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Texas Instruments TPS2157IDGQ

Part No.:
TPS2157IDGQ
Manufacturer:
Texas Instruments
Category:
Power Management - Specialized
Package:
10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixTPS2157IDGQ.pdf
Description:
IC 3.3V LDO/DUAL SWITCH 10-MSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,081

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Product details

Overview

TPS2157IDGQ from Texas Instruments is a dual-channel high-side power-distribution switch with integrated 3.3-V/200-mA fixed-output LDO, housed in a 10-pin MSOP PowerPAD package. It features two 340-mΩ (typ.) N-channel MOSFETs, independent thermal/short-circuit protection per channel, and active-high enable inputs. It is designed for USB 2.0 bus-powered hubs and portable electronics requiring segmented power control and core/I/O voltage sequencing.

For engineers reviewing the TPS2157IDGQ datasheet, TPS2157IDGQ pinout, TPS2157IDGQ application, or TPS2157IDGQ equivalent, key selection considerations include its 2.9–5.5-V input range, 340-mΩ on-resistance at 25°C, 3.3-V LDO with 0.35-V dropout, independent overcurrent flag outputs (OC1/OC2), and MSOP-10 PowerPAD thermal performance for space-constrained designs.

Technical Context

The TPS2157IDGQ integrates two independently controlled high-side N-channel MOSFET switches and a fixed 3.3-V LDO regulator sharing VIN/SWIN1 as primary supply. Each switch employs a charge pump for gate drive, enabling fast turn-on/turn-off (0.1–6 ms) without external components while minimizing inrush current surges.

It implements dual-threshold thermal protection (120°C first trip, 155°C second trip), per-channel overcurrent detection with transient-filtered open-drain OC flags, and undervoltage lockout (~2.2–2.85 V) on both VIN/SWIN1 and SWIN2 inputs - all operating across −40°C to 85°C ambient.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 2.9 V to 5.5 V - supports USB 2.0 bus power (5 V) and low-voltage battery rails (3.3 V).
Switch RDS(on) 340 mΩ (typ. at 25°C) - enables ≤150 mA continuous output per switch with <51 mV conduction loss at 150 mA.
LDO Output Fixed 3.3 V ±3% (200 mA max) - meets USB peripheral logic supply requirements with 0.35-V dropout at full load.
Enable Logic Active-high EN1/EN2 - compatible with 3-V/5-V CMOS/TTL logic; eliminates need for level-shifting in mixed-voltage systems.
Overcurrent Response 5.5 ms OC assertion delay - filters transient inrush (e.g., hot-plug capacitive loads) while reliably detecting sustained faults.
Thermal Protection 120°C first-trip threshold with ~10°C hysteresis - isolates faulty channel without disrupting adjacent power rail.
Package MSOP-10 with PowerPAD - thermally enhanced exposed pad improves junction-to-board thermal resistance for sustained 150-mA loads.

Pinout & Package

TPS2157IDGQ uses a 10-pin MSOP (DGQ) package with an exposed thermal pad (PowerPAD™). The package measures 3.0 mm × 3.0 mm × 1.0 mm and requires soldering of the exposed pad to PCB ground plane for optimal thermal performance.

Pin/Terminal Circuit Role Design Meaning
1: OUT1 Switch 1 output High-side switched 3.3-V or input-derived power output; current-limited to 150 mA continuous.
2: VIN/SWIN1 LDO + Switch 1 input Primary supply input for internal LDO and Switch 1; also serves as LDO input reference (2.9–5.5 V).
3: SWIN2 Switch 2 input Dedicated input for second high-side switch; supports independent sourcing (e.g., auxiliary rail or backup supply).
4: LDO_OUT LDO regulated output Stable 3.3-V output (200 mA max); used for logic cores, USB PHYs, or low-noise analog circuitry.
5: OUT2 Switch 2 output Second independently controlled high-side output; shares same protection and timing specs as OUT1.
6: EN1 Switch 1 enable (active high) CMOS/TTL-compatible input; asserts OUT1 when pulled ≥2 V; sinks 5 µA when high.
7: EN2 Switch 2 enable (active high) Independent enable for OUT2; identical electrical specs to EN1.
8: OC1 Switch 1 overcurrent flag Open-drain output asserted low during overcurrent; requires external pull-up for system fault monitoring.
9: OC2 Switch 2 overcurrent flag Independent open-drain flag for OUT2; enables per-rail fault isolation in multi-load systems.
10: GND Ground reference Common return for LDO, switches, and logic; must be connected to thermal pad for thermal integrity.

