Texas Instruments TPS2376DDAR-H

Overview

TPS2376DDAR-H from Texas Instruments is an IEEE 802.3af-compliant powered device (PD) controller with integrated 0.58-Ω low-side MOSFET, 600-mA operational current limit, adjustable inrush current limiting (via ILIM pin), and true open-drain power-good output referenced to RTN. It enables 26-W PoE designs over 100 m of CAT-5 cable from a 52-V minimum PSE supply and supports industrial temperature range (–40°C to 85°C).

For engineers reviewing the TPS2376DDAR-H datasheet, TPS2376DDAR-H pinout, TPS2376DDAR-H application, or TPS2376DDAR-H equivalent, this page delivers verified technical context, exact pin functions, real-world application mappings for VoIP phones and security cameras, thermal design guidance for SOIC PowerPad layout, and two validated alternative PD controllers with documented functional differences.

Technical Context

The TPS2376DDAR-H implements a state-machine-controlled PoE interface with three distinct operational phases: detection (using 24.9-kΩ DET resistor), classification (via CLASS pin with 255–4420-Ω resistor), and powered operation (with programmable inrush and fixed 765-mA operational current limit). Its UVLO circuit uses an external resistor divider on the UVLO pin to set turn-on (2.49 V typical) and turn-off (1.93 V typical) thresholds, enabling compliance with IEEE 802.3af or custom voltage windows.

It integrates a 100-V rated, 0.58-Ω low-side switch with thermal shutdown (135°C) and foldback protection, where overload triggers automatic transition from operational to inrush current limit upon 10-V MOSFET voltage detection for 150 μs. The PG output asserts high-impedance only after inrush completion and RTN voltage stabilizes below 10 V, with 150-μs deglitching and 0.4-V max low-level output at 2 mA sink.

Key Specifications

Pinout & Package

TPS2376DDAR-H is housed in an 8-pin SOIC package with exposed PowerPad™ (DDA suffix), measuring 4.89 mm × 3.90 mm. The PowerPad must be soldered to a large VSS copper pour for effective thermal dissipation (R_θJA = 45–58.6°C/W depending on PCB layout).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar powered device controller applications.

Compared with TPS2376DDAR-H, both alternatives lack adjustable inrush limiting, thermal foldback, and the 600-mA+ current capability needed for IEEE 802.3af high-power mode; they are functionally suitable only for Class 0–3 (≤12.95 W) applications and require PCB-level thermal redesign if replacing TPS2376DDAR-H in existing 26-W systems.

Availability

TPS2376DDAR-H is available at Aetrix Electronics and suitable for VoIP video phones, security cameras, WiMAX access points, and RFID readers requiring stable component supply across industrial temperature ranges and long product lifecycles.

Supply support for TPS2376DDAR-H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in industrial, automotive, and communications markets.

The TPS2376DDAR-H belongs to TI's Power-over-Ethernet (PoE) PD controller product line, designed specifically to simplify high-power, standards-compliant powered device implementation in networked endpoints such as IP cameras and wireless infrastructure.

FAQ

What is the maximum continuous power the TPS2376DDAR-H can deliver in a compliant IEEE 802.3af system?

The TPS2376DDAR-H supports up to 26 W of continuous delivered power when operating from a 52-V minimum PSE supply over 100 m of CAT-5 cable. This is achieved using its 765-mA operational current limit and 0.58-Ω R_DS(on), assuming proper thermal management via the PowerPad and PCB copper area. The device meets IEEE 802.3af Class 4 power classification requirements.

How does the TPS2376DDAR-H handle overcurrent faults during normal operation?

The TPS2376DDAR-H responds to overcurrent faults by activating foldback protection: when the MOSFET drain-source voltage exceeds 10 V for 150 μs, it automatically switches from the 765-mA operational current limit back to the lower inrush limit set by the ILIM resistor. If the overload persists, thermal shutdown engages at 135°C with 20°C hysteresis, allowing auto-recovery once junction temperature falls below 115°C.

Can the TPS2376DDAR-H be used without the DET resistor in the detection circuit?

Yes - the TPS2376DDAR-H allows elimination of the discrete DET resistor by configuring the UVLO divider resistors to provide the required 24.9-kΩ detection signature. This reduces component count but lowers efficiency during normal operation due to increased divider current; TI recommends this approach only when minimizing BOM is prioritized over optimal power conversion efficiency.

What is the purpose of the PowerPad in the TPS2376DDAR-H SOIC package?

The PowerPad in the TPS2376DDAR-H is an exposed thermal pad electrically connected to VSS that must be soldered to a large copper pour on the PCB. It reduces junction-to-ambient thermal resistance from ~70°C/W (standard SOIC) to as low as 45°C/W, enabling reliable 26-W operation without external heatsinking. Failure to connect the PowerPad to VSS compromises thermal performance and risks thermal shutdown under full load.

Does the TPS2376DDAR-H support non-standard PoE implementations beyond IEEE 802.3af?

Yes - the TPS2376DDAR-H permits non-standard PoE implementations through adjustable UVLO thresholds, programmable inrush current, and flexible classification resistor selection. Its 100-V input rating and 600-mA capability allow operation with higher-voltage PSEs or custom power budgets, provided system-level safety and thermal design are validated independently of IEEE 802.3af compliance testing.