Texas Instruments TPS23730RMTR
- Part No.:
- TPS23730RMTR
- Manufacturer:
- Texas Instruments
- Category:
- Power Over Ethernet (PoE) Controllers
- Package:
- 45-VFQFN Exposed Pad
- Datasheet:
-
TPS23730RMTR.pdf
- Description:
- IEEE 802.3BT TYPE-3 CLASS 1-6 PO
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TPS23730 from Texas Instruments is an IEEE 802.3bt Type 3 PoE powered device (PD) interface with integrated current-mode DC-DC controller for flyback and active clamp forward topologies. It delivers up to 60 W input power, features a 0.3-Ω (typ) hotswap MOSFET, supports primary-side regulation (PSR), and operates across –40°C to 125°C junction temperature. It is used in PoE-powered security cameras requiring robust MPS, low-noise power conversion, and dual-power feed support.
For engineers reviewing the TPS23730 datasheet, TPS23730 pinout, TPS23730 application, or TPS23730 equivalent, key selection criteria include IEEE 802.3bt Class 1–6 compliance, PSR-enabled flyback efficiency, automatic MPS behavior under auxiliary power detection, soft-stop shutdown for FET stress reduction, and VQFN-45 package thermal performance with dual thermal pads.
Technical Context
The TPS23730 integrates two tightly coupled subsystems: a PoE PD interface compliant with IEEE 802.3bt Type 3 (up to 51 W at PD input, scalable to 60 W with margin), and a current-mode DC-DC controller supporting both flyback (with PSR or optocoupler feedback) and active clamp forward configurations. Its PoE section includes programmable classification (CLSA/CLSB), allocated power indication (TPH/TPL), and auto-stretching Maintain Power Signature (MPS).
The DC-DC controller operates at 223–273 kHz (typ 250 kHz), supports CCM operation, provides ±1.5% load regulation at 5 V output with synchronous rectification, and includes slope compensation, blanking, soft-start/soft-stop, frequency dithering (SSFD), and dead-time control (DT). It uses dual thermal pads (PAD_G to RTN, PAD_S to VSS) for enhanced thermal dissipation in high-power PoE applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IEEE Standard | Compliant with IEEE 802.3bt Type 3 (Class 1–6); enables up to 51 W PoE input, extendable to 60 W system-level operation. |
| Hotswap RDS(on) | 0.3 Ω (typ); reduces conduction loss and thermal stress during inrush and steady-state PoE operation. |
| DC-DC Switching Frequency | 223–273 kHz (typ 250 kHz); balances EMI, transformer size, and efficiency in flyback/ACF designs. |
| Load Regulation | ±1.5% (typ, 5-V output, 0–100% load); achieved with PSR + sync FET, enabling stable multi-output rails without optocoupler. |
| Junction Temperature Range | –40°C to 125°C; supports industrial and outdoor deployments including security cameras and access points. |
| Package Thermal Resistance | RθJC(bot_DCDC) = 9.1°C/W (PAD_G), RθJC(bot_POE) = 3.9°C/W (PAD_S); enables high-power density layout with localized heat spreading. |
| MPS Auto-Adjustment | Automatically scales pulsed current amplitude/duration based on PSE type and load current; maintains signature without external timing components. |
Pinout & Package
VQFN-45 package (7.00 mm × 5.00 mm) with exposed thermal pads: PAD_G connected to RTN (DC-DC ground reference), PAD_S connected to VSS (PoE return). Dual-pad construction separates PoE and DC-DC thermal paths for optimized board-level heat management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RTN (Pins 7, 8, 9, 45) | PoE output return / DC-DC reference ground | Common return for hotswap FET source and DC-DC controller analog/digital ground; must be low-impedance plane tied to PAD_S. |
| VDD (Pin 23) | PoE input rail | Accepts 0–60 V PoE input; requires 0.1 µF bypass to VSS and TVS protection per IEEE spec. |
| DEN (Pin 24) | Detection signature enable | 25.5 kΩ pull-up to VDD generates IEEE-compliant 25-kΩ detection signature; pulled low disables hotswap. |
| CLSA / CLSB (Pins 21, 20) | Classification current programming | Resistor-to-RTN sets Class A/B signature current (1.9–42 mA); enables full Class 1–6 support. |
| TPH / TPL (Pins 13, 14) | Allocated power indicator outputs | Open-drain, active-low parallel binary code (or serial via SCDIS) indicating PSE-assigned power level (e.g., 30 W, 45 W, 60 W). |
| GATE / GAT2 (Pins 43, 41) | Main & secondary FET gate drivers | GATE drives primary switch (flyback/ACF); GAT2 supports active clamp or synchronous rectifier; both support adjustable dead time (DT pin). |
| FB / COMP / PSRS / CP (Pins 34, 35, 39, 44) | Primary-side regulation loop | PSR feedback path: CP clamps auxiliary winding; FB senses reflected voltage; PSRS enables sync; COMP interfaces error amplifier or optocoupler. |
