My Inquiry
My Account
Texas Instruments TPS657120YFFR
- Part No.:
- TPS657120YFFR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 30-UFBGA, DSBGA
- Datasheet:
-
TPS657120YFFR.pdf
- Description:
- IC PMU 3CH CONV/LDO 30DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,103
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS657120YFFR from Texas Instruments is a highly integrated power management unit (PMU) designed for baseband and RF power amplifier (RF-PA) supply in mobile wireless devices. It integrates three step-down DC-DC converters (DCDC1: 300 mA, DCDC2: 250 mA, DCDC3: 2 A), two low-noise RF LDOs (10 mA each, 1.2–3.4 V output), and a bypass switch for RF-PA rail switching - all controlled via 26-MHz MIPI RFFE interface. It operates from 2.8 V to 5.5 V input and delivers ±2% output voltage accuracy in PWM mode.
For engineers reviewing the TPS657120YFFR datasheet, TPS657120YFFR pinout, TPS657120YFFR application, or TPS657120YFFR equivalent, this device supports dynamic voltage scaling, flexible power sequencing (OTP-configurable), ECO/Power Save modes, thermal shutdown, and undervoltage lockout - critical for smartphone and data card power architecture validation and layout optimization.
Technical Context
The TPS657120YFFR implements a dual-mode control architecture: PWM for high-efficiency regulation at medium-to-heavy loads and PFM for ultra-low quiescent current (16 µA per DCDC1/DCDC2, 26 µA for DCDC3) during light-load operation. Its DCDC3 converter supports both register-based and analog VCON-controlled output (0.1–3.6 V), enabling precise RF-PA voltage tuning with 10 µs ramp time in VCON mode.
All regulators are managed through a single 26-MHz MIPI RFFE interface compliant with USID addressing, while parallel pin control (PWRON, CLK_REQ1/2, DCDC3_SEL) allows hardware-triggered sequencing. The internal power-up/down controller is OTP-programmable to support arbitrary startup/shutdown orderings without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.8 V to 5.5 V - supports single-cell Li-ion and USB-powered systems without pre-regulation. |
| DCDC3 Output Current | 2 A continuous - sufficient to drive high-power RF-PAs in LTE/WCDMA front-end modules. |
| LDO Output Voltage Range | 1.2 V to 3.4 V in 50-mV steps - enables fine-grained biasing of RF transceivers and analog baseband circuits. |
| MIPI RFFE Clock | 26 MHz full-speed / 13 MHz half-speed - compatible with standard RFFE v2.0 timing for interoperability with baseband SoCs. |
| Quiescent Current (DCDC1/2) | 16 µA typical in Power Save Mode - extends battery life during idle/sleep states in mobile applications. |
| Package | 30-ball DSBGA (2.5 mm × 2.3 mm, 0.4-mm pitch) - ultra-compact footprint for space-constrained smartphone PCBs. |
| Thermal Shutdown Threshold | 136°C to 160°C rising - protects against thermal runaway during sustained RF transmit bursts. |
Pinout & Package
TPS657120YFFR uses a 30-ball YFF Die-Size Ball-Grid Array (DSBGA) package measuring 2.51 mm × 2.31 mm with 0.4-mm ball pitch. The package is optimized for low-inductance power delivery and thermal dissipation in handheld RF designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VINDCDC1/2 | Input supply for DCDC1 and DCDC2 | Must be tied to same voltage as VINDCDC3 and VIN_ANA to ensure proper LDO2 biasing and sequencing integrity. |
| VDCDC1 / VDCDC2 / VDCDC3 | Feedback inputs for respective DC-DC converters | Enable precision output voltage regulation; require external resistor dividers for programmable settings. |
| SW1 / SW2 / SW3 | Switch node outputs | Connect directly to external inductors; layout must minimize loop area to reduce EMI and switching losses. |
| VINLDO1 / VINLDO2 | LDO input supplies | VINLDO2 must be connected to VIN_ANA (analog supply); VINLDO1 can be sourced from input or pre-regulated rails. |
| SDATA / SCLK | MIPI RFFE serial interface | 26-MHz bidirectional data/clock pair supporting USID-addressed register access and status reporting. |
| nRESET (GPIO0) / ADR_SELECT (GPIO1) | Configurable I/O pins | GPIO0 defaults to active-low reset; GPIO1 serves as RFFE address LSB or general-purpose I/O with 1-mA sink capability. |
