Texas Instruments TPS6521902RSMR
- Part No.:
- TPS6521902RSMR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
TPS6521902RSMR.pdf
- Description:
- INTEGRATED POWER MANAGEMENT (PMI
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TPS6521902RSMR from Texas Instruments is a programmable power management IC (PMIC) engineered for industrial SoCs including AM62x and AM64 processors. It integrates three synchronous buck converters (1×3.5A, 2×2A) and four LDOs (2×400mA, 2×300mA), supports dynamic voltage scaling, I²C-based sequencing, and operates across –40°C to +105°C for HMI, PLC, and industrial PC applications.
For engineers reviewing the TPS6521902RSMR datasheet, TPS6521902RSMR pinout, TPS6521902RSMR application, or TPS6521902RSMR equivalent, key selection criteria include its RSM 32-pin QFN package, EEPROM-programmable rail voltages, multi-PMIC configuration support, and configurable GPIO/GPO timing control for industrial SoC power sequencing.
Technical Context
The TPS6521902RSMR implements quasi-fixed-frequency PWM/low-IQ PFM operation with dynamic voltage scaling on all three bucks, enabling efficient load-transient response and adaptive power delivery. Its I²C interface (standard/fast/fast-mode+) allows real-time register access for sequencing, monitoring, and fault handling.
It features two 400mA LDOs supporting bypass mode and SD-card voltage switching via VSEL_SD/VSEL_DDR, plus two 300mA LDOs configurable as load switches. The device uses internal EEPROM to store default rail configurations and supports multi-PMIC synchronization via GPIO and MODE/STBY pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5V–5.5V on VSYS and all PVIN pins; enables direct compatibility with common industrial 3.3V/5V rails. |
| Buck1 Output Current | 3.5A continuous; sufficient for AM62x/AM64 VDD_CORE (0.75V/0.85V) under full load. |
| Buck2/Buck3 Output Current | 2A each; supports DDR/LPDDR memory rails and auxiliary processor domains. |
| LDO1/LDO2 Output | 0.6V–3.4V, 400mA; configurable as load switch or bypass mode for SD-card I/O voltage control. |
| LDO3/LDO4 Output | 1.2V–3.3V, 300mA; supports peripheral I/O, USB PHY, or sensor bias with load-switch capability. |
| Operating Temperature | –40°C to +105°C ambient; qualified for extended industrial environments without derating. |
| I²C Interface | Standard/fast/fast-mode+ (up to 1 MHz); enables robust host-controlled sequencing and telemetry in noisy factory settings. |
Pinout & Package
RSM package: 32-pin QFN, 4.00mm × 4.00mm, exposed thermal pad (PGND) for enhanced thermal dissipation in compact industrial layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB_B1, FB_B2, FB_B3 | Feedback input | Connects to respective buck output filter; sets regulated voltage via internal EEPROM-configured divider ratio. |
| LX_B1_1 / LX_B1_2, LX_B2, LX_B3 | Power switch node | Drives external inductors; dual LX pins for Buck1 reduce parasitic inductance and improve EMI performance. |
| PVIN_B1_1 / PVIN_B1_2, PVIN_B2, PVIN_B3, PVIN_LDO1–LDO34 | Power input | Must be tied to VSYS or local bulk cap; strict voltage differential limits (≤200mV above VSYS for bucks, ≤20mV for LDOs) prevent overstress. |
| VSEL_SD/VSEL_DDR | Multi-function input | Selects SD-card I/O voltage (1.8V/register VOUT) or DDR termination voltage (1.2V/1.35V/register VOUT) dynamically during operation. |
| EN/PB/VSENSE | Enable/monitor input | Configurable as enable pin, push-button monitor (600ms ON, 8s OFF), or power-fail comparator input for system-level brownout response. |
| GPO1, GPO2, GPIO | Programmable digital I/O | Open-drain outputs configurable in power-up/down sequences; GPIO supports multi-PMIC synchronization via level-sensitive signaling. |
