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Toshiba Semiconductor and Storage TCK401G,LF

Part No.:
TCK401G,LF
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Gate Drivers
Package:
6-UFBGA, WLCSP
Datasheet:
AetrixTCK401G,LF.pdf
Description:
IC GATE DRVR HIGH-SIDE 6WCSPE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:61,207

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Product details

Overview

TCK401G,LF from Toshiba Electronic Devices & Storage Corporation is a 28 V high-input-voltage external N-channel MOSFET driver IC with active-high control logic, slew-rate-controlled gate drive, and reverse-current blocking capability via external back-to-back FETs. It operates from 2.7 V to 28 V input, features auto output discharge, over/under-voltage lockout, and integrates a charge pump for enhanced gate drive voltage (up to VIN + 10 V). It is designed for battery charge path selection in portable power systems.

For engineers reviewing the TCK401G,LF datasheet, TCK401G,LF pinout, TCK401G,LF application, or TCK401G,LF equivalent, key selection criteria include its WCSP6E 0.8 mm × 1.2 mm package, 0.58 ms typical VGATE turn-on time at 5 V, 19.7 µs VGATE turn-off time at 9 V, and active-high VCT control with Schmitt-trigger input tolerance beyond VIN.

Technical Context

The TCK401G,LF implements a charge-pump-based gate driver architecture that generates a boosted VGATE up to VIN + 10 V (min. 6.9 V at VIN ≥ 12 V), enabling robust enhancement-mode N-MOSFET conduction across its full 2.7–28 V input range. Its internal inrush current reduction circuit limits dV/dt during startup, while the DIS pin provides controlled output discharge when the driver is disabled.

It incorporates dual protection logic: UVLO triggers below 2.7 V and OVLO above 28 V, both disabling VGATE output. The VSRC pin interfaces directly with the common source node of external back-to-back MOSFETs to support reverse-current blocking - a critical function in bidirectional battery charging and power-path arbitration circuits.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range2.7 V to 28 V operating; 40 V absolute max - supports wide-input industrial/battery systems without external regulators
Gate Drive Voltage (VGATE)VIN + 6.5 V typ. (at VIN = 5–9 V); up to VIN + 10 V (at VIN ≥ 12 V) - ensures full enhancement of standard N-MOSFETs
VGATE Turn-On Time (tON)0.58 ms typ. at VIN = 5 V, CGATE = 2000 pF - enables controlled power-up ramp for inrush mitigation
VGATE Turn-Off Time (tOFF)19.7 µs typ. at VIN = 9 V, CGATE = 2000 pF - supports fast fault response and reverse-current blocking
Quiescent Current (ON)121 µA typ. at VIN = 5 V, VCT = High - ultra-low active-state bias for battery-powered applications
Standby Current (OFF)3.0 µA typ. at VIN = 5 V, VCT = Low - preserves battery life during system sleep modes
DIS Pin Discharge Resistance21 kΩ typ. - provides predictable RC decay for safe output discharge without external components

Pinout & Package

Package: WCSP6E (0.8 mm × 1.2 mm, 0.55 mm height, 1 mg typical weight), bottom-terminal chip-scale package optimized for space-constrained portable designs.

Pin/Terminal Circuit Role Design Meaning
A1VGATEBoosted gate-drive output; delivers VIN + VGS (up to +10 V) to external N-MOSFET gate
A2VINMain supply input; powers internal circuitry and charge pump; accepts 2.7–28 V
B1VSRCCommon-source reference terminal; connects to shared source node of back-to-back MOSFETs for reverse-current blocking
B2GNDAnalog/digital ground reference; must be low-impedance connection to system ground plane
C1DISOutput discharge control; internally pulls VOUT to GND via 21 kΩ resistor when driver is off
C2VCTActive-high mode control input; Schmitt-triggered, tolerant up to 6 V; enables/disables gate drive