| SST / I_STP (Pins 33, 32) | Soft-start & soft-stop timing control | SST capacitor sets startup/hiccup rate; I_STP resistor independently programs soft-stop discharge current-critical for FET BOM cost reduction. |
| LINEUV (Pin 38) | Bulk capacitor undervoltage monitor | Triggers soft-stop when bulk voltage falls below 2.918 V (typ); prevents uncontrolled shutdown during adapter switchover or brownout. |
| APD / PPD (Pins 5, 19) | Auxiliary power detection inputs | APD disables PoE pass FET above 1.5 V; PPD enables hotswap above 2.5 V-enables seamless primary/auxiliary power priority logic. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated IEEE 802.3bt Type 3 PD + DC-DC controller | Single-chip solution eliminates discrete PoE interface + controller coordination; reduces BOM count and layout complexity in space-constrained endpoints. |
| Primary-side regulation (PSR) with CP/FB/PSRS pins | Removes need for shunt regulator and optocoupler in flyback designs-reducing cost, improving reliability, and simplifying safety certification. |
| Programmable spread-spectrum frequency dithering (SSFD) | DTHR pin controls modulation depth/frequency; lowers peak EMI by >10 dB, reducing filter component count and board area. |
| Soft-stop shutdown with independent I_STP control | Gradually discharges VCC during fault/undervoltage events; minimizes voltage spikes and FET stress-enabling lower-voltage, lower-cost MOSFETs. |
| Auto-adjusting Maintain Power Signature (MPS) | Self-tunes pulse amplitude/duration to PSE type (Type 2/3/4) and load current; ensures reliable power maintenance in low-power sleep modes and multi-feed systems. |
| Dual thermal pad architecture (PAD_G/PAD_S) | Separates DC-DC and PoE thermal paths; achieves RθJC as low as 3.9°C/W (PoE side), enabling sustained 60-W operation in compact enclosures. |
Applications
| Video Surveillance Cameras | Enterprise Wi-Fi Access Points |
|---|---|
Use Scenario: Outdoor PTZ camera with IR illumination, video streaming, and motion analytics running on single PoE cable. IC Role / Device Role: PoE PD interface + primary DC-DC controller managing 12-V motor drive, 5-V SoC rail, and 3.3-V sensor rail. Use Value: PSR flyback eliminates optocoupler, reducing height and creepage requirements; soft-stop prevents image corruption during brownout recovery. |
Use Scenario: Dual-band 802.11ax AP with integrated Bluetooth and IoT radio, drawing >40 W under peak traffic. IC Role / Device Role: IEEE 802.3bt Type 3 PD managing power allocation, thermal derating, and seamless failover between PoE and local adapter. Use Value: TPH/TPL binary encoding reports real-time PSE-assigned power to firmware; auto-MPS maintains link during deep sleep without external timers. |
| VoIP Phones with Display & USB | Pass-Through PoE Switches |
Use Scenario: Gigabit VoIP phone with color LCD, speakerphone, and USB-C peripheral charging port. IC Role / Device Role: PoE PD providing isolated 5-V/3-A USB power and regulated 3.3-V/1.2-V rails for codec and display driver. Use Value: Integrated 0.3-Ω hotswap FET handles inrush without external limiting; SSFD meets CISPR-32 Class B EMI limits in shared office environments. |
Use Scenario: 4-port midspan injector supporting downstream PoE+ devices while accepting upstream PoE input. IC Role / Device Role: Primary PD controller managing input power budgeting, thermal headroom, and redundant feed arbitration (PoE + adapter). Use Value: APD/PPD priority logic enables automatic switchover to local adapter during upstream PoE failure; dual thermal pads sustain 60-W continuous operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PoE PD controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS23731 | Supports only Class 1–4 (≤30 W), no ACF topology support, same PSR and SSFD features. | Limited to lower-power VoIP phones and basic sensors; cannot meet 60-W or active clamp forward requirements. | Select TPS23731 only when PoE budget ≤30 W and ACF is not required-reduces cost and complexity where full Type 3 capability is unnecessary. |
| TPS23734 | Supports Class 1–4 and ACF, but lacks PPD input and parallel/serial TPH/TPL encoding; uses T2P/APDO instead. | Designed for fixed-function ACF-based lighting or industrial controllers; no auxiliary adapter priority logic or flexible power reporting. | Choose TPS23734 for ACF-specific designs needing higher efficiency than flyback, but avoid if system requires APD/PPD switchover or IEEE-mandated TPH/TPL signaling. |
Compared with TPS23731 and TPS23734, the TPS23730 uniquely combines full IEEE 802.3bt Type 3 (Class 1–6) support, ACF topology capability, dual-power feed priority (APD/PPD), and flexible TPH/TPL reporting-making it the only option for 60-W, field-upgradeable, multi-source PoE endpoints.
