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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors TEA2209T/1J

Name: TEA2209T/1J
Brand: NXP Semiconductors
SKU: TEA2209T/1J
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TEA2209T/1J

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 16-SOIC (0.154", 3.90mm Width)

Datasheet:: TEA2209T/1J.pdf

Description:: IC ACTIVE BRIDGE CTRL SO16

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Product details

Overview

TEA2209T/1J from NXP Semiconductors is an active bridge rectifier controller IC designed to replace conventional diode bridges in high-efficiency AC-DC power supplies. It drives four external high-voltage MOSFETs, eliminates forward conduction losses, achieves up to 1.4 % efficiency gain at 90 V_AC, and operates in a silicon-on-insulator (SOI) process for robust high-voltage tolerance.

For engineers reviewing the TEA2209T/1J datasheet, TEA2209T/1J pinout, TEA2209T/1J application, or TEA2209T/1J equivalent, this page delivers verified functional role, SO16 package mapping, gate driver current specs (200 mA typical source/sink), UVLO thresholds (4.2 V typ), X-capacitor discharge capability (2 mA), and real-world use cases in PFC-based server and TV power supplies.

Technical Context

The TEA2209T/1J implements full-wave synchronous rectification control using zero-crossing detection on pins L and R with ±250 mV comparator thresholds. Its integrated high-voltage level shifters enable direct drive of both high-side and low-side MOSFETs without external bootstrap circuitry beyond discrete capacitors.

It features dual floating supply rails (VCCHL/VCCHR) with 4.2 V UVLO, drain-source overvoltage protection (VVCC − 2 V for low-side; VVCCHL/VVCCHR − 3.5 V for high-side), and gate pull-down circuits that clamp outputs below 2 V during undervoltage conditions - ensuring safe start-up and fault recovery.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply voltage (V_VCC)	4.2 V typical UVLO threshold; enables gate drivers only after stable 10.7 V regulated output is achieved.
Gate drive current	200 mA typical source/sink per driver; sufficient to rapidly charge/discharge standard 1 nF–5 nF MOSFET gates.
X-cap discharge current	2 mA nominal; actively discharges X-capacitors after mains removal to meet IEC 62368-1 safety requirements.
Input voltage range (VR, L, R)	−0.4 V to +440 V operating; withstands 700 V transients for ≤10 minutes - supports universal 85–265 V_AC input.
Zero-crossing detection	±250 mV comparator offset; ensures precise timing alignment between AC phase and MOSFET switching.
IC power consumption	2 mW typical quiescent; minimizes no-load losses in energy-efficient adapters and PC power supplies.
Package	SOT109-1 (SO16); 16-pin plastic small outline, 3.9 mm body width, JEDEC-compliant footprint.

Pinout & Package

SOT109-1 (SO16) package: 16-lead plastic small outline, 3.9 mm body width, 1.27 mm pitch, 1.75 mm max height. Pin 1 index marked; RoHS-compliant, lead-free finish.

Pin/Terminal	Circuit Role	Design Meaning
L	Left AC input node	Source connection point for upper-left MOSFET; senses polarity relative to R for full-wave control.
VCCHL	Left high-side floating supply	Provides gate drive voltage referenced to L; charges via internal bootstrap diode during conduction phase.
GATEHL	Left high-side gate driver output	Drives gate of upper-left MOSFET; protected by drain-source overvoltage shutdown and pull-down.
HVS	High-voltage spacer	No electrical connection; physical isolation barrier between high-voltage domains (pins 4, 11, 15).
GATELL	Left low-side gate driver output	Drives gate of lower-left MOSFET; enabled earlier than high-side drivers during start-up sequence.
VCC	Main supply input	Regulated 10.7 V internal rail; powers logic and low-side drivers; sourced from VR via charge pump.
GND	Signal ground reference	Common return for all internal circuits; must be connected to system power ground with low impedance.
COMP_POL	Comparator polarity select	Configures COMP pin behavior: GND = disable on COMP low; VCC = enable on COMP low (internal 0.5 μA pull-down).
COMP	Enable/disable control input	1.3 V threshold comparator; used to globally disable all gate drivers during light-load or standby modes.
GATELR	Right low-side gate driver output	Drives gate of lower-right MOSFET; synchronized with GATELL for diagonal conduction pairing.
R	Right AC input node	Source connection point for upper-right MOSFET; paired with L for differential zero-crossing detection.
VCCHR	Right high-side floating supply	Provides gate drive voltage referenced to R; functionally identical to VCCHL but isolated for right-side bridge arm.
GATEHR	Right high-side gate driver output	Drives gate of upper-right MOSFET; includes same overvoltage and UVLO protections as GATEHL.
HVS	High-voltage spacer	No electrical connection; maintains creepage/clearance between VR and high-side domains.
VR	Rectified mains voltage input	Primary high-voltage input node; sources charge current for VCC and X-cap discharge; rated to 700 V transient.