Key Features
| Feature | Design Value |
|---|---|
| EEPROM programmability | Non-volatile storage of rail voltages, sequencing order, and fault thresholds eliminates external configuration hardware. |
| Dynamic voltage scaling (DVS) | Real-time adjustment of buck output voltages via I²C to match SoC performance states-reducing dynamic power by up to 30%. |
| SD-card I/O voltage control | VSEL_SD pin enables seamless 1.8V ↔ register-set VOUT switching on LDO1/LDO2-required for UHS-I/UHS-II SD interfaces. |
| Multi-PMIC synchronization | GPIO and MODE/STBY pins coordinate power-up/down timing across two TPS65219 devices-enabling systems with >14 rails. |
| Low-IQ PFM mode | 250µA typical ACTIVE-state current (all rails on, no load) extends battery life in portable industrial HMIs and data concentrators. |
Applications
| Industrial HMI | Programmable Logic Controller (PLC) |
|---|---|
|
Use Scenario: Touchscreen-based operator interface with AM62x SoC, requiring multiple voltage rails and low-power standby. IC Role / Device Role: Central PMIC managing VDD_CORE (0.75V), DDR (1.1V), I/O (3.3V), and SD-card (1.8V/3.3V). Use Value: EEPROM-stored sequencing ensures deterministic boot; VSEL_SD enables runtime SD voltage switching; STBY mode reduces idle current to 105µA. |
Use Scenario: DIN-rail mounted controller with isolated I/O, Ethernet, and real-time processing using AM64x. IC Role / Device Role: Primary power hub delivering 3.3V for MCU core, 1.8V for Ethernet PHY, 5V for isolated RS-485 transceivers, and 1.2V for ADC reference. Use Value: Dual 2A bucks supply high-current peripherals; I²C telemetry enables remote health monitoring; -40°C to +105°C rating ensures field reliability. |
| Industrial PC | Video Surveillance System |
|
Use Scenario: Fanless IPC running Linux on AM62x SIP, needing thermal-aware power management and DDR4/LPDDR4 flexibility. IC Role / Device Role: Configurable PMIC supporting LPDDR4 (TPS6521902 default) or DDR4 (via TPS6521903 swap) with dynamic VDD_CORE scaling. Use Value: Pin-compatible variants simplify BOM management; DVS lowers CPU junction temperature during sustained compute loads. |
Use Scenario: Multi-camera NVR with AM62x SoC, MIPI CSI-2 interfaces, and PoE-powered modules. IC Role / Device Role: Supplies 0.75V VDD_CORE, 1.1V DDR, 1.8V MIPI, 3.3V sensors, and 5V PoE interface logic-all from single-chip solution. Use Value: Four LDOs eliminate discrete regulators; GPO1/GPO2 drive external enable signals for camera modules; nINT alerts host on overtemperature/fault. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS6521901RSMR | Pre-programmed for DDR4 memory (VDD_CORE=0.75V, DDR=1.2V); fixed NVM settings, no user reprogramming. | Targeted at AM62x/AM64 designs with DDR4, not LPDDR4; lacks runtime VSEL_DDR flexibility. | Select when DDR4 interface is required and EEPROM customization is unnecessary. |
| TPS6521905RSMR | User-programmable version with all rails disabled at power-on; requires full I²C initialization before operation. | Suitable for custom SoCs or non-TI processors where default rail configurations do not match; higher firmware integration effort. | Select for maximum flexibility across diverse SoCs, accepting added bring-up complexity. |
Compared with TPS6521901RSMR and TPS6521905RSMR, the TPS6521902RSMR offers factory-programmed LPDDR4 support out-of-box while retaining partial EEPROM reconfigurability-making it optimal for AM62x/AM64-based industrial designs prioritizing rapid deployment and SD-card interoperability.
Availability
TPS6521902RSMR is available at Aetrix Electronics and suitable for industrial HMI, PLC, and video surveillance systems requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.
