Vishay General Semiconductor - Diodes Division TMPG06-33HE3/54
- Part No.:
- TMPG06-33HE3/54
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- MPG06, Axial
- Datasheet:
-
TMPG06-33HE3/54.pdf
- Description:
- TVS DIODE 26.8VWM 47.7VC MPG06
- Quantity:
- Payment:

- Shipping:

Inventory:2,818
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMPG06-33HE3/54 from Vishay General Semiconductor is a unidirectional transient voltage suppressor (TVS) diode designed for robust overvoltage protection in automotive and industrial power rails and signal lines. It features a 31.4 V to 34.7 V breakdown voltage (VBR), 28.2 V stand-off voltage (VWM), 400 W peak pulse power (10/1000 μs), 45.7 V clamping voltage at 8.8 A peak pulse current, and AEC-Q101 qualification for automotive-grade reliability.
For engineers reviewing the TMPG06-33HE3/54 datasheet, TMPG06-33HE3/54 pinout, TMPG06-33HE3/54 application, or TMPG06-33HE3/54 equivalent, key selection criteria include clamping performance under 10/1000 μs transients, unidirectional polarity compatibility with DC-biased lines, high-temperature operation up to +185 °C junction, and RoHS-compliant, whisker-tested matte tin terminations.
Technical Context
This TVS diode operates as a shunt-clamping device that remains non-conductive below VWM = 28.2 V and rapidly avalanches above VBR (min 31.4 V) to limit transient voltages. Its low incremental resistance and sub-nanosecond response time ensure effective suppression of ESD, load dump, and inductive switching spikes.
The device is rated for 40 A non-repetitive forward surge current (8.3 ms half-sine), dissipates 1.0 W continuously on an infinite heatsink, and maintains stable clamping up to +150 °C ambient due to its +0.098 %/°C VBR temperature coefficient and 185 °C max junction temperature rating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBR (min/max) | 31.4 V / 34.7 V - Ensures reliable turn-on above normal operating voltage while avoiding false triggering |
| VWM | 28.2 V - Maximum continuous reverse working voltage before leakage exceeds 1 μA |
| VC @ IPPM | 45.7 V at 8.8 A - Clamped voltage during 10/1000 μs transient; defines worst-case stress on protected IC |
| PPPM | 400 W - Peak pulse power handling capability per standard 10/1000 μs waveform |
| IFSM | 40 A - Withstands 8.3 ms single half-sine surge without degradation |
| TJ max | +185 °C - Enables use in under-hood automotive environments and high-power industrial enclosures |
| Polarity | Unidirectional - Suitable only for DC-biased circuits where reverse conduction must be blocked |
Pinout & Package
Package: MPG06 - Molded epoxy case with matte tin-plated leads, UL 94 V-0 rated, 0.100" (2.54 mm) lead pitch, 1.0" minimum tape reel length.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point during clamping | Connected to lower-potential side (e.g., ground or return path) in unidirectional configuration |
| Cathode | Reverse-biased terminal; marked by color band | Connected to protected line (e.g., 24 V rail or sensor output); avalanche occurs when cathode-to-anode voltage exceeds VBR |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive applications including engine control, body electronics, and ADAS power domains |
| HE3 suffix | Meets JESD 201 Class 2 whisker resistance - critical for long-term solder joint integrity in thermal cycling environments |
| Low clamping ratio (VC/VBR ≈ 1.42) | Minimizes voltage overshoot during transients, reducing risk of downstream IC latch-up or damage |
| High-temperature stability | Specified performance maintained from –65 °C to +185 °C junction; VBR drift ≤ ±10 % across full range |
| Solderability | Matte tin leads compliant with J-STD-002 and JESD 22-B102; withstands 275 °C solder dip for 10 s |
Applications
| Automotive Power Rail Protection | Industrial Sensor Interface Protection |
|---|---|
Use Scenario: Protecting 24 V supply lines in vehicle ECUs against ISO 7637-2 load dump pulses and alternator overshoot. IC Role / Device Role: Shunt clamping TVS placed between battery rail and ground, upstream of DC/DC converters and microcontrollers. Use Value: Limits transient voltage to ≤45.7 V, preventing damage to 36 V-rated input stages and ensuring ASIL-B system continuity. |
Use Scenario: Safeguarding analog outputs of pressure/temperature sensors in factory automation PLC modules exposed to motor drive noise. IC Role / Device Role: Unidirectional TVS connected across sensor output and ground to clamp fast-rising EFT bursts (IEC 61000-4-4). Use Value: Maintains signal integrity below 28.2 V standby, responds within <1 ns to suppress >1 kV transients without affecting 4–20 mA loop accuracy. |
| Telecom DC Feeder Protection | Consumer Appliance Motor Drive Protection |
Use Scenario: Shielding PoE-powered network switches from lightning-induced surges on 48 V DC feeder lines. IC Role / Device Role: Primary-level TVS on input stage, coordinated with secondary GDT or MOV for staged energy absorption. Use Value: Handles 400 W peak pulse without thermal runaway; enables compact layout due to MPG06's 0.218 g weight and tape-and-reel compatibility. |
Use Scenario: Suppressing back-EMF spikes from brushed DC motors in smart home appliances (e.g., vacuum cleaners, washing machines). IC Role / Device Role: Mounted across motor terminals to clamp inductive kickback during MOSFET commutation. Use Value: Withstands 40 A surge (8.3 ms) and operates reliably at +125 °C ambient inside sealed motor housings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient voltage suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ33A | Lower PPPM (400 W same), but higher VC = 53.3 V at 7.5 A; SMA package (smaller footprint, lower thermal mass) | Limited to lower-energy transients; less suitable for sustained load dump events requiring high IPPM margin | Select when board space is constrained and peak clamping voltage tolerance allows ≥53 V |