Key Features

Feature Design Value
Charge pump gate driverGenerates boosted VGATE up to VIN + 10 V, eliminating need for external high-side drivers or P-MOSFETs
Slew-rate controlled turn-on0.58–1.2 ms tON (VIN = 5–12 V) - inherently limits inrush current without external RC networks
Reverse current protectionEnables bidirectional blocking using external back-to-back N-MOSFETs, reducing BOM cost vs. ideal diode controllers
Auto output dischargeInternal 21 kΩ DIS pull-down discharges output capacitance on disable, preventing floating or latch-up states
UVLO/OVLO protectionLockout thresholds at 2.7 V (UVLO) and 28 V (OVLO) - prevents operation outside safe MOSFET VGS and system voltage margins

Applications

Battery Charge Path Selector USB-C Power Delivery Arbitration

Use Scenario: Dual-input battery charger selecting between wall adapter and USB-C PD source while preventing reverse current flow into inactive sources.

IC Role / Device Role / Timing Role: External FET driver controlling back-to-back N-MOSFETs in high-side power path; enables/disables conduction based on source priority and voltage validation.

Use Value: Eliminates need for discrete ideal diode or P-MOSFET solutions; supports 28 V max input for 2-cell Li-ion fast charging; UVLO/OVLO ensures safe operation across variable adapter voltages.

Use Scenario: Portable device (e.g., tablet or power bank) dynamically switching between USB-C upstream (UFP) and downstream (DFP) roles while maintaining power-path integrity.

IC Role / Device Role / Timing Role: Gate driver for load-switching N-MOSFETs in CC logic-controlled power routing; DIS pin ensures clean VBUS discharge during role swap.

Use Value: Active-high VCT simplifies interface with USB PD controllers; WCSP6E footprint minimizes PCB area in ultra-thin devices; 3 µA standby current extends battery runtime during idle states.

Industrial Backup Power Switchover Medical Portable Equipment Power Management

Use Scenario: PLC I/O module with primary 24 V DC supply and secondary supercapacitor backup, requiring seamless switchover without voltage droop or reverse feed.

IC Role / Device Role / Timing Role: High-voltage external FET driver enabling low-RDS(on) N-MOSFETs in OR-ing configuration; VSRC pin referenced to shared source for precise reverse-current cutoff.

Use Value: 40 V absolute max rating accommodates 24 V system transients; -40°C to +85°C operating range meets industrial temperature requirements; tOFF < 22 µs ensures rapid fault isolation.

Use Scenario: Battery-powered medical monitor with dual Li-ion cells and external charging port, requiring fail-safe power-path control to prevent battery over-discharge or thermal runaway during charging faults.

IC Role / Device Role / Timing Role: Gate driver for redundant power-path MOSFETs; OVLO disables gate drive if input exceeds 28 V (e.g., faulty charger), while DIS pin discharges output to avoid residual voltage hazards.

Use Value: Integrated charge pump eliminates external boost IC; 1 mg WCSP6E package reduces mechanical stress on flex PCBs; RoHS-compliant and qualified per medical-grade reliability standards.

Equivalent & Alternatives

The following parts are listed as comparable options for similar external FET driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS22992DNYRSingle-channel load switch with integrated N-MOSFET; no external FET support; fixed 5.5 V max inputLimited to low-voltage (≤5.5 V), low-power applications; lacks reverse-current blocking and charge pumpSelect only for ≤5.5 V systems where integrated FET suffices and external MOSFET optimization is unnecessary
RTQ2132BGQW28 V input ideal diode controller with integrated gate driver and reverse-current protection; requires external N-MOSFET; no auto-discharge (DIS) pinSupports same 28 V input and back-to-back FET topology but omits DIS functionality and has higher quiescent current (12 µA OFF)Prefer when DIS is not required and higher integration (e.g., integrated current sense) is valued over ultra-low IQ

Compared with TCK401G,LF, the TPS22992DNYR lacks external FET control and high-voltage capability, limiting use to sub-6 V loads; the RTQ2132BGQW matches voltage range and reverse-blocking but trades off auto-discharge and 3 µA standby current for added monitoring features - making TCK401G,LF optimal for space- and battery-life-critical 2.7–28 V power-path selectors.

Availability

TCK401G,LF is available at Aetrix Electronics and suitable for battery charge path selection, USB-C power delivery arbitration, and industrial backup power switchover requiring stable component supply, long-lifecycle availability, and RoHS-compliant packaging.

