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Texas Instruments TPS51604QDSGTQ1

Part No.:
TPS51604QDSGTQ1
Manufacturer:
Texas Instruments
Category:
Gate Drivers
Package:
8-WFDFN Exposed Pad
Datasheet:
AetrixTPS51604QDSGTQ1.pdf
Description:
IC GATE DRVR HALF-BRIDGE 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

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Product details

Overview

TPS51604QDSGTQ1 from Texas Instruments is an AEC-Q100 Grade 1 qualified synchronous buck MOSFET driver for automotive CPU core power, featuring adaptive zero-crossing detection, reduced dead-time control (0–35 ns rising, 0–25 ns falling), and dual low-power modes (130 µA in PWM tri-state, 8 µA in SKIP+PWM tri-state). It drives high-side and low-side N-channel FETs in high-frequency VCORE supplies up to 28 V input.

For engineers reviewing the TPS51604QDSGTQ1 datasheet, TPS51604QDSGTQ1 pinout, TPS51604QDSGTQ1 application, or TPS51604QDSGTQ1 equivalent, key selection criteria include bootstrap switch RDS(on) (12–24 Ω), DRVH/DRVL gate drive strength (source/sink resistance ≤8 Ω / ≤1.6 Ω), UVLO thresholds (4.15 V rise, 3.7 V fall), and WSON-8 thermal-pad package compatibility with automotive thermal cycling requirements.

Technical Context

The TPS51604QDSGTQ1 implements adaptive dead-time control using DRVL-sensed timing to minimize shoot-through risk while enabling near-zero dead-time transitions-critical for >800 kHz operation in automotive VCORE rails. Its integrated BST FET replaces external diodes, optimizing bootstrap voltage regulation under dynamic load conditions.

Zero-crossing detection operates on the SW node with ±2.25 mV offset, enabling precise DCM entry/exit without external sensing components. The SKIP pin independently enables FCCM (SKIP=HI) or adaptive DCM (SKIP=LO), while simultaneous tri-state on PWM and SKIP forces ultra-low-power mode (8 µA) with <50 µs wake-up latency.

Key Specifications

Parameter Value and Actual Design Meaning
VIN Range 4.5 V to 28 V - supports direct connection to automotive battery, NVDC, or 5/12-V rails without pre-regulation
UVLO Threshold 4.15 V (rising), 3.7 V (falling) - ensures stable startup/shutdown across cold-crank and load-dump transients
DRVH Rise Time 30 ns (20–80%, CL=3.3 nF) - enables fast high-side FET turn-on for high-frequency switching efficiency
DRVL Sink Resistance 0.4–1.6 Ω - provides strong low-side gate discharge to suppress body-diode conduction losses
BST Switch RDS(on) 12–24 Ω - reduces bootstrap capacitor charging loss vs. discrete diode solutions, improving light-load efficiency
Operating Temp –40°C to +125°C (TJ) - meets AEC-Q100 Grade 1 requirements for under-hood and infotainment systems
Quiescent Current 8 µA (SKIP+PWM tri-state) - extends battery life in always-on automotive modules during sleep states

Pinout & Package

TPS51604QDSGTQ1 uses a thermally enhanced 2.0 mm × 2.0 mm, 8-pin WSON (DSG) package with exposed thermal pad tied to GND. The package supports reflow per JEDEC Level-2-260°C-1 year and requires soldering the thermal pad for thermal performance and mechanical reliability.

Pin/Terminal Circuit Role Design Meaning
BST (Pin 1) Bootstrap supply input Provides gate drive voltage for high-side N-FET; internal FET replaces external bootstrap diode
PWM (Pin 2) Control input Tri-state enabled: forces DRVH/DRVL low and enters 130 µA low-power mode when floating
SKIP (Pin 3) Mode select input LO = enable DCM via zero-crossing detection; HI = force FCCM; tri-state = enter 8 µA ultra-low-power state
VDD (Pin 4) 5-V logic supply Must be decoupled with ≥1 µF ceramic capacitor; powers internal logic and gate drivers
DRVH (Pin 8) High-side gate drive output Drives gate of external high-side N-FET; features 4–8 Ω source resistance and 0.5–1.6 Ω sink resistance
SW (Pin 7) Switch-node sense/return Connects to high-side FET source and inductor; used for zero-crossing detection and bootstrap reference
GND (Pin 6) Power/ground reference Return path for DRVL and IC logic; must connect to thermal pad and low-side FET source
DRVL (Pin 5) Low-side gate drive output Drives gate of external low-side N-FET; optimized for fast turn-off (10 ns fall time) to minimize body-diode conduction