| PWRON / CLK_REQ1 / CLK_REQ2 | Hardware enable/control inputs | Allow deterministic, pin-driven power resource activation independent of RFFE interface initialization. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Voltage Scaling (DVS) | DCDC3 supports real-time output adjustment via VCON analog input (0.2–2.1 V) or digital register writes - essential for adaptive RF-PA efficiency optimization. |
| 100% Duty Cycle Operation | Enables lowest dropout operation for DCDC3 when input voltage approaches output, extending battery runtime in deep discharge conditions. |
| Bypass Switch Integration | Dedicated 2.5-A bypass path from VINDCDC3 to VDCDC3 eliminates conversion loss during high-current RF transmit bursts - improves system efficiency by up to 8%. |
| OTP-Configurable Sequencing | Power-up/down order stored in one-time-programmable memory eliminates need for external sequencer ICs or firmware coordination. |
| Low-Noise RF-LDOs | 30 µVrms output noise and 63 dB PSRR (10 Hz–1 kHz) meet stringent spectral purity requirements for RF receiver sensitivity and transmitter ACLR. |
Applications
| Smartphone Baseband Power | RF Power Amplifier Supply |
|---|---|
Use Scenario: Dual-core application processor and modem SoC requiring multiple independent, sequenced voltage rails. IC Role / Device Role / Timing Role: Central PMU providing regulated VDD_CORE (1.2 V), VDD_IO (1.8 V), and VDD_RF (2.65 V) with OTP-defined startup order and MIPI RFFE runtime reconfiguration. Use Value: Reduces BOM count by integrating three DC-DCs and two LDOs in one 2.5 mm × 2.3 mm package, eliminating discrete sequencing logic and saving >12 mm² PCB area. |
Use Scenario: LTE/WCDMA power amplifier module needing fast, accurate voltage scaling during modulation envelope tracking. IC Role / Device Role / Timing Role: DCDC3 acts as primary PA supply with <30 µs ramp time; bypass switch engages during peak transmit for zero-conversion-loss conduction. Use Value: Achieves >90% efficiency at 1.5 A load and supports 10 µs VCON-slewed transitions - critical for maintaining ACLR compliance under dynamic EVM stress. |
| Data Card Modem Power | Mobile Hotspot Baseband |
Use Scenario: USB-powered LTE data dongle with thermal constraints and aggressive sleep/wake cycling. IC Role / Device Role / Timing Role: Delivers standby current of 55 µA and supports ECO mode for LDOs (16 µA quiescent), enabling sub-100 µA system sleep states. Use Value: Extends battery-backed operation time by 3.2× compared to fixed-output PMUs due to intelligent light-load mode selection and ultra-low IQ design. |
Use Scenario: Multi-radio (LTE + Wi-Fi + BT) hotspot requiring isolated, low-noise supplies to prevent cross-talk between transceivers. IC Role / Device Role / Timing Role: RF-LDOs (VLDO1/VLDO2) supply analog sections of separate radios with independent enable control and 47 nF–4.7 µF output capacitance flexibility. Use Value: 63 dB PSRR and <50 mV load transient response suppress supply-induced desensitization, improving concurrent transmission reliability by >12 dB SNR margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS657130YFFR | Same pinout and RFFE interface, but adds fourth DC-DC (300 mA) and removes bypass switch; LDOs unchanged. | Targeted at multi-rail baseband SoCs needing extra core voltage, not RF-PA-centric designs. | Select when additional regulated rail is required and bypass functionality is unnecessary. |
| MAX20029ATG+T | 3-channel buck + 2-channel LDO PMU with I²C interface; no RFFE support; higher IQ (45 µA DCDC), larger 4 mm × 4 mm TQFN. | Suitable for automotive infotainment or industrial modems where RFFE is absent and AEC-Q100 qualification is mandatory. | Choose for non-mobile applications requiring extended temperature range (–40°C to +125°C) and functional safety compliance. |
Compared with TPS657120YFFR, TPS657130YFFR offers expanded rail count at the cost of RF-PA bypass capability, while MAX20029ATG+T trades RFFE interoperability and compact size for automotive-grade robustness and I²C simplicity - making TPS657120YFFR uniquely suited for space- and protocol-constrained mobile RF subsystems.
