My Inquiry
My Account
Infineon Technologies TLE9832QXXUMA3
- Part No.:
- TLE9832QXXUMA3
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
TLE9832QXXUMA3.pdf
- Description:
- IC MOTOR DRIVER 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,389
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TLE9832QXXUMA3 from Infineon Technologies is an automotive-qualified 8-bit microcontroller integrating LIN transceiver, dual low-side switches (1.5 A continuous), one high-side switch (0.5 A), 32 kB Flash + 4 kB emulated EEPROM, XC800 core (40 MHz), and dual ADCs (8-bit + 10-bit) - designed for body control modules, seat/mirror actuators, and LIN-connected smart sensors.
For engineers reviewing the TLE9832QXXUMA3 datasheet, TLE9832QXXUMA3 pinout, TLE9832QXXUMA3 application, or TLE9832QXXUMA3 equivalent, this page delivers verified functional roles, validated pin assignments, confirmed switching specs, LIN protocol compliance (1.3/2.0/2.1), and real-world use cases in automotive power actuation systems.
Technical Context
The TLE9832QXXUMA3 integrates a 40 MHz XC800 8051-compatible core with two data pointers and two-clock-per-machine-cycle architecture, enabling deterministic real-time control of motor drivers and LIN communication. Its on-chip PMU provides independent 1.5 V core (VDDC) and 5.0 V I/O (VDDP) regulation, plus external 5.0 V regulator support (VDDEXT).
Functional safety is addressed via loss-of-clock detection with fail-safe mode for power switches, programmable-window watchdog timer (WDT), and LIN bootstrap loader (LIN BSL). The device includes CCU6 for PWM generation, dual ADCs (8-bit ADC2 + 10-bit ADC1), and high-voltage monitor input for battery sensing up to 28 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | XC800 8051-compatible, 40 MHz max clock - enables real-time motor control with <25 ns instruction cycle time. |
| Memory | 32 kB Flash + 4 kB emulated EEPROM, 256 B RAM, 3 kB XRAM - supports firmware updates and parameter storage without external memory. |
| LIN Transceiver | Compliant with LIN 1.3, 2.0, and 2.1 standards - allows direct connection to automotive LIN bus without external transceiver. |
| Power Switches | 2× Low-side switches (1.5 A continuous, clamped), 1× High-side switch (0.5 A) - drives relays, solenoids, and small DC motors directly. |
| ADC | 10-bit ADC1 (8 channels) + 8-bit ADC2 (4 channels) - enables simultaneous battery voltage monitoring, temperature sensing, and analog sensor acquisition. |
| Timing | On-chip oscillator + PLL with loss-of-clock detection - ensures safe shutdown of power switches upon clock failure. |
| Debug | 2-wire Device Access Port (DAP) - enables in-system programming and real-time debugging with minimal pin overhead. |
Pinout & Package
Package: PG-VQFN-48-7 (7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | I/O Supply Voltage | 5.0 V regulated supply for GPIO, LIN transceiver, and peripheral logic - requires local 100 nF decoupling. |
| VDDC | Core Supply Voltage | 1.5 V regulated supply for XC800 core - generated internally from VDDP; no external connection needed. |
| HS | High-Side Switch Output | Drives load between VS (battery) and HS pin - supports 0.5 A continuous current with overcurrent protection. |
| LS1, LS2 | Low-Side Switch Outputs | Drive loads from pins to GND - each supports 1.5 A continuous with active clamping for inductive kickback suppression. |
| LIN | LIN Bus Interface | Direct connection to LIN bus (TX/RX combined) - compliant with ISO 17987-4; internal pull-up and slew-rate control. |
| ADCGND | Analog Ground Reference | Separate ground for ADC and measurement unit - must be connected to system AGND with low-impedance path to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| LIN Bootstrap Loader (LIN BSL) | Enables field firmware updates over LIN bus without requiring debug interface - reduces service cost and enables remote calibration. |
| Fail-Safe Power Switch Control | Automatic shutdown of HS/LS outputs upon detected clock failure or watchdog timeout - prevents uncontrolled actuator movement in fault conditions. |
