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Infineon Technologies TLE9832QX
- Part No.:
- TLE9832QX
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
TLE9832QX.pdf
- Description:
- IC MOTOR DRIVER 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,976
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Product details
Overview
TLE9832QX from Infineon Technologies is an automotive-qualified 8-bit microcontroller integrating LIN transceiver, high-side and dual low-side power switches, 32 kB Flash + 4 kB emulated EEPROM, XC800 core (40 MHz), and on-chip 1.5 V/5.0 V regulators - designed for body control modules, seat/mirror actuators, and LIN-connected smart sensors in 12 V vehicle systems.
For engineers reviewing the TLE9832QX datasheet, TLE9832QX pinout, TLE9832QX application, or TLE9832QX equivalent, this device delivers integrated power switching, LIN 2.1 compliance, hardware PWM generation via CCU6, and fail-safe clock monitoring - critical for cost-sensitive, space-constrained automotive subsystems requiring functional safety support at ASIL-B level.
Technical Context
The TLE9832QX implements a dual-voltage architecture: 1.5 V core supply (VDDC) powers the XC800 CPU and digital logic, while 5.0 V I/O supply (VDDP) drives GPIO, LIN transceiver, and switch drivers. Its PMU includes loss-of-clock detection with automatic fail-safe shutdown of power switches.
Functional integration centers on real-time actuation control: the CCU6 unit generates complementary PWM with dead-time insertion for motor drive; two low-side switches (max 600 mA each, clamped to 42 V) and one high-side switch (max 350 mA, 42 V clamp) are independently controllable and monitored via dedicated sense paths and ADC inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | XC800 (8051-compatible), 40 MHz max, 2-cycle instruction execution - enables deterministic real-time response for LIN-based actuator control loops. |
| Memory | 32 kB Flash + 4 kB emulated EEPROM, 256 B RAM, 3 kB XRAM - supports firmware updates over LIN and parameter storage without external EEPROM. |
| LIN Interface | LIN 1.3/2.0/2.1 compliant transceiver with integrated wake-up and sleep mode - eliminates need for external LIN PHY and reduces BOM count. |
| Power Switches | 1× high-side (350 mA, 42 V clamp), 2× low-side (600 mA each, 42 V clamp, PWM-capable) - directly drives relays, solenoids, and small DC motors. |
| Analog Peripherals | 10-bit ADC (8 channels), 8-bit ADC (2 channels), temperature sensor, VBAT sense attenuator - enables closed-loop voltage/current/temperature monitoring for switch protection. |
| Clock System | On-chip oscillator + PLL, loss-of-clock detection with fail-safe switch disable - ensures safe power stage shutdown during clock failure per ISO 26262 requirements. |
| Debug & Boot | 2-wire Device Access Port (DAP), LIN Bootstrap Loader (LIN BSL) - enables in-system programming and diagnostics over existing LIN bus, no extra debug connector needed. |
Pinout & Package
Package: QFN-48 (7 mm × 7 mm, 0.5 mm pitch) with exposed thermal pad - optimized for compact automotive PCB layouts and thermal dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | I/O and peripheral supply | 5.0 V regulated input powering GPIO, LIN transceiver, and switch drivers; requires local 100 nF decoupling. |
| VDDC | Core logic supply | 1.5 V regulated input for XC800 CPU and digital logic; isolated from VDDP to reduce noise coupling. |
| HSW | High-side switch output | Drives load between battery and HSW pin; internal current sense and overtemperature shutdown enabled. |
| LSW1 / LSW2 | Low-side switch outputs | Ground-switching outputs with active clamping (42 V); support PWM dimming and relay coil driving with flyback energy recapture. |
| LIN | LIN bus interface | Single-wire bidirectional LIN physical layer I/O; integrates pull-up, slew rate control, and wake-up detection. |
| ADCGND | Analog ground reference | Dedicated analog ground pin for ADC and measurement unit - must be routed separately from digital GND to minimize noise. |
Key Features
| Feature | Design Value |
|---|---|
| LIN-compliant transceiver with wake-up | Enables ultra-low-power sleep mode (≤10 µA) and reliable bus wake-up without external circuitry - reduces system standby current. |
| Integrated high- and low-side switches | Eliminates 3 external power FETs and associated gate drivers - cuts board area by ≥25% and simplifies layout for LIN node integration. |
| CCU6 PWM generator with dead-time control | Hardware-accelerated complementary PWM generation with programmable dead time - essential for brushless DC motor commutation without CPU overhead. |
| On-chip 1.5 V/5.0 V regulators | Removes need for external LDOs; VDDC regulator provides stable core voltage across battery range (5.5–27 V) - improves system robustness. |
| LIN Bootstrap Loader (LIN BSL) | Allows field firmware updates using only the LIN bus and standard UART commands - avoids costly rework or connector access in final assemblies. |
Applications
| Seat Position Control | Mirror Adjustment Module |
|---|---|
Use Scenario: Motorized adjustment of automotive seat fore/aft, recline, and lumbar positions using 12 V DC motors. IC Role / Device Role / Timing Role: MCU + power driver managing dual H-bridge direction control, current sensing, and LIN command interpretation. Use Value: Integrated HS/LS switches and CCU6 PWM eliminate external half-bridge drivers; LIN BSL enables OEM calibration updates post-assembly. |
Use Scenario: Bidirectional control of side-view mirror tilt and fold functions in entry-level vehicles. IC Role / Device Role / Timing Role: LIN slave node executing position commands, driving dual low-side switches for mirror motor polarity reversal. Use Value: Single-chip solution replaces discrete MCU + dual MOSFET drivers + LIN transceiver - reduces BoM cost by $0.85/unit at volume. |
| Smart Window Lift Controller | Body Control Submodule (BCSM) |
Use Scenario: One-touch auto-up/down window lift with anti-pinch detection using current profiling and timeout. IC Role / Device Role / Timing Role: Real-time current monitoring via ADC, PWM-controlled high-side switch, and LIN communication with master BCM. Use Value: On-chip 10-bit ADC and hardware PWM enable precise stall detection without external op-amps or comparators. |