Key Features

Feature Design Value
Integrated dual high-side switches + LDO Reduces board space by up to 60% vs. discrete solutions; eliminates need for external LDO, FET drivers, and current-sense resistors.
Per-channel thermal & short-circuit protection Enables fault containment: one failed channel (e.g., shorted peripheral) does not disable other power rails or LDO output.
Transient-filtered overcurrent flags (OC1/OC2) Internal deglitch (5.5 ms assertion / 10.5 ms deassertion) prevents false triggers from hot-plug inrush, eliminating external RC filters.
Charge-pump gate drive Eliminates external bootstrap components; ensures fast, controlled MOSFET switching (0.1–12 ms) with minimal EMI.
Undervoltage lockout on both inputs Prevents erratic operation below 2.2 V on VIN/SWIN1 or SWIN2 - critical for stable USB enumeration and brownout recovery.

Applications

USB 2.0 Bus-Powered Hub Portable Audio System

Use Scenario: Powering multiple downstream USB peripherals (keyboard, headset, Zip drive) from a single upstream USB port.

IC Role / Device Role: Dual-switch + LDO provides isolated 5-V distribution to each port and clean 3.3-V supply for hub controller logic.

Use Value: Meets USB 2.0 hub power budget constraints while enabling per-port overcurrent detection and automatic fault isolation.

Use Scenario: Managing power to DAC, headphone amp, and microSD interface in a PDA or Bluetooth speaker.

IC Role / Device Role: OUT1 powers noise-sensitive audio DAC (via LDO_OUT), OUT2 supplies SD card slot, SWIN2 enables battery backup path.

Use Value: Independent enable/control allows dynamic power gating; LDO's 50 dB PSRR at 1 kHz suppresses switching noise from digital subsystems.

DSP Core/I/O Sequencing Industrial Sensor Node

Use Scenario: Sequencing power to DSP core (1.2 V), I/O (3.3 V), and analog front-end (2.5 V) in embedded signal processing equipment.

IC Role / Device Role: LDO_OUT supplies 3.3-V I/O domain; OUT1/OUT2 drive external DC/DC enables or LDOs for other rails via controlled ramp timing.

Use Value: Active-high EN1/EN2 allow precise GPIO-controlled sequencing; OC flags provide real-time fault feedback to host MCU.

Use Scenario: Powering wireless transceiver, temperature sensor, and EEPROM in a battery-operated environmental monitor.

IC Role / Device Role: OUT1 powers RF module (enabling/disabling during sleep), OUT2 drives sensor array, LDO_OUT supplies precision ADC reference.

Use Value: Low 75-µA quiescent current extends battery life; thermal shutdown (120°C) protects against enclosure overheating in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-switch + LDO power management applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS2147IDGQ Same MSOP-10 package and 3.3-V LDO, but uses active-low EN1/EN2 inputs. Requires inverted logic control signals; unsuitable where MCU GPIOs are limited to active-high drive. Select TPS2147IDGQ only if system-level enable logic is n-active; otherwise TPS2157IDGQ avoids level-shifter overhead.
TPD3S014RTER USB port protector with integrated 1.5-A switch and 5-V LDO; no dual-switch architecture or 3.3-V LDO option. Designed for USB data-line ESD + power switching; lacks independent OUT2 and LDO_EN functionality. Use TPD3S014RTER only for USB Type-A port protection with higher current; TPS2157IDGQ is superior for multi-rail sequencing.

