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Infineon Technologies TLE9833QXXUMA1
- Part No.:
- TLE9833QXXUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Application Specific Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
TLE9833QXXUMA1.pdf
- Description:
- IC MOTOR DRIVER 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,211
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Product details
Overview
TLE9833QXXUMA1 from Infineon Technologies is an automotive-qualified 8-bit microcontroller integrating LIN transceiver, dual high-side and dual low-side power switches, 44 kB Flash, 256 B RAM, and XC800 core operating up to 40 MHz - designed for body control modules, seat/mirror actuators, and LIN-connected lighting drivers in 12 V vehicle systems.
For engineers reviewing the TLE9833QXXUMA1 datasheet, TLE9833QXXUMA1 pinout, TLE9833QXXUMA1 application, or TLE9833QXXUMA1 equivalent, this device delivers integrated power switching, LIN 2.1 compliance, on-chip 1.5 V core regulation, hardware PWM generation via CCU6, and debug support via 2-wire DAP - critical for cost-sensitive, space-constrained automotive sub-systems requiring functional safety awareness.
Technical Context
The TLE9833QXXUMA1 implements a dual-voltage architecture: 1.5 V core supply (VDDC) powers the XC800 CPU and digital peripherals, while 5.0 V I/O supply (VDDP) drives GPIO, LIN transceiver, and switch drivers. Its PMU includes loss-of-clock detection with fail-safe shutdown of power switches.
Functional integration includes LIN 2.1-compliant transceiver with bus wake-up capability, CCU6 unit supporting center-aligned PWM for motor control, and two independent 10-bit ADCs (ADC1 and ADC2) with dedicated voltage reference and temperature sensor interface - enabling closed-loop monitoring of battery voltage, load current, and die temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | XC800 (8051-compatible), 40 MHz max, 2-cycle instruction execution |
| Memory | 44 kB Flash + 4 kB emulated EEPROM, 256 B RAM, 3 kB XRAM |
| LIN Compliance | LIN 1.3 / 2.0 / 2.1 transceiver with wake-up, bus fault protection, and slew-rate control |
| Power Switches | 2× high-side (RDS(on) = 170 mΩ typ @ 25°C), 2× low-side (RDS(on) = 120 mΩ typ @ 25°C), each with overcurrent/thermal shutdown |
| ADC | Two independent 10-bit ADCs: ADC1 (8-channel, 1.25 µs conversion), ADC2 (4-channel, integrated temp sensor & VBAT_SENSE attenuator) |
| Timers & PWM | Five 16-bit timers; CCU6 unit with 2x PWM channels, dead-time insertion, and center-aligned mode for motor drive |
| Debug Interface | 2-wire Device Access Port (DAP) supporting flash programming, real-time debugging, and LIN BSL bootloading |
Pinout & Package
Package: PG-VQFN-48-77 (7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP | I/O & peripheral supply | 5.0 V regulated input for GPIO, LIN transceiver, and switch drivers; requires external 10 µF ceramic decoupling |
| VDDC | Core logic supply | 1.5 V internal regulator output; must be externally bypassed with 1 µF ceramic capacitor |
| VDDEXT | External 5 V regulator input | Accepts 4.5–5.5 V for optional external VDDP regulation; disables internal VDDP LDO when used |
| HSS1, HSS2 | High-side switch outputs | Drives loads between battery and output; supports PWM up to 20 kHz with current limiting and thermal foldback |
| LSS1, LSS2 | Low-side switch outputs | Sinks current to GND; includes active clamping for inductive load flyback suppression |
| LIN | LIN bus interface | Single-wire bidirectional LIN physical layer I/O; integrated pull-up, ESD protection, and bus wake-up detection |
| XTAL1/XTAL2 | Crystal oscillator inputs | Supports 1–20 MHz crystal; internal PLL multiplies to 40 MHz system clock |
| DAP_CLK/DAP_DATA | Debug port interface | 2-wire serial interface for programming, breakpoint debugging, and memory access without reset |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LIN Transceiver | Fully compliant with LIN 2.1; enables direct connection to vehicle LIN bus without external transceiver or level-shifting components |
| Fail-Safe Power Switch Control | Loss-of-clock detection triggers automatic shutdown of HSS/LSS outputs within 10 µs - prevents uncontrolled actuator motion during MCU fault |
| Hardware PWM Generation | CCU6 unit provides synchronized, center-aligned PWM with programmable dead time - eliminates software timing jitter in motor commutation |
| On-Chip Temperature Sensing | Dedicated analog path from internal bandgap reference to ADC2 enables ±2°C die temperature measurement without external sensor |
| Bootloader Support | LIN Bootstrap Loader (LIN BSL) allows field firmware updates over LIN bus - no debugger or additional hardware required |
Applications
| Seat Position Actuators | Mirror Adjustment Modules |
|---|---|
|
Use Scenario: Precise bidirectional control of DC motors for electric seat fore/aft, recline, and lumbar adjustment in passenger vehicles. IC Role / Device Role / Timing Role: MCU + dual HSS/LSS driver + LIN interface - executes position feedback loop, manages motor direction/speed, and reports status over LIN. Use Value: Eliminates need for discrete H-bridge and LIN transceiver; reduces BOM count by ≥7 components while maintaining ASIL-B-aware diagnostics. |
Use Scenario: Compact, low-power control of mirror glass tilt and fold functions using small DC motors and position sensors. IC Role / Device Role / Timing Role: Integrated LIN node managing motor sequencing, end-stop detection via ADC, and wake-on-LIN bus activity. Use Value: Enables <5 mA sleep current with bus wake-up; supports LIN cluster integration without external voltage translation or level shifters. |
| LED Headlamp Dimming | Window Lift Controllers |
|
Use Scenario: Analog dimming of automotive LED headlamps using PWM-controlled constant-current drivers in ADB (Adaptive Driving Beam) subsystems. IC Role / Device Role / Timing Role: Generates precise, jitter-free PWM signals (via CCU6) while monitoring LED forward voltage and junction temperature via ADC1/ADC2. Use Value: Achieves <1% duty cycle resolution at 1 kHz; thermal derating based on real-time die temperature prevents LED lumen degradation. |