Use Scenario: Distributed control node managing interior lighting, door lock actuators, and status feedback in modular vehicle architectures. IC Role / Device Role / Timing Role: LIN slave processing commands, driving multiple low-side loads, and reporting fault status via LIN diagnostic frames. Use Value: Integrated watchdog with programmable window and fail-safe switch disable meets ASIL-B requirements for non-safety-critical but reliability-sensitive functions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive LIN-node microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLE9833QX | Same package and pinout; adds third low-side switch and enhanced ADC resolution (12-bit) | Required for designs needing >2 switched loads or higher-precision battery monitoring | Select when additional switching capacity or improved analog accuracy justifies minor cost increase. |
| SPC560B50L3 | 32-bit Power Architecture MCU; no integrated power switches; requires external LIN transceiver and drivers | Suitable for higher-performance body control with CAN/LIN hybrid networks and complex diagnostics | Choose only if migrating to 32-bit software stack or requiring CAN interface alongside LIN. |
Compared with TLE9832QX, TLE9833QX extends switching capability without changing footprint or firmware architecture, while SPC560B50L3 trades integration for raw compute power and protocol flexibility - making TLE9832QX optimal for cost-driven, single-protocol LIN nodes where BOM reduction is primary.
Availability
TLE9832QX is available at Aetrix Electronics and suitable for seat control modules, mirror adjustment units, window lift systems, and body control submodules requiring stable component supply across automotive production lifecycles.
Supply support for TLE9832QX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TLE9832QX belongs to Infineon's TLE98xx family of automotive LIN system basis chips - engineered specifically to consolidate MCU, LIN PHY, and power switches into a single package for cost-sensitive, functionally safe body electronics.
FAQ
What is the maximum operating ambient temperature for TLE9832QX?
The TLE9832QX is qualified for operation from −40 °C to +125 °C ambient temperature, with junction temperature limits defined up to +150 °C. Thermal derating applies above +105 °C ambient when driving full-load currents through integrated switches; design must ensure thermal pad soldering and PCB copper area meet Infineon's recommended 4-layer layout guidelines.
Does TLE9832QX support LIN 2.2 or later versions?
No - the integrated LIN transceiver complies strictly with LIN specifications 1.3, 2.0, and 2.1 as documented in the 2012 datasheet. It does not implement LIN 2.2 features such as configurable frame response timing or enhanced error handling; migration to newer LIN versions requires external transceiver or upgrade to TLE984x series devices.
Can the high-side switch be used in parallel with a low-side switch for H-bridge motor control?
Yes - the TLE9832QX supports independent control of HSW and either LSW1 or LSW2, enabling single-H-bridge configurations for unidirectional motor control. However, it lacks hardware interlock or shoot-through protection; safe commutation requires firmware-enforced dead time and state validation before simultaneous activation.
Is the 4 kB emulated EEPROM wear-leveled and certified for automotive endurance?
Yes - the 4 kB Flash region configured for EEPROM emulation supports ≥100,000 write/erase cycles and retains data for ≥10 years at +125 °C, validated per AEC-Q100 Grade 1 requirements. Emulation is handled by Infineon's provided Flash library, which manages page rotation and wear leveling transparently to application code.
TLE9832QX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- XC800
- Program Memory Type:
- FLASH (36kB)
- Controller Series:
- -
- RAM Size:
- 3.25K x 8
- Interface:
- LIN, SSI, UART
- Number of I/O:
- 11
- Voltage - Supply:
- 3V ~ 27V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VQFN-48-31
TLE9832QX FAQ
1.How can I place an order for TLE9832QX through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE9832QX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE9832QX reliable?
The price and inventory of TLE9832QX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9832QX is usually 5 days.
3.What payment methods are accepted for TLE9832QX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9832QX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE9832QX?
TLE9832QX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE9832QX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE9832QX?
For technical support, including TLE9832QX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9832QX requirements.
6.How does Aetrix verify that TLE9832QX is sourced from the original manufacturer or authorized distributors?
All TLE9832QX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9832QX meets industry standards.
7.What is the process for return or replacement of TLE9832QX?
All TLE9832QX units undergo pre-shipment inspection (PSI). If there is an issue with TLE9832QX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE9832QX part is unused and in its original packaging.
Return procedure for TLE9832QX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE9832QX Tags
-
CYPD3175-24LQXQ
Infineon Technologies
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SLB9672VU20FW1523XTMA1
Infineon Technologies
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Infineon Technologies
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Infineon Technologies
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Infineon Technologies
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CYPD3125-40LQXIT
Infineon Technologies
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AT97SC3204-U2A1A-20
Microchip Technology
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AT97SC3204-U2A1A-10
Microchip Technology
-
SLM9670AQ20FW1311XTMA1
Infineon Technologies
-
SLB9672XU20FW1613XTMA1
Infineon Technologies
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Infineon Technologies
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SLB9673AU20FW2613XTMA1
Infineon Technologies
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