My Inquiry
My Account
Texas Instruments TPS6521923WRHBRQ1
- Part No.:
- TPS6521923WRHBRQ1
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
TPS6521923WRHBRQ1.pdf
- Description:
- AUTOMOTIVE POWER MANAGEMENT INTE
- Quantity:
- Payment:
- Shipping:
Inventory:3,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS6521923WRHBRQ1 from Texas Instruments is an automotive-grade power management IC (PMIC) designed for ARM Cortex®-A53-based SoCs including AM62x-Q1 and AM64x-Q1. It integrates three synchronous buck converters (1×3.5A, 2×2A) and four LDOs (2×400mA, 2×300mA), supports dynamic voltage scaling, I²C programmable sequencing, and operates across –40°C to +125°C ambient temperature for head units, digital clusters, and telematics control units.
For engineers reviewing the TPS6521923WRHBRQ1 datasheet, TPS6521923WRHBRQ1 pinout, TPS6521923WRHBRQ1 application, or TPS6521923WRHBRQ1 equivalent, key selection criteria include its QFN-32 wettable flank package, EEPROM-programmable rail voltages, multi-PMIC configuration support, functional safety capability, and compliance with AEC-Q100 Grade 1.
Technical Context
The TPS6521923WRHBRQ1 implements a configurable multi-rail power architecture with three independent buck regulators operating up to 2.3 MHz, each supporting dynamic voltage scaling via I²C. Its four LDOs include two 400mA rails configurable as load switches or bypass mode for SD-card interface, and two 300mA rails supporting 1.2V–3.3V outputs with load-switch capability.
Control logic includes programmable power-up/down sequencing, dual GPOs, one GPIO, three multi-function pins (MODE/STBY, MODE/RESET, VSEL_SD/VSEL_DDR), and integrated voltage/temperature monitors. The device uses quasi-fixed-frequency PWM, PFM, or fixed-frequency operation modes and supports synchronized multi-PMIC operation for systems requiring >14 rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5 V to 5.5 V on VSYS and all PVIN pins - enables direct integration with automotive 3.3V/5V pre-regulators and battery-supplied systems. |
| Buck Output Current | 3.5 A (BUCK1), 2 A × 2 (BUCK2/BUCK3) - sufficient to power core, memory, and I/O rails of ARM Cortex-A53 SoCs without external current boosting. |
| LDO Output Current | 400 mA × 2 (LDO1/LDO2), 300 mA × 2 (LDO3/LDO4) - supports peripheral regulation, SD-card voltage switching, and low-noise analog supply requirements. |
| Operating Temperature | –40°C to +125°C ambient - qualified per AEC-Q100 Grade 1, enabling use in under-hood and dashboard-mounted automotive electronics. |
| I²C Interface | Standard, fast-mode, and fast-mode+ (up to 1 MHz) - allows real-time rail reconfiguration, fault reporting, and coordinated sequencing with host processors. |
| Quiescent Current | 250 µA typical in ACTIVE state (all rails on, no load, PFM mode) - minimizes standby power draw in always-on vehicle subsystems. |
| Package | 32-pin QFN with wettable flanks (5.0 mm × 5.0 mm) - supports automated optical inspection (AOI) and high-reliability solder joint formation for automotive manufacturing. |
Pinout & Package
TPS6521923WRHBRQ1 uses a 32-pin QFN package with wettable flanks (RHB), measuring 5.0 mm × 5.0 mm, and features an exposed thermal pad (PGND) for enhanced thermal dissipation in high-power automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FB_B1, FB_B2, FB_B3 | Buck feedback inputs | Connect to respective output filters; enable precise closed-loop regulation of BUCK1–BUCK3 output voltages configured via EEPROM. |
| LX_B1_1 / LX_B1_2, LX_B2, LX_B3 | Buck switch node outputs | Drive external inductors; dual LX pins for BUCK1 reduce conduction loss and improve thermal distribution. |
| PVIN_B1_1 / PVIN_B1_2, PVIN_B2, PVIN_B3, PVIN_LDO1–LDO34 | Power input rails | Require local ceramic decoupling (4.7 µF min for bucks, 2.2 µF min for LDOs); must not exceed VSYS by more than 200 mV (bucks) or 20 mV (LDOs). |
| VLDO1–VLDO4 | LDO output terminals | Deliver regulated 0.6–3.4 V (LDO1/LDO2) or 1.2–3.3 V (LDO3/LDO4); require ≥2.2 µF ceramic output capacitance per rail. |
| SCL / SDA | I²C interface signals | Support standard/fast/fast-mode+ protocols; require external pull-ups to VIO (≤3.4 V) for level translation and noise immunity. |
| EN/PB/VSENSE, MODE/STBY, MODE/RESET, VSEL_SD/VSEL_DDR | Multi-function control inputs | Configurable for enable, push-button monitoring, power-fail sensing, PWM/PSM mode selection, reset triggering, or SD/DDR voltage selection - reduces external logic count. |