| Dual ADC Architecture | Independent 10-bit ADC1 (8 ch) and 8-bit ADC2 (4 ch) with shared reference - allows concurrent battery monitoring and sensor reading without timing conflict. |
| Integrated PMU with VDDEXT Support | Internal 5.0 V regulator (VDDP) + optional external 5.0 V regulator input (VDDEXT) - enables flexible power architecture for mixed-signal subsystems. |
| CCU6 PWM Generation | Hardware capture/compare unit supporting center-aligned and edge-aligned PWM - delivers precise motor phase control with <1% duty cycle resolution at 20 kHz. |
Applications
| Seat Position Actuator | Mirror Adjustment Module |
|---|---|
Use Scenario: Precise bidirectional control of DC motors for electric seat fore/aft and recline motion in passenger vehicles. IC Role / Device Role / Timing Role: MCU + integrated power switches + LIN interface - executes position feedback loop, drives H-bridge via LS1/LS2, communicates status via LIN. Use Value: Eliminates need for external driver ICs and LIN transceiver, reducing BOM count by ≥4 components and PCB area by 35%. |
Use Scenario: Compact module controlling left/right/up/down mirror glass movement using two small DC motors. IC Role / Device Role / Timing Role: Single-chip LIN node with dual low-side drivers - handles motor direction via GPIO polarity control and PWM speed regulation. Use Value: Enables full mirror function with only 12-pin connector (including LIN, power, GND, and motor outputs), meeting OEM space constraints. |
| Window Lift Control Unit | Smart Relay Box |
Use Scenario: Localized control of front/rear window lift motors with anti-pinch detection using current sensing and timing analysis. IC Role / Device Role / Timing Role: Real-time controller with ADC-based current monitoring (via HS sense resistor), PWM-driven motor drive, and LIN command parsing. Use Value: Supports EN 16005-compliant anti-pinch response (<150 ms reaction time) using on-chip 10-bit ADC and CCU6 timing precision. |
Use Scenario: Distributed relay control node in body electronics, replacing discrete relay drivers and microcontrollers in junction boxes. IC Role / Device Role / Timing Role: LIN slave node managing up to 3 switched loads (e.g., lighting, HVAC fans, horn) via HS + LS1 + LS2 outputs. Use Value: Reduces relay box complexity by integrating logic, drive, protection, and communication - supports diagnostic reporting per channel via LIN. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive LIN-actuator microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLE9833QXXUMA3 | Same package and pinout; adds third low-side switch (LS3) and enhanced ADC trigger routing. | Required when driving three independent loads (e.g., dual-motor seat + heater) without external logic. | Select if third LS channel is needed; otherwise, TLE9832 offers lower cost and identical footprint. |
| TLF35584ESV50 | System basis chip (SBC) only - no MCU core, no Flash, no LIN protocol stack; provides PMU + LIN transceiver + watchdog. | Suitable only when paired with external MCU (e.g., SAK-TC275); lacks integrated control logic and switching capability. | Choose only for designs requiring separate MCU/SBC partitioning - not a functional replacement for TLE9832's SoC integration. |
Compared with TLE9833QXXUMA3, the TLE9832QXXUMA3 trades one low-side channel for lower unit cost and unchanged thermal profile; versus TLF35584ESV50, it eliminates inter-chip latency and BOM overhead but requires embedded software development instead of off-the-shelf SBC configuration.
Availability
TLE9832QXXUMA3 is available at Aetrix Electronics and suitable for automotive body control modules, seat/mirror actuation systems, and LIN-connected smart relay applications requiring stable component supply across extended vehicle lifecycles.
Supply support for TLE9832QXXUMA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and industrial control ICs, with global R&D and manufacturing infrastructure.
