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Infineon Technologies TLE98322QXXUMA1

Part No.:
TLE98322QXXUMA1
Manufacturer:
Infineon Technologies
Category:
Application Specific Microcontrollers
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixTLE98322QXXUMA1.pdf
Description:
IC MOTOR DRIVER 48VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,403

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Product details

Overview

TLE98322QXXUMA1 from Infineon Technologies is an automotive-qualified 8-bit microcontroller integrating LIN transceiver, dual high-side and dual low-side power switches, 32 kB Flash + 4 kB emulated EEPROM, XC800 core (40 MHz), and on-chip 1.5 V/5.0 V regulators. It serves as a system-on-chip for body electronics control in 12 V vehicle networks, delivering integrated power switching, LIN communication, and sensor/actuator interfacing in a single QFN-48 package.

For engineers reviewing the TLE98322QXXUMA1 datasheet, TLE98322QXXUMA1 pinout, TLE98322QXXUMA1 application, or TLE98322QXXUMA1 equivalent, this device is selected for cost-sensitive, space-constrained automotive modules requiring functional safety support (fail-safe clock monitoring), embedded PWM generation, and direct drive of resistive/inductive loads without external drivers.

Technical Context

The TLE98322QXXUMA1 implements a dual-voltage architecture: a 1.5 V core supply (VDDC) powers the XC800 CPU and digital logic, while a dedicated 5.0 V I/O supply (VDDP) drives GPIOs, LIN transceiver, and switch drivers. Its integrated PMU includes loss-of-clock detection with automatic fail-safe shutdown of high-side switches to prevent uncontrolled actuation.

Functional integration centers on real-time control: the CCU6 unit generates complementary PWM signals with dead-time insertion for motor control; two independent ADCs (8-bit and 10-bit) monitor battery voltage (VBAT_SENSE), temperature, and analog sensors; and the LIN transceiver supports protocol versions 1.3, 2.0, and 2.1 with built-in wake-up and sleep modes compliant with ISO 17987-4.

Key Specifications

Parameter Value and Actual Design Meaning
Core XC800 8-bit CPU, compatible with 8051 instruction set, executes at up to 40 MHz (2 clocks/machine cycle)
Memory 32 kB Flash program memory + 4 kB emulated EEPROM; 256 B RAM + 3 kB XRAM; 512 B OTP and 512 B 100TP memory
LIN Interface Integrated LIN 1.3/2.0/2.1 transceiver with bus wake-up, sleep mode, and fault protection - eliminates external transceiver IC
Power Switches 2× high-side switches (RDS(on) = 350 mΩ typ. @ 25°C) and 2× low-side switches (RDS(on) = 180 mΩ typ.) with overcurrent, overtemperature, and open-load diagnostics
ADC System Dual converters: 8-bit ADC (10 ch, 10 µs conversion) + 10-bit ADC (8 ch, 12 µs conversion); includes VBAT_SENSE attenuator and internal temperature sensor
Timers & PWM Five 16-bit timers (T0–T3, T21); CCU6 unit with 2x 16-bit PWM channels, dead-time control, and emergency stop capability
Package QFN-48 (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad - optimized for automotive PCB thermal management

Pinout & Package

Package: QFN-48 (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad (EPAD) connected to GND for enhanced thermal dissipation in automotive under-hood environments.

Pin/Terminal Circuit Role Design Meaning
VDDP I/O and peripheral supply 5.0 V regulated supply input for GPIOs, LIN transceiver, and switch drivers; requires local 100 nF decoupling
VDDC Core logic supply 1.5 V regulated supply for XC800 CPU and digital logic; sourced internally from VDDP via on-chip regulator
XTAL1 / XTAL2 Crystal oscillator inputs Supports 1–20 MHz external crystal; enables precise timing for LIN baud rate generation and system clock stability
HS1 / HS2 High-side switch outputs Direct drive outputs capable of sinking up to 600 mA each; include current sense, open-load, and short-circuit diagnostics
LS1 / LS2 Low-side switch outputs Ground-switched outputs with clamping diodes; support PWM dimming and relay driving with integrated overtemperature shutdown
LIN LIN bus interface Single-wire bidirectional LIN physical layer I/O; integrates level-shifting, slew-rate control, and ESD protection per ISO 17987-4
ADCGND Analog ground reference Dedicated analog ground pin isolated from digital GND to minimize noise coupling into 8-/10-bit ADC measurements
EPAD Thermal and electrical ground Exposed pad beneath package must be soldered to PCB GND plane for thermal conduction and EMI reduction

Key Features

Feature Design Value
Fail-safe clock monitoring Loss-of-clock detection triggers immediate disable of high-side switches and entry into safe state - prevents unintended actuator activation
Integrated LIN transceiver Eliminates need for external LIN PHY; supports auto-baud wake-up, sleep current < 10 µA, and bus fault recovery without MCU intervention
Diagnosable power switches Each HS/LS output reports overcurrent, overtemperature, open-load, and short-to-battery/ground faults via dedicated status registers accessible by firmware
BootROM with LIN BSL On-chip BootROM enables field firmware updates over LIN bus without external programmer - supports secure reprogramming in vehicle assembly or service
Dual ADC subsystem Independent 8-bit and 10-bit ADCs allow concurrent battery monitoring (VBAT_SENSE) and precision sensor acquisition (e.g., cabin temperature, pedal position)

Applications

Body Control Module (BCM) Seat Position Control

Use Scenario: Centralized control of door locks, window lifts, interior lighting, and mirror adjustment in modern passenger vehicles.

IC Role / Device Role / Timing Role: Primary controller executing LIN slave node firmware, managing GPIO-driven actuators, and polling LIN master commands at 19.2 kbps.

