Texas Instruments TPS65185RGZT

Overview

TPS65185RGZT from Texas Instruments is a highly integrated power-management IC (PMIC) designed exclusively for E Ink® Vizplex™ electronic paper displays. It delivers ±15-V source driver rails (VPOS/VNEG), ±22-V/–20-V gate driver supplies (VDDH/VEE), and programmable VCOM bias (0 V to –5.11 V) from a single 3-V to 6-V input, supporting 9.7-inch+ panels in e-readers and dual-display tablets.

For engineers reviewing the TPS65185RGZT datasheet, TPS65185RGZT pinout, TPS65185RGZT application, or TPS65185RGZT equivalent, key selection considerations include its I²C-programmable VCOM tracking (±10 mV), active rail discharge capability, ±50-mV VPOS–VNEG tracking tolerance, and RGZ 48-pin VQFN (7 mm × 7 mm) package with thermal pad tied to VN.

Technical Context

The TPS65185RGZT integrates two high-efficiency DC-DC converters: a boost regulator (DCDC1) generating +16 V base for the VDDH positive charge pump, and an inverting buck-boost regulator (DCDC2) generating –16 V base for the VEE negative charge pump. Both LDOs (VPOS and VNEG) are tracking regulators with ±1% output tolerance and 250-mV dropout at 120 mA.

Its VCOM driver uses a 9-bit DAC (10-mV step) with ±1.5% accuracy and supports automatic panel kickback measurement for factory calibration. All critical rails-VPOS, VNEG, VDDH, VEE, and VCOM-feature dedicated discharge pins (e.g., VPOS_DIS, VEE_DIS) enabling controlled shutdown without external circuitry.

Key Specifications

Pinout & Package

TPS65185RGZT is housed in a 48-pin VQFN (RGZ) package with 7.00 mm × 7.00 mm body size and 0.5-mm pitch. The exposed thermal pad is internally connected to PBKG and must be soldered to VN (–16 V) via a short, wide copper trace for thermal and electrical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar E Ink display power management applications.

Compared with TPS65185RGZT, TPS651851RSLR offers higher output current in a smaller package but requires tighter input voltage margining; MAX17135ETJ+ provides functional overlap in LDO/VCOM capability but increases design complexity with external charge pump dependencies.

Availability

TPS65185RGZT is available at Aetrix Electronics and suitable for e-book readers, EPD tablets, industrial shelf labels, and OMAP-based display controllers requiring stable component supply and long-term lifecycle support.

Supply support for TPS65185RGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in low-power display solutions.

The TPS65185x product line was engineered specifically for E Ink Vizplex electronic paper displays, integrating all essential bias rails, VCOM control, and thermal management into a single chip to simplify EPD system design.

FAQ

What is the primary function of the TPS65185RGZT in an E Ink display system?

The TPS65185RGZT serves as a complete power-management IC for E Ink Vizplex panels, generating all required bias voltages: ±15-V source driver rails (VPOS/VNEG), +22-V/–20-V gate driver supplies (VDDH/VEE), and a digitally adjustable VCOM backplane bias (0 V to –5.11 V). It replaces up to 15 discrete components while enabling I²C-controlled sequencing and calibration-making it central to reliable, compact EPD power design.

Does the TPS65185RGZT support automatic VCOM calibration, and how does it work?

Yes, the TPS65185RGZT supports automatic panel kickback voltage measurement to eliminate manual VCOM calibration. During startup, it measures the panel's inherent kickback response, computes the optimal VCOM offset, and stores the value in non-volatile memory. This stored value becomes the default VCOM power-up setting, ensuring consistent image quality across production units without operator intervention.

What are the key thermal design requirements for the TPS65185RGZT RGZ package?

The TPS65185RGZT's 48-pin VQFN (RGZ) package features an exposed thermal pad internally connected to PBKG, which must be tied to the VN pin (–16 V) using a short, wide copper trace-not ground. TI specifies a junction-to-board thermal resistance (RθJB) of 6.6°C/W; proper thermal pad soldering and copper area are essential to maintain TJ ≤125°C under full load, especially during extended VCOM or charge pump operation.

Can the TPS65185RGZT operate from a 3.3-V input supply, and what performance trade-offs apply?

Yes, the TPS65185RGZT supports 3-V to 6-V input, including 3.3-V nominal supplies. At VIN = 3.3 V, VPOS/VNEG output current remains rated at 120 mA, but DCDC1/DCDC2 efficiency drops slightly (~82% typical), and LDO dropout margins tighten-requiring careful capacitor selection (e.g., 4.7-µF X5R ceramics at VPOS_IN/VNEG_IN) to maintain regulation under transient loads.

How does the TPS65185RGZT ensure precise VPOS–VNEG tracking for E Ink waveform integrity?

The TPS65185RGZT guarantees VPOS–VNEG difference within ±50 mV across temperature (–10°C to 85°C), input voltage (3 V–6 V), and load (10%–90% of 120 mA) via matched LDO architectures and shared reference circuitry. This tight tracking prevents waveform skew between positive and negative source driver phases-critical for minimizing ghosting and achieving clean, high-contrast EPD updates.