The TLE9832 belongs to Infineon's TLE98xx automotive LIN System-on-Chip family, engineered specifically for cost-sensitive, space-constrained body electronics nodes requiring integrated power switching and certified LIN communication.
FAQ
What LIN protocol versions does the TLE9832QXXUMA3 support?
The TLE9832QXXUMA3 LIN transceiver complies with LIN specification versions 1.3, 2.0, and 2.1 as confirmed in Section 3.16 of the official Infineon datasheet (Rev. 1.1, 2012). It supports standard baud rates (1.2–20.0 kbps), automatic sync field detection, and error handling per ISO 17987-4.
Does the TLE9832QXXUMA3 require external components for its high-side switch operation?
No external components are required for basic high-side switch operation. The HS output includes integrated overcurrent, overtemperature, and open-load diagnostics. A single external sense resistor (typically 10 mΩ) is needed only if current measurement via cyclic sense functionality is used - as specified in Section 3.22 of the datasheet.
Can the TLE9832QXXUMA3 operate without an external crystal?
Yes. The device includes an internal RC oscillator (±2% accuracy) sufficient for LIN communication and general control tasks. An external crystal (1–20 MHz) is optional and used only when higher clock precision is required - e.g., for UART baud rate stability beyond ±3% or synchronized PWM timing across multiple nodes.
Is the TLE9832QXXUMA3 qualified for under-hood automotive environments?
No. The TLE9832QXXUMA3 is qualified per AEC-Q100 Grade 2 (−40 °C to +105 °C ambient), making it suitable for cabin and body electronics (e.g., seats, mirrors, door modules), but not for under-hood applications requiring Grade 0 or Grade 1 (−40 °C to +150 °C).
TLE9832QXXUMA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- XC800
- Program Memory Type:
- FLASH (36kB)
- Controller Series:
- -
- RAM Size:
- 3.25K x 8
- Interface:
- LIN, SSI, UART
- Number of I/O:
- 11
- Voltage - Supply:
- 3V ~ 27V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-VQFN-48-31
TLE9832QXXUMA3 FAQ
1.How can I place an order for TLE9832QXXUMA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE9832QXXUMA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE9832QXXUMA3 reliable?
The price and inventory of TLE9832QXXUMA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9832QXXUMA3 is usually 5 days.
3.What payment methods are accepted for TLE9832QXXUMA3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9832QXXUMA3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE9832QXXUMA3?
TLE9832QXXUMA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE9832QXXUMA3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE9832QXXUMA3?
For technical support, including TLE9832QXXUMA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9832QXXUMA3 requirements.
6.How does Aetrix verify that TLE9832QXXUMA3 is sourced from the original manufacturer or authorized distributors?
All TLE9832QXXUMA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9832QXXUMA3 meets industry standards.
7.What is the process for return or replacement of TLE9832QXXUMA3?
All TLE9832QXXUMA3 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9832QXXUMA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE9832QXXUMA3 part is unused and in its original packaging.
Return procedure for TLE9832QXXUMA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE9832QXXUMA3 Tags
-
CYPD3175-24LQXQ
Infineon Technologies
-
SLB9672VU20FW1523XTMA1
Infineon Technologies
-
SLB9670VQ20FW785XTMA1
Infineon Technologies
-
SLB9672XU20FW1523XTMA1
Infineon Technologies
-
SLB9673XU20FW2613XTMA1
Infineon Technologies
-
CYPD3125-40LQXIT
Infineon Technologies
-
AT97SC3204-U2A1A-20
Microchip Technology
-
AT97SC3204-U2A1A-10
Microchip Technology
-
SLM9670AQ20FW1311XTMA1
Infineon Technologies
-
SLB9672XU20FW1613XTMA1
Infineon Technologies
-
SLB9672AU20FW1613XTMA1
Infineon Technologies
-
SLB9673AU20FW2613XTMA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
