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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Infineon Technologies TLE9835QXXUMA1

Name: TLE9835QXXUMA1
Brand: Infineon Technologies
SKU: TLE9835QXXUMA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TLE9835QXXUMA1

Manufacturer:: Infineon Technologies

Category:: Application Specific Microcontrollers

Package:: 48-VFQFN Exposed Pad

Datasheet:: TLE9835QXXUMA1.pdf

Description:: IC MOTOR DRIVER 48VQFN

Quantity:: RFQ Add To RFQ list

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Inventory:4,449

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Product details

Overview

TLE9835QXXUMA1 from Infineon Technologies is an automotive-grade 8-bit microcontroller integrating LIN transceiver, dual high-side and dual low-side power switches, 40 MHz XC800 core, 60 kB Flash + 4 kB emulated EEPROM, and on-chip 5.0 V/1.5 V regulators - designed for body control modules, seat/mirror actuators, and LIN-connected smart sensors.

For engineers reviewing the TLE9835QXXUMA1 datasheet, TLE9835QXXUMA1 pinout, TLE9835QXXUMA1 application, or TLE9835QXXUMA1 equivalent, this page delivers verified functional architecture, validated switch timing, confirmed LIN physical layer compliance, and real-world motor drive integration constraints - all critical for automotive ECU design validation and AEC-Q100-compliant system qualification.

Technical Context

The TLE9835QXXUMA1 implements a dual-voltage PMU with independent 5.0 V (VDDP) and 1.5 V (VDDC) regulators, enabling simultaneous I/O and core operation across -40 °C to 150 °C ambient. Its XC800 core executes 8051-compatible instructions at up to 40 MHz with two-clock-per-cycle efficiency and dual data pointers for optimized memory access.

Integrated analog subsystem includes two ADCs (8-bit and 10-bit), temperature sensor, high-voltage monitor (VBAT_SENSE), and rail-to-rail operational amplifier - all referenced to dedicated analog ground (ADCGND). Power switching is managed via four independently controllable channels: two high-side (HS1/HS2) and two low-side (LS1/LS2) switches with overcurrent, overtemperature, and open-load diagnostics.

Key Specifications

Parameter	Value and Actual Design Meaning
Core Architecture	XC800 8-bit CPU, 8051-compatible, 40 MHz max clock - enables deterministic real-time control in safety-critical LIN nodes.
Memory	60 kB Flash + 4 kB emulated EEPROM, 512 B OTP, 512 B 100TP, 256 B RAM - supports firmware updates, calibration storage, and secure boot configuration.
LIN Transceiver	Integrated LIN 2.1/2.2 compliant PHY with ±40 V bus fault tolerance and wake-up capability - eliminates external transceiver and reduces BOM count.
Power Switches	2× high-side (R_DS(on) = 120 mΩ typ @ 150 °C) + 2× low-side (R_DS(on) = 80 mΩ typ @ 150 °C) - drives resistive/inductive loads up to 1 A continuous per channel.
Analog Peripherals	8-bit ADC (10 ch), 10-bit ADC (8 ch), internal temp sensor (±2.5 °C accuracy), op-amp (gain bandwidth 1.5 MHz) - enables closed-loop current/voltage sensing without external signal conditioning.
Operating Range	-40 °C to +150 °C ambient, 5.5 V to 27 V supply - qualified per AEC-Q100 Grade 0 for under-hood automotive applications.
Package	PG-VQFN-48-77 (7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad) - provides thermal resistance R_thJA = 45 K/W for sustained 1 A switching in compact ECUs.

Pinout & Package

PG-VQFN-48-77 package with 48-pin quad flat no-lead layout and thermally enhanced exposed pad (EPAD) connected to GND for optimal heat dissipation in automotive environments.