Supply support for TPS6521902RSMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with over 50 years of industrial-grade product experience.
The TPS65219 family delivers integrated, EEPROM-configurable power solutions for TI's AM62x/AM64x/AM243x processors-designed specifically to simplify power architecture in space-constrained, thermally demanding industrial edge devices.
FAQ
What is the primary application target for the TPS6521902RSMR?
The TPS6521902RSMR is specifically configured for industrial applications using AM62x and AM64x processors with LPDDR4 memory, including HMIs, PLCs, industrial PCs, and video surveillance systems. Its factory-programmed default settings-VDD_CORE = 0.75V, LPDDR4 I/O = 1.1V, and SD-card support via VSEL_SD-align directly with TI's AM62x/AM64x power reference designs. This eliminates manual configuration for standard deployments while retaining EEPROM programmability for fine-tuning.
Does the TPS6521902RSMR support dynamic voltage scaling (DVS)?
Yes, the TPS6521902RSMR supports dynamic voltage scaling on all three buck converters via I²C commands. This allows real-time adjustment of output voltages-such as lowering VDD_CORE from 0.85V to 0.75V during low-activity states-to reduce dynamic power consumption. DVS is implemented in hardware with minimal latency and does not require host firmware intervention beyond register writes, making it suitable for real-time industrial control loops.
How does the TPS6521902RSMR handle SD-card voltage selection?
The TPS6521902RSMR uses the VSEL_SD/VSEL_DDR pin to dynamically switch LDO1 or LDO2 output between 1.8V and a register-configured voltage (e.g., 3.3V) during operation-enabling compliance with UHS-I and UHS-II SD specifications. This function is hardware-automated: asserting VSEL_SD triggers an internal state machine that reconfigures the LDO feedback network without I²C traffic, ensuring glitch-free transitions critical for reliable SD card enumeration and data transfer.
What package and thermal characteristics does the TPS6521902RSMR have?
The TPS6521902RSMR uses the RSM 32-pin QFN package (4.00mm × 4.00mm) with an exposed thermal pad (PGND). Its junction-to-board thermal resistance (RΘJB) is 10.5°C/W, enabling effective heat dissipation into the PCB ground plane via multiple vias under the pad. This thermal design supports continuous 3.5A buck operation at +105°C ambient without forced airflow-validated per JEDEC JESD51-7 standards and essential for fanless industrial enclosures.
Can the TPS6521902RSMR be used in multi-PMIC configurations?
Yes, the TPS6521902RSMR supports synchronized multi-PMIC operation using GPIO and MODE/STBY pins to coordinate power-up/down sequencing across two devices. This enables systems requiring more than 14 rails-such as high-channel industrial data concentrators or modular PLC backplanes-while maintaining deterministic timing and avoiding rail contention. Synchronization is achieved through level-sensitive signaling, eliminating need for external timing controllers or complex firmware coordination.
TPS6521902RSMR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 250µA
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-VQFN (4x4)
TPS6521902RSMR FAQ
1.How can I place an order for TPS6521902RSMR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6521902RSMR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6521902RSMR reliable?
The price and inventory of TPS6521902RSMR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6521902RSMR is usually 5 days.
3.What payment methods are accepted for TPS6521902RSMR?
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4.How is shipping managed for TPS6521902RSMR?
TPS6521902RSMR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6521902RSMR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6521902RSMR?
For technical support, including TPS6521902RSMR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6521902RSMR requirements.
6.How does Aetrix verify that TPS6521902RSMR is sourced from the original manufacturer or authorized distributors?
All TPS6521902RSMR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6521902RSMR meets industry standards.
7.What is the process for return or replacement of TPS6521902RSMR?
All TPS6521902RSMR units undergo pre-shipment inspection (PSI). If there is an issue with TPS6521902RSMR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6521902RSMR part is unused and in its original packaging.
Return procedure for TPS6521902RSMR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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