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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

Infineon Technologies TDA21460

Name: TDA21460
Brand: Infineon Technologies
SKU: TDA21460
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TDA21460

Manufacturer:: Infineon Technologies

Category:: Power Management - Specialized

Package:: -

Datasheet:: TDA21460.pdf

Description:: IC CONTROLLER

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Product details

Overview

TDA21460 from Infineon Technologies is a 25 V integrated power stage (IPS) designed for high-efficiency CPU/GPU core and DDR memory VR applications in servers and datacom systems. It delivers up to 60 A continuous output current, operates from 4.25 V to 16 V input, supports 0.25–5.5 V output, switches up to 1.5 MHz, and achieves >95% peak efficiency with dual-edge-trim dead time control.

For engineers reviewing the TDA21460 datasheet, TDA21460 pinout, TDA21460 application, or TDA21460 equivalent, key selection criteria include its Kelvin-sense-enabled R_DS(on) current reporting accuracy, programmable OCSET threshold, UVLO behavior, deep-sleep IQ (<200 µA), and PQFN 5×6 mm package compatibility with multi-phase VR controllers.

Technical Context

The TDA21460 integrates high- and low-side MOSFETs with a gate driver, current sensing via dedicated Kelvin GND, and cycle-by-cycle overcurrent protection. Its internal temperature-compensated R_DS(on) sensing eliminates need for external DCR networks while maintaining ±3% current reporting accuracy across load and temperature.

It features programmable constant-current limit (OCSET), UVLO with hysteresis, and PS4 deep-sleep mode enabling <200 µA quiescent current. Optimized for 5 V gate drive, it supports high-frequency operation up to 1.5 MHz without sacrificing thermal performance in the 5×6×0.9 mm³ PQFN package.

Key Specifications

Parameter	Value and Actual Design Meaning
Max Output Current	60 A continuous - supports single-phase CPU core rail in dual- or triple-phase server VR designs
Input Voltage Range	4.25 V to 16 V - compatible with 5 V, 12 V intermediate bus architectures
Output Voltage Range	0.25 V to 5.5 V - covers CPU core (0.8–1.3 V), GPU (0.9–1.2 V), and DDR4/5 (1.1–1.8 V) rails
Switching Frequency	Up to 1.5 MHz - enables smaller output inductors and faster transient response in compact VRMs
Peak Efficiency	>95% at 500 kHz, 12 V_IN, 1.82 V_OUT - includes driver, FET, and inductor losses per five-phase measurement
I_Q (PS4 Mode)	<200 µA - enables ultra-low-power standby during system idle without disabling VR controller
R_DS(on) Sensing	Kelvin GND-connected, temperature-compensated - achieves ±3% current reporting accuracy vs. ±8–10% with DCR sensing

Pinout & Package

Package: PQFN 5×6 mm², 0.45 mm pitch, 0.9 mm height, thermally enhanced overmolded construction with exposed thermal pad (EP).

Pin/Terminal	Circuit Role	Design Meaning
V_IN	High-side MOSFET drain supply	Primary input power connection; requires local 10–22 µF ceramic bulk capacitance
V_OUT	Power stage output node	Connects directly to output inductor; forms switching node with V_IN and PGND
PGND	Power ground return	Low-inductance return path for high-side and low-side FETs; separate from AGND
AGND	Analog ground reference	Reference for current sense amplifier and OCSET comparator; must be star-connected to Kelvin GND
KGND	Kelvin sense ground	Dedicated low-noise ground for R_DS(on) current sensing; routed separately from PGND to avoid IR drop error
OCSET	Overcurrent threshold programming	Resistor-programmable current limit; sets cycle-by-cycle trip point independent of temperature drift
EN	Enable control input	Active-high logic input; pulls down to disable stage and enter PS4 deep-sleep mode
EP	Exposed thermal pad	Thermal interface to PCB copper; must be soldered to ≥4 cm² internal ground plane for ≤35 °C/W θ_JA

Key Features

Feature	Design Value
Dual-edge-trim dead time	Reduces shoot-through loss and improves peak efficiency by dynamically optimizing high-/low-side overlap timing
Kelvin GND current sensing	Enables ±3% current reporting accuracy without DCR network, reducing BOM count and layout sensitivity
Programmable OCSET	Allows precise setting of overcurrent threshold (e.g., 65 A ±5%) without requiring controller-level scaling
PS4 deep-sleep mode	Reduces total stage IQ to <200 µA while retaining fast wake-up capability for dynamic phase shedding
UVLO with hysteresis	Ensures clean startup at 4.25 V with 150 mV hysteresis, preventing oscillation near brown-out thresholds

Applications

CPU Core Power Delivery

GPU Core Power Delivery

Use Scenario: Dual- or triple-phase VR for Intel Xeon Scalable or AMD EPYC processors in 1U/2U rack servers.

IC Role / Device Role / Timing Role: Integrated power stage providing high-current, high-efficiency buck conversion with accurate current telemetry to VR controller.

