My Inquiry
My Account
Texas Instruments TPS6591102A2ZRC
- Part No.:
- TPS6591102A2ZRC
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 98-VFBGA
- Datasheet:
-
TPS6591102A2ZRC.pdf
- Description:
- IC PWR MGMT CONV 8LDO 98BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,030
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS6591102A2ZRC from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, RTC with 32.768-kHz crystal support, and nine GPIOs - designed for single-cell Li-ion or 5-V powered portable systems requiring multi-rail sequencing and dynamic voltage scaling.
For engineers reviewing the TPS6591102A2ZRC datasheet, TPS6591102A2ZRC pinout, TPS6591102A2ZRC application, or TPS6591102A2ZRC equivalent, this page delivers verified specifications, validated BGA-98 pin mapping, confirmed I²C-controlled DVS operation, thermal shutdown behavior, and real-world use cases in handheld processors and battery-powered embedded platforms.
Technical Context
The TPS6591102A2ZRC implements a hierarchical power architecture: dual core SMPS (VDD1/VDD2) support independent dynamic voltage scaling via dedicated high-speed I²C interface, while VIO SMPS supplies I/O and memory rails at up to 1.3 A. The VDDCtrl controller drives external FETs for high-current rails, and all eight LDOs (including RTC LDO) are digitally programmable with 50-mV or 100-mV resolution.
Its embedded power controller (EPC) executes EEPROM-programmable power-up/down sequences, synchronized by internal state machine and triggered by EN1/EN2 or GPIOs. The integrated RTC includes calendar, alarm, and backup battery charging, and two comparators monitor VCCS for system-level fault detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 SMPS Output | 0.6–3.3 V, 1.5 A max - powers primary processor core with DVS support |
| VDD2 SMPS Output | 0.6–3.3 V, 1.5 A max - powers secondary processor core with independent DVS |
| VIO SMPS Output | 1.5 V @ 1.3 A, 1.8 V @ 1.2 A, 2.5/3.3 V @ 1.1 A - supplies I/O and memory subsystems |
| LDO Count & Range | 8 general-purpose LDOs + 1 RTC LDO; output range 1.0–3.3 V in 50-mV or 100-mV steps |
| I²C Interface | High-speed (up to 400 kHz), dual-role: general control (CTL-I²C) and dedicated VDD1/VDD2 scaling |
| RTC Accuracy | 32.768-kHz crystal oscillator ±20 ppm typical; supports calendar, alarm, and backup battery charging |
| Package | 98-pin BGA MicroStar Junior™, 9.0 mm × 6.0 mm, 0.65-mm pitch - optimized for compact portable PCB layouts |
Pinout & Package
TPS6591102A2ZRC is housed in a 98-ball, 0.65-mm pitch BGA MicroStar Junior™ package (ZRC), measuring 9.0 mm × 6.0 mm. Thermal performance is enhanced by exposed thermal pad on underside (AGND balls at D6, E5, E6, F5, G4, H5, H6, J3, J4, J6, K3, M8, N8).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1, VDD2, VIO | SMPS regulated outputs | Core processor (dual), I/O/memory rails - each with dedicated feedback (VFB1/VFB2/VFBIO) and switching nodes (SW1/SW2/SWIO) |
| EN1 / EN2 | Multi-function digital I/O | Configurable as enable signals for power resources or as dedicated I²C clock/data lines for VDD1/VDD2 DVS |
| SCL_SCK / SDA_SDI | Primary I²C interface | Bidirectional high-speed control bus for register access, sequencing, and LDO/SMPS configuration |
| GPIO0–GPIO8 | Configurable digital I/O | Nine pins supporting push-pull/OD modes; four integrated into power-up sequence; two drive LEDs (10 mA sink) |
| OSC32KIN / OSC32KOUT | RTC oscillator interface | Supports external 32.768-kHz crystal or internal RC oscillator; CLK32KOUT provides buffered 32-kHz output |
| HDRST / PWRDN / NRESPWRON | Reset & power control | Cold reset (asynchronous), thermal/power-init reset input, and open-drain power-off reset output |
Key Features
| Feature | Design Value |
|---|---|
| EEPROM-programmable power sequencing | Enables custom boot/shutdown order across all 12 power rails without firmware changes |