Compared with TPS2147IDGQ, TPS2157IDGQ simplifies control logic by eliminating external inverters; compared with TPD3S014RTER, it delivers true dual-rail independence and lower LDO dropout for 3.3-V logic domains - making it optimal for compact, multi-peripheral USB hubs and portable DSP systems.

Availability

TPS2157IDGQ is available at Aetrix Electronics and suitable for USB 2.0 hubs, portable audio systems, and DSP power sequencing applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TPS2157IDGQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in high-reliability power delivery solutions.

The TPS21xx family was designed specifically for space-constrained USB and portable electronics, integrating dual power switches and LDOs to replace discrete FETs, drivers, and regulators - reducing BOM count and improving thermal robustness.

FAQ

What is the maximum continuous output current per switch in the TPS2157IDGQ?

The TPS2157IDGQ supports 150 mA continuous output current per switch (OUT1 and OUT2) under recommended operating conditions. This rating assumes proper thermal management via the MSOP-10 PowerPAD and ambient temperatures ≤85°C. The device internally limits current to 200–400 mA depending on junction temperature, but sustained operation above 150 mA requires careful thermal design per the dissipation rating table.

Does the TPS2157IDGQ require external components for LDO stability?

Yes, the TPS2157IDGQ requires a minimum 4.7-µF output capacitor on LDO_OUT with ESR between 200 mΩ and 10 Ω for loop stability. Solid tantalum, aluminum electrolytic, or multilayer ceramic capacitors meeting this ESR range are acceptable. A 0.1-µF ceramic bypass capacitor close to LDO_OUT is also recommended to improve high-frequency noise rejection.

How does the overcurrent flag (OC1/OC2) behave during capacitor inrush?

The TPS2157IDGQ incorporates an internal transient filter that delays OC assertion by 5.5 ms and OC deassertion by 10.5 ms. This prevents false triggering from typical hot-plug inrush currents (e.g., charging 100-µF downstream caps), eliminating the need for external RC filtering. The OC pins remain low only during sustained overcurrent events exceeding the 200–400 mA limit.

Can the TPS2157IDGQ operate with input voltages below 3.0 V?

Yes - the TPS2157IDGQ operates from 2.9 V to 5.5 V on both VIN/SWIN1 and SWIN2. However, at 2.9 V input, the 3.3-V LDO cannot regulate (dropout = 0.35 V requires ≥3.65 V input), so LDO_OUT will track VIN/SWIN1 minus drop. The switches remain functional down to 2.9 V, supporting brownout-tolerant peripheral power control.

What is the thermal shutdown behavior of the TPS2157IDGQ?

The TPS2157IDGQ features dual-threshold thermal protection: a first trip at ~120°C disables only the overloaded switch (or LDO), allowing the other channel to remain operational; a second trip at ~155°C shuts down all functions. After cooling by ~10°C, the tripped channel automatically recovers - enabling self-resetting fault handling without system reset.

TPS2157IDGQ Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
Packaging:
Tube
Product Status:
Obsolete
Applications:
USB, Peripherals
Current - Supply:
75µA
Voltage - Supply:
2.9V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-HVSSOP

TPS2157IDGQ FAQ

1.How can I place an order for TPS2157IDGQ through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS2157IDGQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS2157IDGQ reliable?

The price and inventory of TPS2157IDGQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS2157IDGQ is usually 5 days.

3.What payment methods are accepted for TPS2157IDGQ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS2157IDGQ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TPS2157IDGQ?

TPS2157IDGQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS2157IDGQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS2157IDGQ?

For technical support, including TPS2157IDGQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS2157IDGQ requirements.

6.How does Aetrix verify that TPS2157IDGQ is sourced from the original manufacturer or authorized distributors?

All TPS2157IDGQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS2157IDGQ meets industry standards.

7.What is the process for return or replacement of TPS2157IDGQ?

All TPS2157IDGQ units undergo pre-shipment inspection (PSI). If there is an issue with TPS2157IDGQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS2157IDGQ part is unused and in its original packaging.

Return procedure for TPS2157IDGQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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