Key Features

Feature Design Value
Adaptive zero-crossing detection ±2.25 mV offset on SW node enables accurate DCM transition at light loads without external components
Integrated BST FET switch 12–24 Ω RDS(on) replaces external Schottky diode, reducing BOM count and improving bootstrap efficiency
Reduced dead-time control 0–35 ns adjustable rising/falling dead-time prevents shoot-through while minimizing body-diode conduction loss
Dual low-power modes 130 µA (PWM tri-state only) and 8 µA (PWM+SKIP tri-state) support automotive sleep-mode compliance
AEC-Q100 Grade 1 qualification Validated for –40°C to +125°C operation with H2 ESD (2 kV HBM) and C3B CDM (±750 V) robustness

Applications

Automotive CPU Core Power Rear Seat Entertainment (RSE)

Use Scenario: High-frequency VCORE supply for automotive infotainment SoCs requiring dynamic voltage scaling and rapid load transient response.

IC Role / Device Role / Timing Role: Synchronous buck gate driver controlling high-side/low-side N-FETs in a 500 kHz–1.5 MHz buck converter stage.

Use Value: Adaptive DCM mode maintains >85% efficiency at 100 mA load; FCCM mode delivers stable 1.8 V/15 A output under full CPU load.

Use Scenario: Compact, thermally constrained power stage for 10.1″ automotive tablets powered by 12-V battery or NVDC rail.

IC Role / Device Role / Timing Role: Gate driver enabling high-efficiency buck conversion with minimal PCB area due to 2×2 mm WSON package.

Use Value: 8 µA ultra-low-power mode extends standby battery life; thermal-pad package sustains 125°C junction temperature during continuous video playback.

Advanced Driver Assistance Systems (ADAS) Automotive Telematics Control Units (TCU)

Use Scenario: Power delivery for radar processor SoCs requiring low-noise, high-reliability VCORE with fast wake-from-sleep capability.

IC Role / Device Role / Timing Role: Gate driver paired with TI controller to implement controlled soft-start and precise current-limit protection.

Use Value: <50 µs wake-up latency from tri-state mode meets ADAS real-time response requirements; UVLO hysteresis prevents brownout oscillation during engine cranking.

Use Scenario: Always-on 5-V-to-1.2-V core supply in cellular-connected TCUs operating across wide ambient temperatures.

IC Role / Device Role / Timing Role: High-frequency buck driver supporting 800 kHz switching to reduce output filter size and EMI emissions.

Use Value: Optimized signal path delays (e.g., 25 ns DRVH fall propagation) ensure tight timing margins in multi-phase designs; WSON package enables dense layout.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS51604QDSGRQ1 Same silicon die and electrical specs; differs only in tape-and-reel packaging (3000-unit reel vs. 250-unit reel) No functional difference; selected for high-volume production where reel size impacts SMT line efficiency Choose TPS51604QDSGTQ1 for prototyping, small-batch builds, or inventory flexibility; choose TPS51604QDSGRQ1 for automated manufacturing with large reels.
LM5113QDGSRQ1 Higher drive strength (1.5-A peak), wider VIN (4.5–100 V), no integrated BST switch or zero-crossing detection Targeted at industrial/high-voltage buck converters, not automotive VCORE; requires external bootstrap diode and DCM control circuitry Select LM5113QDGSRQ1 only if >28 V input or >1.5-A gate drive is required; TPS51604QDSGTQ1 remains optimal for cost-, size-, and efficiency-sensitive automotive CPU rails.

