Infineon Technologies TLE94713ESV33XUMA1

Overview

TLE94713ESV33XUMA1 from Infineon is a monolithic System Basis Chip (SBC) integrating a 3.3 V/500 mA buck DC/DC regulator, 5 V/100 mA LDO, HS-CAN FD transceiver (up to 5 Mbit/s), cyclic wake/sense capability, and configurable HV GPIO - all in a PG-TSDSO-24-1 EP package. It serves as main power supply and CAN interface for automotive ECUs such as HVAC controllers, light control units, and wiper modules.

For engineers reviewing the TLE94713ESV33XUMA1 datasheet, TLE94713ESV33XUMA1 pinout, TLE94713ESV33XUMA1 application, or TLE94713ESV33XUMA1 equivalent, key selection criteria include CAN FD partial networking support, dual-regulator output stability under battery voltage transients, low quiescent current in Stop/Sleep mode (<30 µA), and AEC-Q100 Grade 1 qualification for under-hood environments.

Technical Context

The device implements a state-machine-driven SBC architecture with five operational modes (Normal, Stop, Sleep, Restart, Fail-Safe), each supporting configurable cyclic wake and sense functions via internal timer. Wake sources include CAN message reception, bi-level HV wake input, and periodic timer events - all monitored independently of MCU activity.

Its CAN transceiver complies fully with ISO 11898-2:2016 and SAE J2284, enabling CAN FD communication up to 5 Mbit/s while maintaining backward compatibility in FD-tolerant mode. The integrated spread spectrum modulation on both buck regulator and charge pump reduces peak EMI emissions by >10 dBµV over narrowband switching noise.

Key Specifications

Pinout & Package

Package: PG-TSDSO-24-1 with exposed thermal pad (EP), 150 mil body width, RoHS-compliant lead finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Compared with TLE94713ESV33XUMA1, the TLE9471-2ES V33 omits selective wake logic and associated diagnostics, while the TLE9263-2QX lacks both cyclic sensing and spread spectrum modulation - making the TLE94713ESV33XUMA1 uniquely suited for next-gen low-power, EMC-sensitive CAN FD nodes requiring autonomous wake capability.

Availability

TLE94713ESV33XUMA1 is available at Aetrix Electronics and suitable for HVAC ECUs, light control units, wiper modules, and seat belt pretensioner systems requiring stable component supply across automotive production lifecycles.

Supply support for TLE94713ESV33XUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

This part belongs to the TLE94xx Lite CAN SBC product line, designed specifically for cost-optimized, scalable automotive body electronics requiring integrated power, communication, and supervision in a single chip.

FAQ

What is the maximum CAN FD data rate supported by TLE94713ESV33XUMA1?

The device supports HS-CAN FD communication up to 5 Mbit/s, compliant with ISO 11898-2:2016 and SAE J2284. It operates in CAN FD tolerant mode for seamless interoperability with legacy CAN 2.0B nodes on the same bus, and includes clock and data recovery circuitry optimized for high-speed bit timing accuracy.

How does the cyclic wake feature reduce system power consumption?

Cyclic wake allows the SBC to autonomously exit Stop or Sleep mode at programmable intervals (e.g., every 100 ms) without CAN bus activity or external trigger. This enables periodic sensor sampling or self-diagnostic checks while maintaining average current below 30 µA - eliminating the need for always-on MCU supervision in battery-powered modules.

Can the 5 V LDO supply external sensors with reverse polarity protection?

Yes. The VIO pin delivers a regulated 5 V ±3% at up to 100 mA and includes integrated reverse-polarity protection, overcurrent limiting, and thermal shutdown. It is explicitly designed for off-board sensor biasing - such as NTC thermistors or Hall-effect position sensors - without requiring external protection components.

Is the PG-TSDSO-24-1 package compatible with standard reflow profiles?

Yes. The PG-TSDSO-24-1 package with exposed pad uses standard SnAgCu (SAC305) solder paste and conforms to IPC/JEDEC J-STD-020D moisture sensitivity level 3. Recommended peak reflow temperature is 260 °C for ≤30 seconds, with thermal pad solder coverage ≥90% to ensure reliable heat dissipation in automotive under-hood environments.