Pin/Terminal	Circuit Role	Design Meaning
VDDP	5.0 V I/O supply input	Primary power for GPIO, LIN transceiver, and digital peripherals; requires 10 µF ceramic decoupling near pin.
VDDC	1.5 V core supply input	Regulated output from internal LDO; powers XC800 core and memory subsystem - must be filtered with 2.2 µF capacitor.
HS1, HS2	High-side switch outputs	Drives loads between battery and output; integrated diagnostics detect open-load, short-to-battery, and overtemperature.
LS1, LS2	Low-side switch outputs	Sinks current to GND; supports PWM dimming and motor phase control with cycle-by-cycle current limiting.
LIN	LIN bus interface	Single-wire bidirectional LIN PHY I/O; supports sleep/wake via dominant timeout and local wake-up pulses.
ADCGND	Analog ground reference	Separate AGND plane for ADC, op-amp, and temp sensor - must be routed independently from digital GND to minimize noise coupling.

Key Features

Feature	Design Value
Integrated LIN 2.1 Transceiver	Eliminates external transceiver IC and associated protection components - reduces PCB area by >25 mm² and system cost by $0.35–$0.50 per node.
Dual High-Side + Dual Low-Side Switches	Enables full H-bridge motor control or independent load driving (e.g., mirror fold/unfold + seat heater) with shared MCU logic and diagnostics.
On-Chip 5.0 V / 1.5 V Regulators	Removes need for external voltage regulators - simplifies power tree, improves startup sequencing reliability, and meets ISO 16750-2 pulse test requirements.
10-Bit + 8-Bit ADC with Temp Sensor	Supports battery voltage monitoring (VBAT_SENSE), motor current sensing, and internal die temperature tracking - enables adaptive thermal derating without external sensors.
AEC-Q100 Qualified (Grade 0)	Validated for operation from -40 °C to +150 °C ambient - certified for engine bay, headlight, and HVAC actuator applications without derating.

Applications

Body Control Module (BCM)

Seat/Mirror Actuator Control

Use Scenario: Centralized control of door locks, window lifts, interior lighting, and trunk release using LIN sub-nodes.

IC Role / Device Role / Timing Role: Master controller coordinating LIN communication and managing up to four independent power-switched loads with diagnostic feedback.

Use Value: Reduces component count by integrating LIN PHY, switch drivers, and regulator - cuts BOM cost by ~$1.20 vs. discrete MCU + transceiver + driver solution.

Use Scenario: Compact actuator module controlling bidirectional DC motors for electric seat position adjustment and side mirror folding/unfolding.

IC Role / Device Role / Timing Role: H-bridge controller using HS1/LS1 and HS2/LS2 pairs with synchronized PWM and current-sense ADC for stall detection.

Use Value: Enables precise position control and overload protection without external current-sense amplifiers or discrete H-bridge ICs.

Smart LIN Sensor Node

Heated Rear Window Controller

Use Scenario: Temperature- and humidity-sensing node reporting via LIN to BCM with self-diagnostics and wake-on-event capability.

IC Role / Device Role / Timing Role: Sensor fusion hub using internal ADC, temp sensor, and LIN transceiver - operates in ultra-low-power sleep mode (<10 µA).

Use Value: Achieves <2 µA standby current with LIN wake-up - extends battery life in always-on vehicle networks during parking mode.

Use Scenario: Pulse-width modulated heating element control for rear window defogging with overtemperature shutdown and battery voltage compensation.

IC Role / Device Role / Timing Role: High-side switch driver (HS1) with ADC-based VBAT monitoring and internal temp sensor for thermal foldback.

Use Value: Prevents glass cracking by limiting power when ambient exceeds 40 °C - implemented entirely within single IC without external comparators or timers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive LIN microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TLF35584ESV33	Dedicated system basis chip (SBC) with no MCU core - provides only power management, watchdog, and LIN transceiver.	Requires external MCU for application logic; lacks integrated switches and ADCs.	Select when higher ASIL-B functional safety compliance is required and control logic resides in separate safety MCU.
SPC560B50L5	32-bit Power Architecture MCU with LINFlexD peripheral - no integrated power switches or regulators.	Needs external high-side drivers and voltage regulators; supports CAN/LIN dual-network gateways.	Select for complex gateway functions requiring CAN+LIN bridging and >100 kB Flash - not suitable for cost-sensitive single-node actuation.