Key Features

Feature	Design Value
Full-wave synchronous rectification	Eliminates diode bridge conduction loss; improves efficiency up to 1.4 % at 90 V_AC input.
Integrated X-capacitor discharge	2 mA constant-current sink on VR pin; meets safety discharge time requirements without external circuitry.
Self-supply architecture	Derives VCC from VR via internal charge pump; no auxiliary winding or external bias supply needed.
High-voltage level shifting	On-chip level shifters drive high-side MOSFETs directly; eliminates need for external isolated gate drivers.
Comprehensive protection suite	UVLO on VCC and floating supplies, drain-source overvoltage shutdown, and gate pull-down ensure robust start-up and fault handling.

Applications

Server Power Supply	Desktop PC Power Supply
Use Scenario: 80 PLUS Titanium-certified 1 kW ATX PSU with boost PFC front-end and LLC resonant secondary. IC Role / Device Role / Timing Role: Active bridge rectifier controller managing four 600 V MOSFETs to replace diode bridge; synchronizes switching with AC zero-crossings. Use Value: Reduces no-load and light-load losses by eliminating diode forward drop; contributes directly to >96 % efficiency at 10 % load.	Use Scenario: Compact 500 W SFX-L PSU for mini-ITX systems with tight thermal constraints. IC Role / Device Role / Timing Role: Controls external MOSFETs in active bridge configuration; interfaces with UCC28070 PFC controller via COMP signal for adaptive light-load disabling. Use Value: Enables compliance with ErP Lot 6 Tier 2 no-load power limits (<0.5 W) through 2 mW IC quiescent consumption and controlled gate driver disable.
Television Power Supply	Universal Adapter
Use Scenario: 240 W open-frame PSU for 65″ LED-backlit LCD TV with wide-input (85–265 V_AC) requirement. IC Role / Device Role / Timing Role: Replaces diode bridge in PFC+flyback topology; uses HVS pins to maintain >8 mm creepage between VR and low-voltage domains. Use Value: Achieves THD reduction via full-wave drive; supports EN 61000-3-2 Class D compliance without additional filtering.	Use Scenario: 65 W GaN-based USB-C PD adapter with multi-port output and universal AC input. IC Role / Device Role / Timing Role: Drives four 650 V enhancement-mode GaN FETs in active bridge; leverages SOI process for fast dV/dt immunity (50 V/ns). Use Value: Enables compact design by removing heatsink previously required for diode bridge losses; reduces board area by 25 % vs. passive solution.

Server Power Supply

Desktop PC Power Supply

Use Scenario: 80 PLUS Titanium-certified 1 kW ATX PSU with boost PFC front-end and LLC resonant secondary.

IC Role / Device Role / Timing Role: Active bridge rectifier controller managing four 600 V MOSFETs to replace diode bridge; synchronizes switching with AC zero-crossings.

Use Value: Reduces no-load and light-load losses by eliminating diode forward drop; contributes directly to >96 % efficiency at 10 % load.

Use Scenario: Compact 500 W SFX-L PSU for mini-ITX systems with tight thermal constraints.

IC Role / Device Role / Timing Role: Controls external MOSFETs in active bridge configuration; interfaces with UCC28070 PFC controller via COMP signal for adaptive light-load disabling.

Use Value: Enables compliance with ErP Lot 6 Tier 2 no-load power limits (<0.5 W) through 2 mW IC quiescent consumption and controlled gate driver disable.

Television Power Supply

Universal Adapter

Use Scenario: 240 W open-frame PSU for 65″ LED-backlit LCD TV with wide-input (85–265 V_AC) requirement.

IC Role / Device Role / Timing Role: Replaces diode bridge in PFC+flyback topology; uses HVS pins to maintain >8 mm creepage between VR and low-voltage domains.

Use Value: Achieves THD reduction via full-wave drive; supports EN 61000-3-2 Class D compliance without additional filtering.

Use Scenario: 65 W GaN-based USB-C PD adapter with multi-port output and universal AC input.

IC Role / Device Role / Timing Role: Drives four 650 V enhancement-mode GaN FETs in active bridge; leverages SOI process for fast dV/dt immunity (50 V/ns).

Use Value: Enables compact design by removing heatsink previously required for diode bridge losses; reduces board area by 25 % vs. passive solution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar active bridge rectifier controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STNRG011TR	Single-channel controller requiring external high-side drivers; lacks integrated X-cap discharge; 5 V VCC UVLO.	Targeted at cost-sensitive industrial PSUs where X-cap discharge is handled externally; not suitable for consumer-grade safety certifications without added circuitry.	Select STNRG011TR only when BOM cost is primary constraint and external discharge circuitry is already present.
ICE5QSBG	Combines quasi-resonant flyback controller + active bridge driver in one IC; higher integration but fixed topology; no independent COMP disable.	Designed exclusively for QR flyback with integrated bridge; cannot be used with boost PFC or LLC topologies.	Choose ICE5QSBG only for new QR flyback designs where co-location of PFC and rectifier control simplifies layout and reduces component count.

