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Texas Instruments TPS2147IDGQR

Part No.:
TPS2147IDGQR
Manufacturer:
Texas Instruments
Category:
Power Management - Specialized
Package:
10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixTPS2147IDGQR.pdf
Description:
IC 3.3V LDO/DUAL SWITCH 10-MSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,331

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Product details

Overview

TPS2147IDGQR from Texas Instruments is a dual-channel power-distribution switch with integrated 3.3-V/200-mA fixed-output LDO, configured as two independent high-side N-channel MOSFETs (340-mΩ typical RDS(on)) and an LDO sharing VIN/SWIN1 input. It delivers 150 mA per switch output and 200 mA LDO output across 2.9–5.5 V input, with independent thermal/short-circuit protection - used in USB 2.0 bus-powered hubs and portable electronics power segmentation.

For engineers reviewing the TPS2147IDGQR datasheet, TPS2147IDGQR pinout, TPS2147IDGQR application, or TPS2147IDGQR equivalent, key selection criteria include its MSOP-10 package, active-low enable logic for both switches, 3.3-V fixed LDO with 0.35-V dropout, overcurrent flag timing (5.5 ms assertion delay), and independent fault isolation for OUT1/OUT2/LDO.

Technical Context

The TPS2147IDGQR integrates two current-limited high-side switches and a fixed 3.3-V LDO in a single die, with each switch featuring independent CMOS/TTL-compatible active-low EN inputs and open-drain OC status outputs. Its internal charge pump drives MOSFET gates without external components, enabling controlled rise/fall times (0.1–6 ms) and minimizing inrush surges.

Each switch provides 150 mA continuous output with 340-mΩ typical on-resistance at 25°C and 580-mΩ max over temperature; the LDO maintains ±3% regulation (3.20–3.40 V) at 200 mA load with 50 dB PSRR at 1 kHz. Undervoltage lockout (2.2–2.85 V threshold) and dual-threshold thermal shutdown (120°C first trip, 155°C second trip) operate independently per channel.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 2.9 V to 5.5 V - supports USB 2.0 bus power and common Li-ion battery rails without external regulation.
Switch Output Current 150 mA continuous per channel - sufficient for USB peripherals like keyboards, headsets, and zip drives.
LDO Output Fixed 3.3 V ±3% at 200 mA - eliminates need for external feedback resistors and simplifies layout for core I/O rail generation.
RDS(on) 340 mΩ typical at 25°C - limits voltage drop to ≤51 mV at 150 mA, reducing heat generation and improving efficiency.
Dropout Voltage 0.35 V at 200 mA - enables stable 3.3-V output even when input drops to 3.65 V, critical for brownout resilience.
OC Assertion Delay 5.5 ms - filters transient inrush currents (e.g., hot-plug capacitive loads) to prevent false fault reporting.
Thermal Shutdown Threshold 120°C (per switch) - isolates faulty channel while preserving operation of healthy switch and LDO.

Pinout & Package

TPS2147IDGQR is housed in a thermally enhanced 10-pin MSOP (DGQ) package with exposed thermal pad (PowerPAD™), optimized for compact USB hub and portable electronics PCB layouts.

Pin/Terminal Circuit Role Design Meaning
1: OUT1 Switch 1 output High-side switched 3.3-V or input-derived power for peripheral load; current-limited to 150 mA.
2: VIN/SWIN1 Primary input / LDO & Switch 1 supply Shared input for LDO and first switch; must be ≥2.9 V; powers internal charge pump and regulator.
3: SWIN2 Switch 2 input Dedicated input for second high-side switch; supports independent power domain segmentation.
4: LDO_OUT LDO regulated output Fixed 3.3-V supply rail; requires ≥4.7 µF output capacitor with 200 mΩ–10 Ω ESR for stability.
5: OUT2 Switch 2 output Second independent high-side output; electrically isolated from OUT1 for fault containment.
6: EN1 Active-low enable for OUT1 Logic-low (≤0.8 V) enables Switch 1; compatible with 3-V/5-V CMOS/TTL; pulls up internally.
7: EN2 Active-low enable for OUT2 Independent control of Switch 2; allows staggered power-up or dynamic load management.
8: OC1 Open-drain overcurrent flag for OUT1 Asserts low during overload; includes internal transient filter to suppress false triggers from capacitor inrush.
9: OC2 Open-drain overcurrent flag for OUT2 Independent fault signaling; enables per-channel monitoring without software polling overhead.
10: GND Ground reference Common return for all circuits; connects to PowerPAD™ for optimal thermal conduction to PCB.

Key Features

Feature Design Value
Independent thermal protection per switch Enables fault containment: one shorted output does not disable the other switch or LDO.
Integrated charge pump Eliminates need for external gate-drive components; ensures fast, controlled MOSFET switching (0.1–12 ms).
Undervoltage lockout (UVLO) Prevents erratic behavior below 2.2 V input; hysteresis (260 mV) avoids oscillation near threshold.
Overcurrent transient filtering Built-in 5.5-ms assertion delay rejects brief inrush events (e.g., 100-µF hot-plug), reducing system-level false alarms.
Low quiescent current 75 µA typical supply current - extends battery life in always-on portable applications.

Applications

USB 2.0 Bus-Powered Hub Portable Audio Device Power

Use Scenario: Powering multiple low-power peripherals (keyboard, headset, flash drive) from a single USB upstream port.

IC Role / Device Role / Timing Role: Dual-switch + LDO provides three independent, current-limited, fault-isolated rails: one for hub logic (LDO), two for downstream ports (OUT1/OUT2).

Use Value: Meets USB 2.0 bus-powered hub requirements with <60% board space reduction versus discrete solutions.

Use Scenario: Managing power domains in Bluetooth speakers or portable headphones with separate DSP, codec, and amplifier sections.