Use Value: Reduces BOM count by integrating LIN PHY, power switches, and ADCs - enabling single-chip implementation of multi-function BCM nodes.

Use Scenario: Motorized adjustment of driver/passenger seat fore-aft, recline, and lumbar support using DC motors and potentiometer feedback.

IC Role / Device Role / Timing Role: Real-time PWM generator (via CCU6) with current-sense feedback loop; monitors potentiometer voltage (10-bit ADC) and motor supply (8-bit VBAT_SENSE).

Use Value: Enables closed-loop seat positioning with diagnostic coverage (open-load, overcurrent) and failsafe shutdown on fault detection.

Roof Module (Sunroof/Window) Engine Bay Fan Control

Use Scenario: Bidirectional control of sunroof glass and shade motors, including obstacle detection and soft-stop functionality.

IC Role / Device Role / Timing Role: Dual H-bridge driver (using HS/LS pairs) with PWM-controlled direction and speed; uses ADC to read current-sense resistor and hall sensor feedback.

Use Value: Integrated current sensing and thermal shutdown eliminate external sense amplifiers and protect against motor stall conditions.

Use Scenario: Speed-regulated control of engine cooling fans based on coolant temperature and vehicle speed signals.

IC Role / Device Role / Timing Role: LIN slave node receiving PWM duty cycle commands from ECU; drives fan via high-side switch with duty-cycle-modulated output.

Use Value: Direct 12 V fan drive capability with diagnostics reduces external FETs and discrete protection components - improves system reliability and layout density.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller-with-integrated-power-switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
TLE98332QXXUMA1 Same footprint and pinout; adds third high-side switch and enhanced watchdog (WDT2) with windowed refresh Required for 3-output load control (e.g., dual-fan + radiator valve); supports ASIL-B decomposition via dual watchdogs Select when additional switch channel or higher functional safety assurance is needed beyond TLE98322's ASIL-A capability
MC9S08DZ60 8-bit S08 core (20 MHz max); no integrated power switches or LIN transceiver - requires external drivers and PHY Suitable only with full external power stage and LIN interface; lacks on-chip diagnostics and fail-safe features Choose only if legacy S08 toolchain compatibility outweighs integration benefits and BOM cost increase from external components

Compared with TLE98322QXXUMA1, TLE98332QXXUMA1 extends integration and safety capability within identical packaging, while MC9S08DZ60 represents a less integrated, higher-component-count alternative requiring external power and communication interfaces - increasing design complexity and board area.

Availability

TLE98322QXXUMA1 is available at Aetrix Electronics and suitable for automotive body electronics, seat control modules, roof systems, and engine bay fan applications requiring stable component supply across extended temperature ranges (−40°C to +125°C) and AEC-Q100 Grade 1 qualification.

Supply support for TLE98322QXXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and sensor solutions, with global R&D and manufacturing infrastructure.

The TLE98322QXXUMA1 belongs to Infineon's TLE983x family of automotive LIN-system basis chips (SBCs), designed specifically for cost-optimized, single-chip control of resistive and inductive loads in 12 V vehicle networks.

FAQ

What is the maximum operating junction temperature for TLE98322QXXUMA1?

The TLE98322QXXUMA1 is rated for a maximum junction temperature of +150°C, validated per AEC-Q100 Grade 1 requirements (−40°C to +125°C ambient). Thermal derating begins above 125°C ambient, and internal overtemperature protection disables high-side switches at TJ ≥ 160°C to prevent permanent damage.

Does TLE98322QXXUMA1 support LIN bootloader updates without external hardware?

Yes - the device includes a factory-programmed BootROM implementing LIN Bootstrap Loader (LIN BSL) compliant with LIN 2.1. Firmware updates can be performed over the LIN bus using standard UDS services (0x34/0x36/0x37), requiring only a LIN-capable host ECU or diagnostic tool - no JTAG or DAP programmer needed.

How are the high-side and low-side switches protected against short circuits?

Each high-side and low-side switch incorporates independent overcurrent detection with fast response (< 2 µs), automatic shutdown, and latched fault reporting. Short-to-battery events trigger HS switch disable; short-to-ground events trigger LS switch disable. Recovery requires explicit firmware reset of the fault latch and verification of safe conditions.

Can TLE98322QXXUMA1 operate without an external crystal?

Yes - the device includes an internal RC oscillator (12 MHz ±10%) usable for basic operation and LIN communication at lower accuracy. However, for guaranteed LIN baud rate compliance (±1.5% tolerance), an external 1–20 MHz crystal connected to XTAL1/XTAL2 is required; the internal PLL locks to this source for precise timing.

TLE98322QXXUMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Applications:
-
Core Processor:
XC800
Program Memory Type:
FLASH (36kB)
Controller Series:
-
RAM Size:
3.25K x 8
Interface:
LIN, SSI, UART
Number of I/O:
11
Voltage - Supply:
3V ~ 27V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-VQFN-48-31

TLE98322QXXUMA1 FAQ

1.How can I place an order for TLE98322QXXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TLE98322QXXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLE98322QXXUMA1 reliable?

The price and inventory of TLE98322QXXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE98322QXXUMA1 is usually 5 days.

3.What payment methods are accepted for TLE98322QXXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE98322QXXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLE98322QXXUMA1?

TLE98322QXXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLE98322QXXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLE98322QXXUMA1?

For technical support, including TLE98322QXXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE98322QXXUMA1 requirements.

6.How does Aetrix verify that TLE98322QXXUMA1 is sourced from the original manufacturer or authorized distributors?

All TLE98322QXXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE98322QXXUMA1 meets industry standards.

7.What is the process for return or replacement of TLE98322QXXUMA1?

All TLE98322QXXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE98322QXXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE98322QXXUMA1 part is unused and in its original packaging.

Return procedure for TLE98322QXXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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