Texas Instruments TPS65835RKPR

Overview

TPS65835RKPR from Texas Instruments is an integrated power management unit (PMU) with embedded MSP430 microcontroller, designed specifically for active shutter 3D glasses. It combines a linear battery charger (pre-charge/fast-charge/termination), adjustable 8–16 V boost converter, dual full H-bridge analog switches for left/right LC shutters, 2.2 V or 3.0 V LDO, and system power path management - all in a single 40-pin VQFN package.

For engineers reviewing the TPS65835RKPR datasheet, TPS65835RKPR pinout, TPS65835RKPR application, or TPS65835RKPR equivalent, this device enables compact, low-power, synchronized shutter control with integrated battery charging, thermal regulation, and IR/RF communication interface support via its MSP430 core.

Technical Context

The TPS65835RKPR integrates two functionally distinct subsystems: a dedicated power management core (PMIC) handling battery charging, voltage conversion, and H-bridge drive; and an embedded MSP430G2xx-series MCU managing timing-critical shutter sequencing, charger state transitions, and communication protocol decoding (IR, RF, UART, I²C). The PMIC's power path architecture allows simultaneous system operation and battery charging while enforcing DPPM (Dynamic Power Path Management) at the VIN input.

Its H-bridge outputs (LCLP/LCLN/LCRP/LCRN) are driven by the MSP430 via GPIO-controlled logic signals, enabling precise phase-aligned left/right shutter actuation. The boost converter uses internal MOSFETs and supports external inductor selection (4.7–10 µH), with feedback regulation referenced to a 1.20 V ±2.5% internal reference on BST_FB.

Key Specifications

Pinout & Package

TPS65835RKPR is housed in a 40-pin VQFN package (RKP), 4.0 mm × 4.0 mm body size, with exposed thermal pad connected internally to AGND. The package supports fine-pitch PCB layout and efficient thermal dissipation (R_θJB = 9.8 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMU-with-integrated-MCU applications.

Compared with TPS65835RKPR, TPS65834RKPR removes MCU overhead but adds design complexity, while BQ24250RGET reduces integration depth significantly - making TPS65835RKPR uniquely suited for self-contained, ultra-compact 3D glasses requiring both power and intelligence in one die.

Availability

TPS65835RKPR is available at Aetrix Electronics and suitable for active shutter 3D glasses, portable consumer wearables, and low-power wireless synchronization systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for TPS65835RKPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-reliability, low-power IC design for consumer and industrial markets.

The TPS65835RKPR belongs to TI's Active Shutter 3D Power Management portfolio, engineered to consolidate charging, boosting, analog switching, and real-time control into a single chip - specifically targeting miniaturized, battery-operated 3D eyewear with stringent size, power, and timing constraints.

FAQ

What is the primary application target for the TPS65835RKPR?

The TPS65835RKPR is purpose-built for active shutter 3D glasses, integrating all essential power and control functions - including Li-ion battery charging, 8–16 V boost conversion, dual H-bridge analog switches for left/right lens actuation, and an embedded MSP430 microcontroller for real-time synchronization. Its compact 40-pin VQFN package and ultra-low quiescent current (8.6 µA in sleep) directly address the size, power, and timing demands of commercial 3D eyewear designs.

Does the TPS65835RKPR support battery charging with temperature monitoring?

Yes, the TPS65835RKPR supports NTC thermistor-based battery temperature monitoring via the TS pin. It detects a 10-kΩ NTC (β = 3490) and enforces charge inhibition below 0°C (VCOLD = 2100 mV) and above 50°C (VHOT = 300 mV), with hysteresis (300 mV cold, 30 mV hot). Temperature sensing activates only during charging to minimize quiescent current, and the device includes dedicated bias current (75 µA) and comparator circuitry for accurate thermal regulation.

How is the output voltage of the integrated LDO configured on the TPS65835RKPR?

The TPS65835RKPR's LDO output voltage is selected via the VLDO_SET pin (Pin 28): connecting VLDO_SET to DGND configures a 2.2 V output (2.13–2.27 V range), while connecting it to SYS selects a 3.0 V output (2.91–3.09 V range). The LDO delivers up to 30 mA with ≤200 mV dropout at 10 mA load and includes power-good detection (VGOOD_LDO = 1.96 V threshold) to signal valid regulation to the MSP430 core or external logic.

Can the TPS65835RKPR operate without an external microcontroller?

Yes - the TPS65835RKPR embeds a fully functional MSP430G2xx-series microcontroller with 16 kB Flash, 10-bit ADC, UART/I²C/SPI interfaces, and two Timer_A modules. This enables autonomous operation: the MSP430 executes shutter timing algorithms, decodes IR/RF sync signals, monitors battery state, and controls the PMIC's H-bridges and charger without requiring an external host processor. Firmware is field-upgradable via Spy-Bi-Wire (SBWTCK/SBWTIO pins).

What thermal protection mechanisms does the TPS65835RKPR implement?

The TPS65835RKPR implements three-tier thermal protection: (1) Charger thermal regulation between 75°C and 95°C (foldback), (2) Boost converter thermal shutdown at 105°C with 20°C hysteresis, and (3) System-level junction shutdown at 105°C. All sections share the same thermal sensor, and protections are hardware-enforced - no firmware dependency. The 40-pin VQFN package features an exposed thermal pad (R_θJB = 9.8 °C/W) to facilitate heat dissipation in space-constrained 3D glasses assemblies.