| SMCJ33A | Same VBR/VWM, but higher PPPM = 1500 W and VC = 53.3 V at 28.3 A; larger SMC package | Better for high-energy threats (e.g., ISO 16750-2 jump start), but requires more PCB area and thermal relief | Choose when system-level testing demands >400 W surge immunity and layout permits SMC footprint |
Compared with SMAJ33A and SMCJ33A, the TMPG06-33HE3/54 delivers optimal balance of AEC-Q101 compliance, MPG06 mechanical robustness, and precise 45.7 V clamping-making it preferred for automotive and industrial designs where qualification, lead strength, and predictable voltage limiting are prioritized over raw power rating or miniaturization.
Availability
TMPG06-33HE3/54 is available at Aetrix Electronics and suitable for automotive power distribution, industrial sensor interfaces, telecom DC feeders, and consumer appliance motor drives requiring stable component supply and long-term lifecycle support.
Supply support for TMPG06-33HE3/54 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, MOSFETs, and protection devices with emphasis on reliability, high-temperature operation, and automotive qualification.
The TMPG06 series belongs to Vishay's PAR® (Protection and Regulation) TVS family, engineered specifically for high-reliability transient suppression in harsh environments-including under-hood automotive, industrial controls, and infrastructure equipment.
FAQ
What is the maximum clamping voltage of the TMPG06-33HE3/54 under standard test conditions?
The TMPG06-33HE3/54 has a maximum clamping voltage (VC) of 45.7 V when subjected to its rated peak pulse current of 8.8 A using the 10/1000 μs waveform. This value is measured per JEDEC standards and represents the upper bound of voltage seen by downstream circuitry during a defined transient event. The TMPG06-33HE3/54 achieves this clamping performance while maintaining low incremental resistance and stable behavior across temperature.
Is the TMPG06-33HE3/54 suitable for automotive applications?
Yes, the TMPG06-33HE3/54 is AEC-Q101 qualified and explicitly rated for automotive use, including engine control units, body electronics, and ADAS subsystems. Its operating junction temperature range of –65 °C to +185 °C, HE3 whisker-resistant terminations, and compliance with load dump and EFT immunity requirements make it appropriate for under-hood and chassis-mounted deployments. The TMPG06-33HE3/54 meets these requirements without derating in typical automotive thermal profiles.
What does the "HE3" suffix indicate in TMPG06-33HE3/54?
"HE3" denotes Vishay's standardized packaging and qualification level: RoHS-compliant construction, AEC-Q101 qualification, and JESD 201 Class 2 whisker resistance for matte tin leads. This ensures long-term solder joint reliability under thermal cycling and vibration-critical for automotive and industrial applications. The TMPG06-33HE3/54 carries this suffix to confirm conformance to all three requirements, not just RoHS or qualification alone.
Can the TMPG06-33HE3/54 be used in bidirectional configurations?
No, the TMPG06-33HE3/54 is unidirectional only, as confirmed in its official datasheet. It conducts in reverse avalanche mode above VBR but blocks forward current beyond its 3.5 V forward voltage at 25 A. For bidirectional protection (e.g., AC lines or differential signals), a separate symmetric TVS pair or a dedicated bidirectional part such as SMBJ33CA must be used. The TMPG06-33HE3/54 must be oriented with its cathode band toward the protected line.
What is the thermal derating behavior of the TMPG06-33HE3/54 above 25 °C ambient?
The TMPG06-33HE3/54 follows a linear power derating curve starting at 25 °C: its 1.0 W steady-state power dissipation decreases by approximately 0.75% per °C rise in lead temperature (TL), reaching zero at TL = 175 °C. Derating is based on thermal resistance from junction to lead (RθJL) and applies to continuous DC or low-duty-cycle operation-not transient clamping. The TMPG06-33HE3/54 retains full 400 W pulse capability regardless of ambient, as pulse energy is too brief for significant thermal accumulation.
TMPG06-33HE3/54 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- MPG06, Axial
- Series:
- eSMP®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 26.8V
- Voltage - Breakdown (Min):
- 29.7V
- Voltage - Clamping (Max) @ Ipp:
- 47.7V
- Current - Peak Pulse (10/1000µs):
- 8.4A
- Power - Peak Pulse:
- 400W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -65°C ~ 185°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Through Hole
- Supplier Device Package:
- MPG06
TMPG06-33HE3/54 FAQ
1.How can I place an order for TMPG06-33HE3/54 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMPG06-33HE3/54 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMPG06-33HE3/54 reliable?
The price and inventory of TMPG06-33HE3/54 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMPG06-33HE3/54 is usually 5 days.
3.What payment methods are accepted for TMPG06-33HE3/54?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMPG06-33HE3/54 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMPG06-33HE3/54?
TMPG06-33HE3/54 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMPG06-33HE3/54 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMPG06-33HE3/54?
For technical support, including TMPG06-33HE3/54 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMPG06-33HE3/54 requirements.
6.How does Aetrix verify that TMPG06-33HE3/54 is sourced from the original manufacturer or authorized distributors?
All TMPG06-33HE3/54 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMPG06-33HE3/54 meets industry standards.
7.What is the process for return or replacement of TMPG06-33HE3/54?
All TMPG06-33HE3/54 units undergo pre-shipment inspection (PSI). If there is an issue with TMPG06-33HE3/54, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMPG06-33HE3/54 part is unused and in its original packaging.
Return procedure for TMPG06-33HE3/54:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMPG06-33HE3/54 Tags

-
ESD9B5.0ST5G
onsemi

-
DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

