Infineon Technologies TLE9832QV

Overview

TLE9832QV from Infineon Technologies is an automotive-qualified 8-bit microcontroller integrating LIN transceiver, high-side and dual low-side power switches, 32 kB Flash, 256 B RAM, and XC800 core operating up to 40 MHz - designed for body control modules, window lifters, and seat adjusters requiring integrated LIN communication and local power switching.

For engineers reviewing the TLE9832QV datasheet, TLE9832QV pinout, TLE9832QV application, or TLE9832QV equivalent, this device delivers system-level integration for cost-sensitive automotive sub-systems where LIN bus control, on-chip voltage regulation (1.5 V core / 5.0 V I/O), and direct load driving eliminate external transceivers and discrete switches.

Technical Context

The TLE9832QV implements a dual-voltage architecture: a 1.5 V core supply (VDDC) powers the XC800 CPU and digital logic, while a dedicated 5.0 V regulator (VDDP) supplies I/Os, LIN transceiver, and switch drivers. Its LIN transceiver complies with LIN 1.3/2.0/2.1 standards and supports wake-up via bus activity.

Power switching is handled by one high-side switch (max 60 V, 270 mΩ R_DS(on)) and two low-side switches (max 40 V, 120 mΩ R_DS(on), clamped), each supporting PWM control via CCU6 timers. The device includes loss-of-clock detection with fail-safe shutdown of power switches.

Key Specifications

Pinout & Package

Package: QFN-48 (7 mm × 7 mm, 0.5 mm pitch), thermally enhanced with exposed pad (EPAD) for PCB heat dissipation and ground reference.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive LIN-node microcontroller applications.

Compared with TLE9832QV, TLE9833QV extends integration with a third low-side switch and 12-bit ADC, while TLF35584ESV50 offloads power and communication functions to enable use with more powerful MCUs - choice depends on compute needs versus integration density.

Availability

TLE9832QV is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based actuator control, and embedded power switching applications requiring stable component supply and AEC-Q100 qualification.

Supply support for TLE9832QV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

The TLE9832QV belongs to Infineon's TLE98xx family of automotive LIN System-on-Chip devices, engineered to consolidate MCU, LIN communication, and power switching into single-package solutions for cost-optimized body electronics.

FAQ

What is the maximum operating voltage for the high-side switch?

The TLE9832QV high-side switch supports absolute maximum voltage of 60 V, with continuous operation rated up to 27 V battery supply. It includes overvoltage protection and thermal shutdown, and its cyclic current sense feature enables accurate load current monitoring without external components.

Does the TLE9832QV support in-system programming via LIN?

Yes - the device integrates a LIN Bootstrap Loader (LIN BSL) stored in BootROM, enabling firmware updates directly over the LIN bus without requiring JTAG or external debug hardware. This supports field reprogramming during vehicle service or OTA-like campaigns.

How many ADC channels does the TLE9832QV provide, and what are their resolutions?

The TLE9832QV features two independent ADC subsystems: ADC1 is a 10-bit SAR converter with 8 input channels and programmable gain; ADC2 is an 8-bit converter embedded within the Measurement Unit, optimized for fast battery voltage (VBAT_SENSE) and temperature sensing. Both support hardware-triggered conversions synchronized to PWM events.

Is the exposed pad (EPAD) on the QFN-48 package electrically connected?

Yes - the EPAD is internally connected to VSS (ground) and must be soldered to a solid PCB ground plane for thermal dissipation and electrical stability. Thermal resistance θ_JA is specified at 35 K/W with 250 mm² copper pad; omitting EPAD connection degrades thermal performance and may cause premature thermal shutdown under sustained load conditions.