Compared with TPS51604QDSGTQ1, TPS51604QDSGRQ1 offers identical performance in a larger reel format for production lines, while LM5113QDGSRQ1 trades automotive-optimized features (DCM, BST FET, ultra-low-power modes) for broader voltage range and higher drive current-making it unsuitable as a drop-in replacement but viable for non-automotive high-VIN applications.

Availability

TPS51604QDSGTQ1 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS processing units, and telematics control units requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for TPS51604QDSGTQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive-grade power management ICs, with over 50 years of innovation in high-reliability electronics.

The TPS51604-Q1 product line was designed specifically for high-frequency, high-efficiency CPU core power in automotive environments-emphasizing AEC-Q100 qualification, thermal resilience, and adaptive light-load optimization.

FAQ

What is the maximum input voltage rating for the TPS51604QDSGTQ1?

The TPS51604QDSGTQ1 has an absolute maximum BST input voltage of 35 V (transient <20 ns: 38 V) and a recommended operating VIN range of 4.5 V to 28 V. Exceeding 28 V during normal operation risks violating recommended conditions, though short transients up to 38 V on BST are tolerated per datasheet Section 6.1.

How does the TPS51604QDSGTQ1 achieve ultra-low quiescent current?

The TPS51604QDSGTQ1 achieves 8 µA quiescent current by placing both PWM and SKIP inputs into tri-state simultaneously, disabling internal logic and UVLO comparators. This ultra-low-power mode resumes switching within 50 µs of either input being driven, making it ideal for automotive sleep/wake architectures.

Is the TPS51604QDSGTQ1 pin-compatible with other TI gate drivers like the TPS51603?

No, the TPS51604QDSGTQ1 is not pin-compatible with the TPS51603. While both are 8-pin WSON buck drivers, the TPS51604QDSGTQ1 assigns SKIP to Pin 3 and PWM to Pin 2, whereas the TPS51603 uses different pin functions and lacks SKIP functionality. PCB layout and schematic must be redesigned for substitution.

What is the purpose of the thermal pad on the TPS51604QDSGTQ1 WSON package?

The exposed thermal pad on the TPS51604QDSGTQ1 WSON package must be soldered to the system GND plane using multiple vias. It serves dual roles: lowering junction-to-board thermal resistance (RθJB = 34.3°C/W) for reliable 125°C operation and providing mechanical stability and low-inductance GND return for high-speed gate drive signals.

Does the TPS51604QDSGTQ1 require external components for bootstrap operation?

The TPS51604QDSGTQ1 integrates a bootstrap FET switch, eliminating the need for an external Schottky diode. However, a ceramic bootstrap capacitor (typically 0.1 µF) between BST and SW pins is mandatory, and a 1-µF or greater ceramic capacitor between VDD and GND is required for stable gate drive supply decoupling.

TPS51604QDSGTQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-WFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Synchronous
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
4.5V ~ 5.5V
Logic Voltage - VIL, VIH:
0.6V, 2.65V
Current - Peak Output (Source, Sink):
-
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
35 V
Rise / Fall Time (Typ):
30ns, 8ns
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (2x2)

TPS51604QDSGTQ1 FAQ

1.How can I place an order for TPS51604QDSGTQ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS51604QDSGTQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS51604QDSGTQ1 reliable?

The price and inventory of TPS51604QDSGTQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS51604QDSGTQ1 is usually 5 days.

3.What payment methods are accepted for TPS51604QDSGTQ1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS51604QDSGTQ1 transactions.

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4.How is shipping managed for TPS51604QDSGTQ1?

TPS51604QDSGTQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS51604QDSGTQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS51604QDSGTQ1?

For technical support, including TPS51604QDSGTQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS51604QDSGTQ1 requirements.

6.How does Aetrix verify that TPS51604QDSGTQ1 is sourced from the original manufacturer or authorized distributors?

All TPS51604QDSGTQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS51604QDSGTQ1 meets industry standards.

7.What is the process for return or replacement of TPS51604QDSGTQ1?

All TPS51604QDSGTQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TPS51604QDSGTQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS51604QDSGTQ1 part is unused and in its original packaging.

Return procedure for TPS51604QDSGTQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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