Use Scenario: One-touch auto-up/down control of power windows with anti-pinch detection using current sensing and position tracking. IC Role / Device Role / Timing Role: Measures motor current via shunt resistor and ADC1, computes position via pulse counting, and controls HSS/LSS outputs for direction and braking. Use Value: Integrates all signal conditioning, PWM generation, and LIN communication - meets ECE R127 anti-pinch requirements with <2 ms response latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive LIN-node microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLF35584ESV33 | System basis chip (SBC) only - no MCU core or Flash; provides 3x LDOs, watchdog, and LIN transceiver | Requires external MCU; suitable for designs needing higher integration of power management but separate control logic | Select when separating safety-critical power management from application processing improves ASIL decomposition |
| SPC560B50L5 | 32-bit Power Architecture MCU with CAN, no integrated LIN transceiver or power switches; 512 kB Flash, 48 kB RAM | Targets higher-performance body domain controllers requiring CAN/LIN gateway functionality and larger code footprint | Select when LIN node must also serve as gateway or run complex diagnostics stacks beyond TLE9833's 44 kB Flash limit |
Compared with TLF35584ESV33 and SPC560B50L5, the TLE9833QXXUMA1 uniquely combines 8-bit MCU, LIN PHY, and dual HSS/LSS in one die - reducing PCB area and interconnect complexity for single-function LIN nodes where cost and footprint are primary constraints.
Availability
TLE9833QXXUMA1 is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based actuator control, and 12 V embedded power switching applications requiring stable component supply across production lifecycles.
Supply support for TLE9833QXXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TLE9833QXXUMA1 belongs to Infineon's TLE98xx family of automotive LIN System Basis Chips with embedded microcontrollers - engineered specifically for cost-optimized, function-integrated body electronics nodes requiring ASIL-aware operation and minimal external components.
FAQ
What LIN protocol versions does the TLE9833QXXUMA1 support?
The TLE9833QXXUMA1 integrates a LIN transceiver compliant with LIN specification versions 1.3, 2.0, and 2.1. It supports standard LIN frame formats, slave node addressing, sleep/wake-up via bus activity, and configurable baud rates from 1.2 to 20 kbps - all implemented in hardware without MCU intervention.
How is functional safety addressed in the TLE9833QXXUMA1?
The device includes loss-of-clock detection that forces immediate shutdown of high-side and low-side switches within 10 µs, a windowed watchdog timer with programmable refresh interval and warning flag, and hardware-based overtemperature/overcurrent protection for all power switches - collectively supporting ASIL-B decomposition in ISO 26262-compliant systems.
Can the TLE9833QXXUMA1 operate without an external crystal?
Yes - the device features an internal RC oscillator (12 MHz typ.) usable as system clock source. However, LIN communication requires ±1.5% clock accuracy, which mandates use of the external crystal (1–20 MHz) with internal PLL for full LIN compliance; RC oscillator alone is sufficient only for non-LIN debug or test modes.
What is the maximum continuous current rating for the integrated high-side switches?
Each high-side switch (HSS1/HSS2) supports 350 mA continuous current at 25°C ambient with PCB copper area ≥200 mm² per switch. Derating applies above 85°C junction temperature, reaching 0 mA at 150°C - enforced by internal thermal shutdown circuitry independent of MCU firmware.
TLE9833QXXUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- XC800
- Program Memory Type:
- FLASH (48kB)
- Controller Series:
- -
- RAM Size:
- 3.25K x 8
- Interface:
- LIN, SSI, UART
- Number of I/O:
- 11
- Voltage - Supply:
- 3V ~ 27V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- -
TLE9833QXXUMA1 FAQ
1.How can I place an order for TLE9833QXXUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TLE9833QXXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLE9833QXXUMA1 reliable?
The price and inventory of TLE9833QXXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9833QXXUMA1 is usually 5 days.
3.What payment methods are accepted for TLE9833QXXUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9833QXXUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLE9833QXXUMA1?
TLE9833QXXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLE9833QXXUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLE9833QXXUMA1?
For technical support, including TLE9833QXXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9833QXXUMA1 requirements.
6.How does Aetrix verify that TLE9833QXXUMA1 is sourced from the original manufacturer or authorized distributors?
All TLE9833QXXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9833QXXUMA1 meets industry standards.
7.What is the process for return or replacement of TLE9833QXXUMA1?
All TLE9833QXXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9833QXXUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLE9833QXXUMA1 part is unused and in its original packaging.
Return procedure for TLE9833QXXUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TLE9833QXXUMA1 Tags
-
CYPD3175-24LQXQ
Infineon Technologies
-
SLB9672VU20FW1523XTMA1
Infineon Technologies
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SLB9670VQ20FW785XTMA1
Infineon Technologies
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SLB9672XU20FW1523XTMA1
Infineon Technologies
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SLB9673XU20FW2613XTMA1
Infineon Technologies
-
CYPD3125-40LQXIT
Infineon Technologies
-
AT97SC3204-U2A1A-20
Microchip Technology
-
AT97SC3204-U2A1A-10
Microchip Technology
-
SLM9670AQ20FW1311XTMA1
Infineon Technologies
-
SLB9672XU20FW1613XTMA1
Infineon Technologies
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SLB9672AU20FW1613XTMA1
Infineon Technologies
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SLB9673AU20FW2613XTMA1
Infineon Technologies
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