| GPO1 / GPO2 / GPIO / nINT / nRSTOUT | Digital I/O and status outputs | Open-drain outputs for rail enable sequencing, interrupt signaling, SoC reset assertion, and inter-PMIC synchronization. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic voltage scaling (DVS) | Enables real-time adjustment of BUCK1–BUCK3 output voltages during SoC operation to optimize power vs. performance trade-offs in AM62x/AM64x systems. |
| EEPROM programmability | Stores default rail voltages, sequencing order, timing delays, and fault thresholds - eliminates need for external configuration EEPROM or firmware initialization overhead. |
| Functional safety capability | Includes internal voltage/temperature monitors, watchdog timer, and fault reporting via nINT - supports ISO 26262 ASIL-B system-level compliance when used per TI's safety manual. |
| Multi-PMIC configuration support | Allows two TPS6521923WRHBRQ1 devices to operate synchronously using GPIO and MODE/STBY pins - scales to >14 regulated rails for complex automotive domain controllers. |
| SD-card interface support | LDO1/LDO2 configurable as 1.8 V/3.3 V load switches with VSEL_SD pin - enables seamless SDIO voltage switching without external MOSFETs or level shifters. |
Applications
| Digital Cluster | Telematics Control Unit (TCU) |
|---|---|
|
Use Scenario: High-resolution TFT display with GPU, video decoder, and CAN/FlexRay connectivity in instrument panel. IC Role / Device Role / Timing Role: Primary PMIC supplying core (1.2 V), DDR (1.1 V), I/O (3.3 V), and display bias (5 V) rails with synchronized startup and DVS for GPU frequency scaling. Use Value: Reduces bill-of-materials by integrating 7 rails in one package and enables ASIL-B-compliant power supervision via built-in monitors and nINT reporting. |
Use Scenario: Cellular modem, GNSS receiver, and vehicle-to-everything (V2X) processor in connected car gateway. IC Role / Device Role / Timing Role: Centralized power controller delivering isolated, sequenced supplies to modem baseband, RF front-end, and secure MCU domains. Use Value: Supports fast wake-from-sleep transitions via STBY mode with only LDO1 active (105 µA), minimizing always-on power while maintaining RTC and CAN bus monitoring. |
| Advanced Driver Assistance Systems (ADAS) Camera ECU | Automotive Audio Amplifier |
|
Use Scenario: ISP and deep learning accelerator processing raw image data from multiple CMOS sensors in surround-view or DMS systems. IC Role / Device Role / Timing Role: Supplies low-noise analog (1.8 V), digital core (1.0 V), memory (1.1 V), and sensor interface (2.8 V) rails with tight transient response (<±27.5 mV at 1.1 A step) to prevent image corruption. Use Value: Achieves <100 mV load transient deviation on BUCK1 at 1.8 V output using auto-PFM mode and 80 µF output capacitance - critical for real-time vision processing stability. |
Use Scenario: Class-D amplifier driving mid/high-range speakers in premium audio head units with DSP and Bluetooth streaming. IC Role / Device Role / Timing Role: Provides clean 5 V for analog audio stages, 3.3 V for digital interfaces, and 1.2 V for DSP core - all with independent enable control and fault isolation. Use Value: LDO3/LDO4 deliver <10 µV RMS noise over 10 Hz–100 kHz, preserving SNR in high-fidelity audio paths without requiring additional linear regulators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS6594242ZRQRQ1 | Higher integration: adds USB-C PD controller, 12-bit ADC, and 8-channel GPIO; supports up to 16 rails; larger 48-pin QFN (7 mm × 7 mm). | Targeted at next-gen domain controllers requiring USB power delivery and extensive system monitoring - over-spec for basic SoC power needs. | Select when USB-C charging, advanced telemetry, or >14 rails are required; avoid if footprint and cost sensitivity dominate. |
| MAX20430ATPA/VY+ | Lower current: 3×2.5 A bucks, 3×300 mA LDOs; no EEPROM; fixed factory-programmed sequencing; smaller 28-pin QFN (4 mm × 4 mm). | Designed for cost-sensitive entry-level ADAS cameras and infotainment displays where field reprogrammability is unnecessary. | Choose for simplified design, lower BOM cost, and space-constrained layouts - but requires external sequencing logic for complex SoCs. |
Compared with TPS6521923WRHBRQ1, TPS6594242ZRQRQ1 offers expanded system integration at higher cost and size, while MAX20430ATPA/VY+ trades configurability and rail count for compactness and simplicity - making TPS6521923WRHBRQ1 the optimal balance for mid-tier automotive SoC power with EEPROM flexibility and AEC-Q100 Grade 1 assurance.
