C/W (typical) on FR4 PCB with 2 cm² copper area under the tab, per Table 5 of DS2114 Rev 16. This value assumes 35 µm copper thickness and no external heatsink; adding a heatsink reduces effective Rth(j–a) significantly.