Availability
TPS23730 is available at Aetrix Electronics and suitable for video surveillance, enterprise Wi-Fi infrastructure, and industrial IoT edge nodes requiring stable component supply, long-term lifecycle assurance, and design-in support for IEEE 802.3bt-compliant systems.
Supply support for TPS23730 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of leadership in PoE innovation and industrial-grade IC design.
The TPS23730 belongs to TI's PoE PD controller product line, engineered specifically for high-efficiency, thermally robust, and standards-compliant powered devices in demanding 60-W applications such as security cameras and wireless infrastructure.
FAQ
What is the maximum input power supported by the TPS23730?
The TPS23730 supports IEEE 802.3bt Type 3 operation with up to 51 W delivered at the PD input, and is designed for system-level operation up to 60 W. Its 0.3-Ω (typ) hotswap MOSFET, robust thermal design (RθJC(bot_POE) = 3.9°C/W), and 100-V absolute max rating enable reliable 60-W handling when paired with appropriate magnetics and PCB layout.
Does the TPS23730 support primary-side regulation (PSR) in flyback designs?
Yes, the TPS23730 fully supports PSR in flyback configurations using its dedicated PSRS, CP, FB, and COMP pins. The PSR loop eliminates the need for an optocoupler and TLV431 shunt regulator-reducing bill-of-materials cost, improving reliability, and simplifying safety isolation certification for the TPS23730-based design.
How does the TPS23730 handle auxiliary power adapter integration?
The TPS23730 uses APD and PPD inputs to manage auxiliary power priority: raising APD above 1.5 V disables the PoE hotswap FET and turns off classification, while asserting PPD above 2.5 V enables the FET and activates TPH/TPL. This allows seamless switchover between PoE and local adapter without firmware intervention-critical for redundant power feeds in the TPS23730 application.
What is the purpose of the dual thermal pads (PAD_G and PAD_S) on the TPS23730 VQFN package?
PAD_G connects to RTN and serves the DC-DC controller's thermal path, while PAD_S connects to VSS and serves the PoE hotswap circuit. This separation enables independent thermal management: RθJC(bot_DCDC) = 9.1°C/W and RθJC(bot_POE) = 3.9°C/W. In practice, this allows the TPS23730 to sustain 60-W operation without thermal throttling when both pads are properly soldered to large copper areas.
Can the TPS23730 be used in active clamp forward (ACF) topologies?
Yes, the TPS23730 explicitly supports ACF configurations via its GAT2 gate driver output, DT pin for dead-time control, and current-sense (CS) and COMP interfaces. Unlike the TPS23731, the TPS23730 includes full ACF enablement-making it suitable for high-efficiency, high-density 60-W PoE power supplies where ACF outperforms flyback in efficiency and EMI performance.
TPS23730RMTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 45-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Controller (PD), DC/DC
- Number of Channels:
- 1
- Power - Max:
- 60 W
- Internal Switch(s):
- Yes
- Auxiliary Sense:
- Yes
- Standards:
- 802.3at (PoE+), 802.3bt
- Voltage - Supply:
- 0V ~ 60V
- Current - Supply:
- 20mA
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 45-VQFN (7x5)
TPS23730RMTR FAQ
1.How can I place an order for TPS23730RMTR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS23730RMTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS23730RMTR reliable?
The price and inventory of TPS23730RMTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS23730RMTR is usually 5 days.
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TPS23730RMTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS23730RMTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS23730RMTR?
For technical support, including TPS23730RMTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS23730RMTR requirements.
6.How does Aetrix verify that TPS23730RMTR is sourced from the original manufacturer or authorized distributors?
All TPS23730RMTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS23730RMTR meets industry standards.
7.What is the process for return or replacement of TPS23730RMTR?
All TPS23730RMTR units undergo pre-shipment inspection (PSI). If there is an issue with TPS23730RMTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS23730RMTR part is unused and in its original packaging.
Return procedure for TPS23730RMTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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