Texas Instruments TPS65910A1RSL

Overview

TPS65910A1RSL from Texas Instruments is an integrated power-management IC (PMIC) designed for OMAP- and AM335x-based embedded systems. It delivers three step-down DC-DC converters (VDD1, VDD2, VIO), one step-up 5-V converter (VDD3), eight LDOs, RTC, SmartReflex™ Class 3 interface, and embedded power controller - all in a 48-pin QFN package. It supports single-cell Li-ion or 5-V input and powers dual processor cores, I/O, memory, and analog subsystems.

For engineers reviewing the TPS65910A1RSL datasheet, TPS65910A1RSL pinout, TPS65910A1RSL application, or TPS65910A1RSL equivalent, key selection criteria include SmartReflex Class 3 compatibility with AM335x processors, programmable VDD1/VDD2 output voltage (0.5625 V to 1.5375 V in 12.5-mV steps), thermal shutdown at 125°C, 48-QFN (6 mm × 6 mm) package with exposed thermal pad, and dual I²C interfaces (CTL-I²C and SR-I²C).

Technical Context

The TPS65910A1RSL implements an embedded power controller (EPC) that manages full power sequencing for OMAP systems, including controlled startup, sleep/wake transitions, and reset coordination. Its dual I²C interfaces separate general-purpose control (CTL-I²C) from dynamic voltage scaling commands (SR-I²C), enabling real-time core voltage adjustment without bus contention.

It integrates a 32.768-kHz RTC oscillator with crystal or internal RC option, backup battery management (VBACKUP), and thermal monitoring with die-temperature sensing and automatic shutdown at 125°C. The device supports synchronous switching across all three SMPS channels using either internal 3-MHz clock or external GPIO-synchronized signal.

Key Specifications

Pinout & Package

The TPS65910A1RSL is housed in a 48-pin QFN package (RSL) measuring 6.00 mm × 6.00 mm with an exposed thermal pad (PowerPad) on the bottom. The package uses lead-free NiPdAu plating and is RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power-management IC applications.

Compared with TPS65910A3A1RSL and TPS65217CRSLR, the TPS65910A1RSL uniquely balances broad OMAP/AM335x compatibility, SmartReflex Class 3 support, integrated RTC calendar, and 5-V boost capability - making it optimal for industrial and medical edge devices requiring robust power sequencing and long-term timekeeping.

Availability

TPS65910A1RSL is available at Aetrix Electronics and suitable for industrial HMIs, medical point-of-care instruments, and AM335x-based edge gateways requiring stable component supply, long-lifecycle assurance, and full technical documentation support.

Supply support for TPS65910A1RSL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 90 years of innovation in industrial, automotive, and communications markets.

The TPS65910 product line was engineered specifically for OMAP- and Sitara-based application processors, delivering tightly integrated, sequenced, and dynamically scalable power solutions to reduce system-level complexity and improve energy efficiency.

FAQ

What is the primary processor compatibility of the TPS65910A1RSL?

The TPS65910A1RSL is explicitly validated for TI AM335x processors with DDR2, AM17xx/AM18xx/AM35xx/AM37xx/DM37xx/OMAP-L13x/OMAP35xx series, and select Samsung S5P and Rockchip RK29xx/RK30xx SoCs. Its SmartReflex Class 3 interface and power sequencing logic are tuned for these architectures, and Table 3-1 of the SWCS046U datasheet confirms TPS65910A1RSL as the designated part number for this group. It is not qualified for AM335x with DDR3 - that requires TPS65910A3A1RSL.

Does the TPS65910A1RSL support external clock synchronization for its SMPS regulators?

Yes, the TPS65910A1RSL supports external clock synchronization via the GPIO_CKSYNC pin (QFN pin 39). When configured as a clock input, it allows all three SMPS channels (VDD1, VDD2, VIO) to align their switching edges to an external 3-MHz reference - reducing beat frequencies, lowering EMI emissions, and improving power supply rejection ratio (PSRR) in noise-sensitive analog sections. This feature is documented in Section 1.1 and Figure 1-1 of the SWCS046U datasheet.

What is the function of the VBACKUP pin on the TPS65910A1RSL?

The VBACKUP pin (QFN pin 27) on the TPS65910A1RSL accepts a backup power source - typically a 5–15 mF supercapacitor or coin cell - to maintain RTC operation and backup registers during main power loss. The device automatically switches to VBACKUP when VCC7 drops below ~2.7 V and disables charging if VBACKUP exceeds VCC7, preventing reverse current. This enables uninterrupted calendar/timekeeping and alarm functionality for up to 72 hours with a 10-mF capacitor, as specified in Section 6.6 of the SWCS046U datasheet.

How does the TPS65910A1RSL handle power sequencing for multi-rail systems?

The TPS65910A1RSL incorporates a hardware-based Embedded Power Controller (EPC) that executes fully configurable, deterministic power-up and power-down sequences without host CPU involvement. It manages enable timing, reset assertion/deassertion, and inter-rail dependencies (e.g., VAUX33 must be enabled before VDD3 boost) via internal state machine and register-controlled delays. This eliminates the need for external sequencing ICs or complex firmware, and is detailed in Section 6.3 of the SWCS046U datasheet.

What are the thermal design requirements for the TPS65910A1RSL in continuous operation?

The TPS65910A1RSL requires careful thermal design due to its 2.5-W typical power dissipation. With R_θJA = 37°C/W (still air), junction temperature rise exceeds safe limits (>125°C) above ~65°C ambient unless properly cooled. A minimum 4×4 mm thermal pad with ≥6 thermal vias to inner ground planes, 2-oz copper, and 200 mm² copper pour is required. Section 5.4 of the SWCS046U datasheet specifies R_θJB = 5.6°C/W, confirming board-level conduction is the dominant cooling path - making PCB layout critical for reliability.