Use Value: Enables tight voltage regulation (±3 mV) and fast transient response (<5 µs) under 100 A/µs load steps while maintaining >94% efficiency at 40 A.

Use Scenario: Single-phase or two-phase VR for NVIDIA A100 or AMD Instinct MI250X GPU cores in AI training servers.

IC Role / Device Role / Timing Role: High-bandwidth power stage delivering stable 0.9–1.2 V at up to 60 A with cycle-by-cycle OCP for fault containment.

Use Value: Supports 1.2 MHz switching to shrink inductor size by 35% versus 500 kHz designs, reducing VR footprint by 28%.

DDR5 Memory Subsystem

Telecom Baseband Processor Rail

Use Scenario: Dedicated 1.1 V or 1.8 V VR for DDR5 LRDIMM channel power in cloud storage controllers.

IC Role / Device Role / Timing Role: Low-noise, high-accuracy power stage supplying tightly regulated voltage with real-time current monitoring for thermal derating.

Use Value: Kelvin-sense accuracy enables dynamic current-based throttling, improving memory reliability under sustained 40 A loads.

Use Scenario: 1.0 V core rail for 5G baseband SoCs (e.g., Xilinx Versal or Qualcomm QDM5670) in macrocell radio units.

IC Role / Device Role / Timing Role: High-efficiency, low-IQ power stage supporting burst-mode operation and rapid sleep/wake transitions.

Use Value: PS4 mode reduces standby power by 92% versus standard disable, extending uptime in energy-constrained outdoor enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated power stage applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TDA21470	70 A rated, identical pinout and feature set; higher R_DS(on) on low-side FET increases conduction loss above 50 A	Preferred for single-phase 65–70 A CPU core rails where peak current exceeds TDA21460 rating	Select when full 70 A capability is required and board layout allows same 5×6 mm footprint
IR35411	60 A rated, same 5×6 mm PQFN but uses DCR current sensing; no Kelvin GND or OCSET pin	Suitable for cost-sensitive telecom VRs where ±8% current accuracy is acceptable and controller handles OCP	Choose only if existing design uses DCR sensing and no upgrade to R_DS(on) sensing is planned

Compared with TDA21470 and IR35411, the TDA21460 uniquely balances 60 A capability with Kelvin-sense accuracy and programmable OCP-making it optimal for next-gen server VRs requiring both precision telemetry and robust fault management in minimal area.

Availability

TDA21460 is available at Aetrix Electronics and suitable for server motherboard development, telecom baseband power design, and DDR5 memory subsystem integration requiring stable component supply and long-term lifecycle support.

Supply support for TDA21460 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D centers and wafer fabs in Austria, Germany, and Malaysia.

The TDA21460 belongs to Infineon's integrated power stage (IPS) portfolio, engineered specifically for high-density, high-efficiency multiphase VR solutions in datacenter and communications infrastructure.

FAQ

What is the recommended PCB layout practice for KGND and PGND separation?

KGND must be routed as a dedicated low-impedance trace directly to the Kelvin sense point at the source of the low-side MOSFET, isolated from PGND by ≥2 mm clearance. A separate AGND plane connects KGND to the OCSET and current sense amplifier inputs. PGND pours should not overlap KGND traces on adjacent layers.

Does TDA21460 support parallel operation for higher current?

Yes - TDA21460 supports current-sharing in paralleled configurations using its accurate R_DS(on) current reporting. Matching OCSET resistors and synchronized gate drive signals are required; typical current imbalance is <3% between two stages under 60 A total load.

What is the thermal resistance (θ_JA) under standard JEDEC 2S2P test conditions?

θ_JA is 35 °C/W when mounted on a 4-layer PCB with 4 cm² internal copper pour connected to the EP pad. With 2 oz. copper and 6 thermal vias (0.3 mm diameter) under EP, θ_JA improves to 28 °C/W in typical server VR layouts.

Can TDA21460 be used with non-5 V gate drive controllers?

No - TDA21460 is optimized for 5 V gate drive and lacks level-shifting circuitry. Using 3.3 V drive results in incomplete high-side FET turn-on and >15% efficiency loss. Controller outputs must be 5 V logic-compatible with ≥10 mA sink/source capability.

TDA21460 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Obsolete

Applications:: -

Current - Supply:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

TDA21460 FAQ

1.How can I place an order for TDA21460 through Aetrix?

Please submit a Request for Quotation (RFQ) for TDA21460 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TDA21460 reliable?

The price and inventory of TDA21460 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21460 is usually 5 days.

3.What payment methods are accepted for TDA21460?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21460 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TDA21460?

TDA21460 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TDA21460 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TDA21460?

For technical support, including TDA21460 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21460 requirements.

6.How does Aetrix verify that TDA21460 is sourced from the original manufacturer or authorized distributors?

All TDA21460 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21460 meets industry standards.

7.What is the process for return or replacement of TDA21460?

All TDA21460 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21460, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TDA21460 part is unused and in its original packaging.

Return procedure for TDA21460:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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