IC Role / Device Role / Timing Role: LDO supplies clean 3.3-V core logic; OUT1 powers audio codec; OUT2 powers Class-D amplifier - each with independent enable/control.

Use Value: Enables sequenced power-up and per-rail fault shutdown, preventing audio pop/click and protecting sensitive analog circuitry.

DSP Core/I/O Voltage Sequencing PDAs and Handheld Computing

Use Scenario: Supplying core and I/O voltages to a digital signal processor where I/O must power up before core or vice versa.

IC Role / Device Role / Timing Role: LDO delivers stable 3.3-V I/O rail; OUT1/OUT2 provide auxiliary rails; independent ENx pins allow precise timing control via MCU GPIO.

Use Value: Eliminates need for external sequencing ICs or RC delays; supports both pre- and post-power-up sequencing via software control.

Use Scenario: Consolidating power management in legacy PDA designs with multiple low-power subsystems (touchscreen, memory, backlight).

IC Role / Device Role / Timing Role: Acts as central power distributor: LDO for main logic, OUT1 for touchscreen controller, OUT2 for SD card interface.

Use Value: Reduces BOM count and PCB area while maintaining per-rail current limiting and thermal safety for handheld thermal constraints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-switch + fixed-LDO power management applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS2147IDGQT Same silicon, tape-and-reel packaging (vs. cut-tape TPS2147IDGQR); identical electrical specs and pinout. No functional difference; selected for automated SMT assembly requiring reel format. Choose TPS2147IDGQT for volume production with pick-and-place machines; TPS2147IDGQR suits prototyping or low-volume builds.
TPS2157IDGQR Active-high EN1/EN2 logic (vs. active-low in TPS2147IDGQR); otherwise identical switch/LDO specs and pinout. Requires inverted enable signals from host MCU; unsuitable if existing firmware assumes active-low control. Select TPS2157IDGQR only when system-level logic levels mandate active-high enables; verify firmware compatibility before substitution.

Compared with TPS2147IDGQR, TPS2147IDGQT offers identical performance in reel format for production scalability, while TPS2157IDGQR changes enable polarity - requiring hardware or firmware adaptation but enabling direct interface with active-high GPIOs.

Availability

TPS2147IDGQR is available at Aetrix Electronics and suitable for USB peripheral design, portable audio systems, and DSP power sequencing requiring stable component supply, full traceability, and long-term industrial lifecycle support.

Supply support for TPS2147IDGQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power IC design.

The TPS214x family was engineered specifically for space-constrained USB and portable electronics applications, integrating dual power switches and an LDO to replace multi-component discrete solutions while ensuring robust fault protection and thermal resilience.

FAQ

What is the maximum continuous output current per switch in the TPS2147IDGQR?

The TPS2147IDGQR supports 150 mA continuous output current per switch (OUT1 and OUT2) under recommended operating conditions. This rating is maintained across the full −40°C to 85°C ambient temperature range and accounts for thermal derating in the MSOP-10 PowerPAD™ package. The device also features programmable current limiting up to 400 mA for short-circuit protection.

Does the TPS2147IDGQR require external components for LDO stability?

Yes, the TPS2147IDGQR requires a minimum 4.7 µF output capacitor on LDO_OUT with an ESR between 200 mΩ and 10 Ω to ensure loop stability. Solid tantalum, aluminum electrolytic, or multilayer ceramic capacitors meeting this ESR range are acceptable. No external feedback resistors are needed since the LDO is fixed at 3.3 V.

How does the overcurrent protection work on the TPS2147IDGQR switches?

The TPS2147IDGQR uses integrated sense FETs to monitor load current. When current exceeds the limit (200–400 mA), it enters constant-current mode within 5.5 ms and asserts the corresponding OC1 or OC2 open-drain flag. The device remains in current-limit until the fault clears or thermal shutdown activates at 120°C junction temperature.

Can the TPS2147IDGQR be used with a 2.5-V input supply?

No - the TPS2147IDGQR has a minimum input voltage of 2.9 V per its recommended operating conditions. At 2.5 V, the internal undervoltage lockout (UVLO) activates (threshold 2.2–2.85 V), disabling both switches and the LDO. Operation below 2.9 V risks unstable regulation and unguaranteed current limiting.

What is the purpose of the charge pump in the TPS2147IDGQR?

The internal charge pump in the TPS2147IDGQR generates gate drive voltage above VIN to fully enhance the N-channel high-side MOSFETs. This eliminates the need for external boost components, ensures consistent turn-on characteristics across the 2.9–5.5 V input range, and enables controlled rise/fall times (0.1–12 ms) to minimize inrush current.

TPS2147IDGQR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
USB, Peripherals
Current - Supply:
75µA
Voltage - Supply:
2.9V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-HVSSOP

TPS2147IDGQR FAQ

1.How can I place an order for TPS2147IDGQR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS2147IDGQR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS2147IDGQR reliable?

The price and inventory of TPS2147IDGQR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS2147IDGQR is usually 5 days.

3.What payment methods are accepted for TPS2147IDGQR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS2147IDGQR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS2147IDGQR?

TPS2147IDGQR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS2147IDGQR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS2147IDGQR?

For technical support, including TPS2147IDGQR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS2147IDGQR requirements.

6.How does Aetrix verify that TPS2147IDGQR is sourced from the original manufacturer or authorized distributors?

All TPS2147IDGQR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS2147IDGQR meets industry standards.

7.What is the process for return or replacement of TPS2147IDGQR?

All TPS2147IDGQR units undergo pre-shipment inspection (PSI). If there is an issue with TPS2147IDGQR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS2147IDGQR part is unused and in its original packaging.

Return procedure for TPS2147IDGQR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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