Texas Instruments TPS65910A1RSLR

Overview

TPS65910A1RSLR from Texas Instruments is an integrated power-management IC (PMIC) designed for OMAP- and AM335x-based portable systems. It delivers three step-down DC-DC converters (VDD1, VDD2, VIO), one step-up 5-V converter (VDD3), eight LDOs, and a real-time clock with 32.768-kHz crystal support - all in a 48-pin QFN package. It enables SmartReflex™ Class 3 dynamic voltage scaling for dual processor cores in battery-powered industrial handhelds.

For engineers reviewing the TPS65910A1RSLR datasheet, TPS65910A1RSLR pinout, TPS65910A1RSLR application, or TPS65910A1RSLR equivalent, key selection criteria include verified SmartReflex Class 3 interface compatibility, confirmed 48-QFN (6 mm × 6 mm) thermal performance (R_θJA = 37°C/W), validated RTC alarm and backup battery management, and I²C-controlled LDO sequencing for multi-rail OMAP power trees.

Technical Context

The TPS65910A1RSLR implements an embedded power controller (EPC) to enforce strict power-on/off sequencing for OMAP processors, including configurable boot states via BOOT0/BOOT1 pins and hardware-controlled SLEEP state transitions. Its dual I²C interfaces - one for general control (CTL-I2C), one dedicated to SmartReflex Class 3 (SR-I2C) - enable independent voltage scaling of VDD1 and VDD2 based on processor activity.

It integrates analog resources including a precision bandgap reference (VREF), RTC oscillator with ±20 ppm crystal tolerance support, and thermal shutdown protection triggered at 125°C junction temperature. The device supports both external 32.768-kHz crystal (OSC32KIN/OSC32KOUT) and internal RC oscillator modes, with CLK32KOUT providing buffered output.

Key Specifications

Pinout & Package

TPS65910A1RSLR uses a 48-pin QFN (RSL) package with 0.4-mm pitch and exposed thermal pad (PowerPad). Pin functions are validated per TI SWCS046U datasheet Section 4.1 and Figure 4-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with TPS65910A1RSLR, TPS659121A1RSLR offers expanded configurability and newer processor support but requires firmware revalidation, while TPS65217CRSLR reduces BOM count and cost at the expense of SmartReflex DVFS and full RTC functionality.

Availability

TPS65910A1RSLR is available at Aetrix Electronics and suitable for industrial handheld terminals, OMAP-based embedded controllers, and AM335x edge gateways requiring stable component supply, long-lifecycle support, and qualified automotive-grade thermal performance.

Supply support for TPS65910A1RSLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management technologies.

The TPS65910 product line was engineered specifically to address the complex multi-rail, sequencing, and dynamic voltage scaling requirements of OMAP and Sitara application processors in portable and industrial systems.

FAQ

What is the package type and thermal performance of the TPS65910A1RSLR?

The TPS65910A1RSLR uses a 48-pin QFN (RSL) package measuring 6.0 mm × 6.0 mm with an exposed thermal pad. Its thermal resistance is characterized as R_θJA = 37°C/W (still air), R_θJC = 16.4°C/W (top), and R_θJB = 5.6°C/W - enabling reliable operation up to 85°C ambient when mounted on a 2-layer PCB with adequate copper pour under the PowerPad. This matches TI's JEDEC 2S2P test board standard.

Does the TPS65910A1RSLR support SmartReflex Class 3 dynamic voltage scaling?

Yes, the TPS65910A1RSLR supports SmartReflex Class 3 via its dedicated SR-I²C interface (pins SDASR_EN2 and SCLSR_EN1). This allows real-time, closed-loop adjustment of VDD1 and VDD2 output voltages based on processor AVS feedback - a requirement for OMAP3/AM335x platforms. The CTL-I²C interface handles all other register configuration and monitoring tasks independently.

How does the RTC function operate in backup mode on the TPS65910A1RSLR?

In backup mode, the TPS65910A1RSLR powers its RTC circuitry from the VBACKUP pin using a coin cell or supercapacitor. The VRTC LDO remains active, sustaining the RTC registers and oscillator. With a 10 µF backup capacitor, the RTC retains time/date/alarm settings for over 10 years at room temperature. The device draws less than 1 µA from VBACKUP in this state, as specified in Section 5.13 of the SWCS046U datasheet.

Can the TPS65910A1RSLR be used with AM335x processors?

Yes, the TPS65910A1RSLR is explicitly qualified for AM335x processors, as documented in TI's SWCU093 User's Guide and Table 3-1 of the SWCS046U datasheet. It supports AM335x with DDR2 and DDR3 memory configurations, providing all required rails (VDD1, VDD2, VIO, VDD3, VAUX1/2, VDAC, VPLL) and hardware sequencing signals (PWRON, PWRHOLD, BOOT0/1) needed for robust boot.

What are the key differences between TPS65910A1RSLR and TPS65217CRSLR?

The TPS65910A1RSLR includes SmartReflex Class 3, full RTC with alarm, VBACKUP management, and eight LDOs - features absent in the TPS65217CRSLR. While both are 48-QFN and AM335x-compatible, the TPS65217CRSLR has only six LDOs, no RTC alarm, no backup battery support, and operates I²C at 400 kHz (vs. 3.4 MHz on TPS65910A1RSLR). Use TPS65910A1RSLR when advanced power management and timekeeping are required.