Availability
TPS6521923WRHBRQ1 is available at Aetrix Electronics and suitable for automotive head units, digital clusters, and telematics control units requiring stable component supply, AEC-Q100 qualification, and long-term production continuity.
Supply support for TPS6521923WRHBRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive electronics, with decades of experience in high-reliability power management solutions.
The TPS65219-Q1 product line delivers integrated, AEC-Q100-qualified PMICs for ARM-based automotive SoCs, emphasizing functional safety, multi-rail scalability, and EEPROM-driven flexibility to accelerate development of ADAS, infotainment, and domain controller systems.
FAQ
What is the maximum supported switching frequency for the buck converters in the TPS6521923WRHBRQ1?
The TPS6521923WRHBRQ1 buck converters operate at up to 2.3 MHz, enabling compact external component selection - specifically 470 nH inductors and minimal output capacitance (as low as 10 µF depending on mode). This high-frequency capability reduces solution size and improves transient response for automotive SoC applications requiring rapid voltage changes.
Does the TPS6521923WRHBRQ1 support dynamic voltage scaling (DVS) for all three buck converters?
Yes, the TPS6521923WRHBRQ1 supports dynamic voltage scaling on all three buck converters (BUCK1, BUCK2, BUCK3) via I²C commands. This allows real-time adjustment of output voltages during SoC operation - essential for optimizing power consumption in ARM Cortex-A53-based processors like AM62x-Q1 and AM64x-Q1 during varying workload conditions.
How does the TPS6521923WRHBRQ1 handle power sequencing for automotive applications?
The TPS6521923WRHBRQ1 provides fully programmable power-up and power-down sequencing through EEPROM-stored configurations and runtime I²C control. Sequencing includes adjustable delays, voltage monitoring, timeout handling, and fault recovery - ensuring safe, repeatable startup/shutdown of multi-rail SoC systems such as digital clusters and TCUs without external timing components.
Can the TPS6521923WRHBRQ1 be used in multi-PMIC configurations, and how is synchronization achieved?
Yes, the TPS6521923WRHBRQ1 supports multi-PMIC operation for systems needing >14 rails. Synchronization is achieved using the GPIO pin and MODE/STBY pins to coordinate power-up timing between two or more devices. This enables deterministic, glitch-free rail activation across distributed power domains in domain controllers and high-end head units.
What are the key thermal characteristics of the TPS6521923WRHBRQ1 package?
The TPS6521923WRHBRQ1 uses a 32-pin QFN with wettable flanks and an exposed thermal pad (PGND). Its junction-to-board thermal resistance (RΘJB) is 10.9 °C/W, and junction-to-ambient (RΘJA) is 31.3 °C/W with standard PCB layout - enabling reliable operation up to +150°C junction temperature in automotive under-dash environments when properly heatsinked.
TPS6521923WRHBRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 250µA
- Voltage - Supply:
- 1.5V ~ 5.5V, 2.2V ~ 5.5V, 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 32-VQFN (5x5)
TPS6521923WRHBRQ1 FAQ
1.How can I place an order for TPS6521923WRHBRQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6521923WRHBRQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6521923WRHBRQ1 reliable?
The price and inventory of TPS6521923WRHBRQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6521923WRHBRQ1 is usually 5 days.
3.What payment methods are accepted for TPS6521923WRHBRQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS6521923WRHBRQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS6521923WRHBRQ1?
TPS6521923WRHBRQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6521923WRHBRQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6521923WRHBRQ1?
For technical support, including TPS6521923WRHBRQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6521923WRHBRQ1 requirements.
6.How does Aetrix verify that TPS6521923WRHBRQ1 is sourced from the original manufacturer or authorized distributors?
All TPS6521923WRHBRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6521923WRHBRQ1 meets industry standards.
7.What is the process for return or replacement of TPS6521923WRHBRQ1?
All TPS6521923WRHBRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TPS6521923WRHBRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6521923WRHBRQ1 part is unused and in its original packaging.
Return procedure for TPS6521923WRHBRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS6521923WRHBRQ1 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