Supply support for TCK401G,LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs high-reliability analog, power, and logic ICs for automotive, industrial, and consumer applications, with emphasis on energy efficiency and miniaturization.

The TCK401G,LF belongs to Toshiba's External FET Driver IC product line, engineered specifically for compact, high-voltage power-path control in portable and battery-powered systems requiring reverse-current blocking and ultra-low quiescent current.

FAQ

What is the function of the VSRC pin on the TCK401G,LF?

The VSRC pin on the TCK401G,LF serves as the common-source reference terminal for external back-to-back N-MOSFETs. When the driver is disabled, it helps short the gate-to-source path to ensure reliable reverse-current blocking. Connecting VSRC to the shared source node is mandatory for proper bidirectional blocking operation - omitting this connection compromises reverse-current protection functionality in the TCK401G,LF.

Does the TCK401G,LF support 24 V industrial input rails?

Yes, the TCK401G,LF supports 24 V industrial input rails within its specified 2.7 V to 28 V operating range. Its 40 V absolute maximum input rating provides margin against transients, and its UVLO (2.7 V) and OVLO (28 V) thresholds ensure safe operation across typical 24 V system variations. The TCK401G,LF is explicitly rated for −40°C to +85°C operation, meeting standard industrial temperature requirements.

How does the DIS pin function in the TCK401G,LF?

The DIS pin on the TCK401G,LF provides automatic output discharge when the driver is disabled: it activates an internal 21 kΩ pull-down resistor between VOUT and GND, ensuring rapid and controlled discharge of output capacitance. This prevents floating outputs and residual voltage hazards. Leaving DIS open is acceptable if discharge is not required, but connecting it to VOUT is necessary for applications demanding fast, deterministic shutdown behavior in the TCK401G,LF.

What is the difference between TCK401G,LF and TCK402G,LF?

The TCK401G,LF uses active-high logic on the VCT pin (high = ON, low = OFF), whereas the TCK402G,LF uses active-low logic (low = ON, high = OFF). Both share identical electrical specifications, package, pinout, and protection features. The functional difference lies solely in control polarity - TCK401G,LF simplifies interface with microcontrollers or PMICs that assert enable signals high, while TCK402G,LF suits systems with active-low enable outputs. Neither is pin-compatible with the other due to inverted logic.

Can the TCK401G,LF drive both single and dual N-MOSFET configurations?

Yes, the TCK401G,LF supports both single-N-MOSFET high-side switches and dual back-to-back N-MOSFET configurations. For single-FET use, VSRC may be left open if VGS margin is sufficient; for dual-FET reverse-blocking, VSRC must connect to the common source node. The TCK401G,LF's charge pump and slew-rate control adapt automatically - no external configuration is needed to switch between topologies, making it flexible across varied power-path architectures.

TCK401G,LF Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
6-UFBGA, WLCSP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
High-Side
Channel Type:
Single
Number of Drivers:
1
Gate Type:
-
Voltage - Supply:
2.7V ~ 28V
Logic Voltage - VIL, VIH:
0.4V, 1.6V
Current - Peak Output (Source, Sink):
-
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
0.2ms, 1.5µs
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-WCSPE (0.80x1.2)

TCK401G,LF FAQ

1.How can I place an order for TCK401G,LF through Aetrix?

Please submit a Request for Quotation (RFQ) for TCK401G,LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TCK401G,LF reliable?

The price and inventory of TCK401G,LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TCK401G,LF is usually 5 days.

3.What payment methods are accepted for TCK401G,LF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TCK401G,LF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TCK401G,LF?

TCK401G,LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TCK401G,LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TCK401G,LF?

For technical support, including TCK401G,LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TCK401G,LF requirements.

6.How does Aetrix verify that TCK401G,LF is sourced from the original manufacturer or authorized distributors?

All TCK401G,LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TCK401G,LF meets industry standards.

7.What is the process for return or replacement of TCK401G,LF?

All TCK401G,LF units undergo pre-shipment inspection (PSI). If there is an issue with TCK401G,LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TCK401G,LF part is unused and in its original packaging.

Return procedure for TCK401G,LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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