Availability
TPS657120YFFR is available at Aetrix Electronics and suitable for smartphone baseband power, RF power amplifier supply, data card modem power, and mobile hotspot baseband applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for TPS657120YFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in energy-efficient electronics.
The TPS657120YFFR belongs to TI's Mobile Power Management portfolio, engineered specifically for high-density, low-power wireless handsets and data terminals - emphasizing RF-PA efficiency, MIPI RFFE interoperability, and minimal PCB footprint.
FAQ
What is the maximum supported output current for DCDC3 in TPS657120YFFR?
The TPS657120YFFR supports up to 2.2 A continuous output current from its DCDC3 converter, with a typical rating of 2 A under recommended operating conditions (VIN = 2.8 V to 5.5 V, TA ≤ 85°C). Peak current capability reaches 3.6 A before overcurrent protection triggers, ensuring robust handling of RF-PA burst loads.
Does TPS657120YFFR support dynamic voltage scaling for RF power amplifiers?
Yes, TPS657120YFFR supports dynamic voltage scaling via two independent methods: digital register writes over MIPI RFFE (for coarse steps) and analog VCON input (0.2 V to 2.1 V) for fine-grained, real-time DCDC3 output adjustment between 0.1 V and 3.6 V - enabling envelope tracking and efficiency optimization in LTE/WCDMA PAs.
What is the purpose of the bypass switch in TPS657120YFFR?
The bypass switch in TPS657120YFFR provides a low-resistance (100–170 mΩ) direct conduction path from VINDCDC3 to VDCDC3, engaging during high-current RF transmit events to eliminate DC-DC conversion loss. This improves system efficiency by up to 8% and reduces thermal stress on the PMU during sustained 2-A bursts.
Can TPS657120YFFR operate with a 1.2-V I/O supply (VDDIO)?
Yes, TPS657120YFFR supports VDDIO operation at either 1.2 V or 1.8 V, with corresponding input thresholds (VIH = 0.7 × VDDIO, VIL = 0.3 × VDDIO) and output drive levels (VOH ≥ 0.8 × VDDIO, VOL ≤ 0.2 × VDDIO). The RFFE interface remains fully functional at both voltages, verified per MIPI RFFE v2.0 timing specs.
How is power sequencing configured in TPS657120YFFR?
Power sequencing in TPS657120YFFR is configured using one-time-programmable (OTP) memory, allowing users to define custom power-up and power-down orders for all integrated regulators without external components or firmware intervention. Sequencing parameters are set during manufacturing or programming and persist across power cycles.
TPS657120YFFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 30-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Baseband, RF-PA
- Current - Supply:
- 170µA
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 30-DSBGA
TPS657120YFFR FAQ
1.How can I place an order for TPS657120YFFR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS657120YFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS657120YFFR reliable?
The price and inventory of TPS657120YFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS657120YFFR is usually 5 days.
3.What payment methods are accepted for TPS657120YFFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS657120YFFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS657120YFFR?
TPS657120YFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS657120YFFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS657120YFFR?
For technical support, including TPS657120YFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS657120YFFR requirements.
6.How does Aetrix verify that TPS657120YFFR is sourced from the original manufacturer or authorized distributors?
All TPS657120YFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS657120YFFR meets industry standards.
7.What is the process for return or replacement of TPS657120YFFR?
All TPS657120YFFR units undergo pre-shipment inspection (PSI). If there is an issue with TPS657120YFFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS657120YFFR part is unused and in its original packaging.
Return procedure for TPS657120YFFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS657120YFFR Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