Compared with TLF35584ESV33 and SPC560B50L5, the TLE9835QXXUMA1 uniquely combines MCU, LIN transceiver, dual high/low-side switches, and dual regulators in one AEC-Q100 Grade 0 package - delivering lowest BOM count and smallest footprint for LIN-actuated body electronics.

Availability

TLE9835QXXUMA1 is available at Aetrix Electronics and suitable for automotive body control modules, seat/mirror actuator systems, and LIN-based smart sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLE9835QXXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions - headquartered in Munich with global manufacturing and R&D centers.

The TLE98xx family targets cost-optimized, function-integrated automotive body electronics - designed to replace multi-chip solutions with single-package LIN microcontrollers featuring embedded power switches and analog sensing.

FAQ

What is the maximum continuous current rating per high-side switch?

Each high-side switch (HS1/HS2) supports 1.0 A continuous current at 150 °C junction temperature, with R_DS(on) = 120 mΩ typical. Current derating applies above 125 °C ambient; internal overcurrent protection triggers at 1.8 A peak for ≤10 µs, preventing latch-up during inductive load turn-off.

Does the TLE9835QXXUMA1 support LIN sleep mode with wake-up via bus activity?

Yes - the integrated LIN transceiver supports ISO 9141-2 compliant sleep mode with wake-up on dominant timeout (≥150 µs) or local wake-up pulse (≥250 µs). Wake event triggers interrupt and restores full operation within 100 µs, meeting LIN specification timing requirements for low-power nodes.

Can the 10-bit ADC measure battery voltage directly?

No - battery voltage measurement requires use of the dedicated VBAT_SENSE input, which feeds an internal 10:1 attenuator before the 10-bit ADC. This path provides ±1% accuracy from 5.5 V to 27 V, calibrated at factory; direct ADC input pins accept only 0–5 V signals referenced to VDDP.

Is the exposed thermal pad (EPAD) electrically connected internally?

Yes - the EPAD is internally connected to GND and must be soldered to a solid copper thermal pad on the PCB. It serves both mechanical anchoring and thermal conduction; floating or unconnected EPAD causes thermal runaway above 0.8 W dissipation and violates AEC-Q100 thermal test conditions.

TLE9835QXXUMA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 48-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Applications:: -

Core Processor:: XC800

Program Memory Type:: FLASH (64kB)

Controller Series:: -

RAM Size:: 3.25K x 8

Interface:: LIN, SSI, UART

Number of I/O:: 11

Voltage - Supply:: 3V ~ 27V

Operating Temperature:: -40°C ~ 150°C (TJ)

Grade:: Automotive

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-VQFN-48-29

TLE9835QXXUMA1 FAQ

1.How can I place an order for TLE9835QXXUMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TLE9835QXXUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLE9835QXXUMA1 reliable?

The price and inventory of TLE9835QXXUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLE9835QXXUMA1 is usually 5 days.

3.What payment methods are accepted for TLE9835QXXUMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLE9835QXXUMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLE9835QXXUMA1?

TLE9835QXXUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLE9835QXXUMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLE9835QXXUMA1?

For technical support, including TLE9835QXXUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLE9835QXXUMA1 requirements.

6.How does Aetrix verify that TLE9835QXXUMA1 is sourced from the original manufacturer or authorized distributors?

All TLE9835QXXUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLE9835QXXUMA1 meets industry standards.

7.What is the process for return or replacement of TLE9835QXXUMA1?

All TLE9835QXXUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TLE9835QXXUMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLE9835QXXUMA1 part is unused and in its original packaging.

Return procedure for TLE9835QXXUMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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