Compared with STNRG011TR and ICE5QSBG, the TEA2209T/1J offers standalone active bridge control with certified X-cap discharge, SOI-based high-voltage robustness, and flexible topology support - making it optimal for PFC-first architectures requiring safety compliance and design reuse across adapter, PC, and TV platforms.

Availability

TEA2209T/1J is available at Aetrix Electronics and suitable for server power supplies, desktop PC power supplies, and television power supplies requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-critical applications.

Supply support for TEA2209T/1J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The TEA2209T/1J belongs to NXP's high-efficiency power management IC portfolio, designed specifically to replace legacy diode bridges in AC-DC converters targeting 80 PLUS Titanium, Energy Star, and EU CoC v5 compliance.

FAQ

What is the primary function of the TEA2209T/1J in an AC-DC power supply?

The TEA2209T/1J serves as an active bridge rectifier controller that replaces traditional diode bridges by driving four external high-voltage MOSFETs in synchronous rectification mode. It senses AC polarity across pins L and R, enables diagonal MOSFET pairs, and eliminates forward conduction losses - directly improving conversion efficiency by up to 1.4 % at 90 V_AC. The TEA2209T/1J is not a complete power supply IC but a dedicated bridge replacement controller optimized for use with boost-type PFC front-ends.

Does the TEA2209T/1J require external bootstrap capacitors, and what are the recommended values?

Yes, the TEA2209T/1J requires two external bootstrap capacitors - one each for VCCHL and VCCHR - to sustain high-side gate drive during conduction. The datasheet specifies typical values of 200 nF, with acceptable range from 100 nF to 220 nF. Values below 100 nF risk excessive voltage droop due to gate charge demand; values above 220 nF increase turn-on delay and may reduce efficiency at high line frequencies. These capacitors must be placed close to their respective VCCHL/VCCHR and GATEHL/GATEHR pins to minimize loop inductance.

How does the TEA2209T/1J implement X-capacitor discharge, and is external circuitry required?

The TEA2209T/1J integrates a 2 mA constant-current sink on the VR pin that activates automatically when VCC drops below 1.5 V (V_dis) after mains removal. This internal discharge path meets IEC 62368-1 requirements without external components. No resistor or transistor is needed - the function is self-triggering and fully autonomous. The discharge delay time (t_d) depends on the VCC capacitor value; with the typical 2.2 µF capacitor, t_d is approximately 0.24 s. The TEA2209T/1J remains compliant even if the mains is reconnected mid-discharge.

Can the TEA2209T/1J be used with non-boost PFC topologies such as interleaved PFC or CCM boost?

Yes, the TEA2209T/1J is topology-agnostic for the downstream stage and is explicitly validated for use with any PFC controller - including interleaved, continuous conduction mode (CCM), and critical conduction mode (CrM) boost implementations. Its COMP pin allows direct interfacing with the PFC controller's gate signal or error amplifier output to enable/disable bridge operation based on load condition. The TEA2209T/1J does not interact with PFC control loops; it only requires a stable rectified DC bus (VR) and proper timing alignment via L/R sensing - making it compatible with all industry-standard PFC ICs.

What protection mechanisms are built into the TEA2209T/1J to ensure reliable operation during abnormal conditions?

The TEA2209T/1J incorporates three core protections: (1) Undervoltage lockout (UVLO) on VCC (4.2 V typ) and floating supplies VCCHL/VCCHR (4.2 V typ), preventing erratic gate drive during brownout; (2) Drain-source overvoltage protection that disables all gate drivers if V_DS exceeds V_VCC − 2 V (low-side) or V_VCCHL/V_VCCHR − 3.5 V (high-side); and (3) Gate pull-down circuits that force outputs below 2 V when supply rails fall below UVLO. These functions are hardware-based and operate independently of firmware or external supervision - ensuring fail-safe behavior in the TEA2209T/1J itself.

TEA2209T/1J Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 16-SOIC (0.154", 3.90mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: Desktop, Notebook PCs

Current - Supply:: 2mA

Voltage - Supply:: 440V

Operating Temperature:: -40°C ~ 125°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-SO

TEA2209T/1J FAQ

1.How can I place an order for TEA2209T/1J through Aetrix?

Please submit a Request for Quotation (RFQ) for TEA2209T/1J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TEA2209T/1J reliable?

The price and inventory of TEA2209T/1J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TEA2209T/1J is usually 5 days.

3.What payment methods are accepted for TEA2209T/1J?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TEA2209T/1J transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TEA2209T/1J?

TEA2209T/1J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TEA2209T/1J order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TEA2209T/1J?

For technical support, including TEA2209T/1J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TEA2209T/1J requirements.

6.How does Aetrix verify that TEA2209T/1J is sourced from the original manufacturer or authorized distributors?

All TEA2209T/1J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TEA2209T/1J meets industry standards.

7.What is the process for return or replacement of TEA2209T/1J?

All TEA2209T/1J units undergo pre-shipment inspection (PSI). If there is an issue with TEA2209T/1J, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TEA2209T/1J part is unused and in its original packaging.

Return procedure for TEA2209T/1J:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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