| Dual-core DVS via dedicated I²C | Reduces dynamic power by independently scaling VDD1 and VDD2 voltages during CPU load transitions |
| Integrated RTC with calendar & alarm | Eliminates need for external RTC IC; retains time/date during main power loss using VBACKUP supply |
| VDDCtrl external-FET controller | Supports high-current rails (>6 A) with adjustable slew rate (5 mV/µs) and overcurrent protection |
| 9 GPIOs with multiplexed functions | Four assigned to power sequencing; two support LED drive (10 mA); all configurable as interrupt-capable GPI |
| Thermal monitoring & shutdown | Detects hot-die condition and triggers automatic shutdown at >125°C junction temperature |
Applications
| Smartphone Application Processor Power | Tablet SoC Power Management |
|---|---|
|
Use Scenario: Powers NVIDIA T30 application processor in smartphone form factor with DDR2/DDR3 memory. IC Role / Device Role / Timing Role: PMIC providing sequenced VDD1/VDD2 cores, VIO I/O rail, eight LDOs for peripherals, and RTC for always-on timekeeping. Use Value: Enables dynamic voltage scaling per core to reduce active power by up to 35% versus fixed-voltage solutions. |
Use Scenario: Manages power for AM387x/DM814x processors in 7–10 inch tablets with multi-layer PCB constraints. IC Role / Device Role / Timing Role: Centralized power hub delivering 12 regulated rails, EEPROM-configurable startup timing, and 32-kHz RTC synchronization. Use Value: Reduces BOM count by replacing six discrete regulators and external RTC, saving >25 mm² PCB area. |
| Industrial Handheld Terminal | Medical Portable Monitor |
|
Use Scenario: Powers ARM-based controller in ruggedized barcode scanner with battery backup and low-power sleep mode. IC Role / Device Role / Timing Role: Delivers stable VDDIO (1.8 V), VDD1 (1.2 V), and RTC LDO (VRTC) while supporting wake-on-GPIO and watchdog reset. Use Value: Achieves <5 µA quiescent current in SLEEP state via programmable LDO biasing and GPIO power gating. |
Use Scenario: Supplies critical rails for patient-monitor SoC requiring FDA-compliant power integrity and battery runtime extension. IC Role / Device Role / Timing Role: Provides isolated, low-noise LDOs (LDO1–LDO4) for analog front-end, plus VDDCtrl-controlled high-current rail for display backlight. Use Value: Meets IEC 60601-1 ripple requirements (<10 mVpp) on LDO outputs and supports 72-hour backup runtime via VBACKUP charging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS659122A2ZRC | Same ZRC package, identical pinout, but adds USB OTG support and removes VDDCtrl controller | Targeted at USB-host devices; lacks external-FET control needed for high-current rails | Select when USB connectivity is required and VDDCtrl functionality is unnecessary |
| TPS65910A3ZRCR | 98-pin ZRC, same footprint, but only two SMPS (no VIO), reduced LDO count (6), no RTC | Lower-cost option for simpler processors without I/O rail or calendar requirements | Choose for cost-sensitive designs where VIO rail and RTC are omitted |
Compared with TPS6591102A2ZRC, TPS659122A2ZRC retains full compatibility but trades VDDCtrl for USB PHY, while TPS65910A3ZRC reduces feature set to cut cost - making the TPS6591102A2ZRC optimal for complex, battery-backed, multi-rail applications requiring full sequencing, DVS, and RTC.
Availability
TPS6591102A2ZRC is available at Aetrix Electronics and suitable for smartphone application processor power, tablet SoC management, industrial handheld terminals, medical portable monitors, and battery-backed embedded systems requiring stable component supply and long-term lifecycle support.
Supply support for TPS6591102A2ZRC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability PMIC design for mobile and industrial markets.
The TPS65911 family was engineered specifically for multi-core application processors in portable systems, integrating sequencing, DVS, RTC, and flexible LDO/SMPS combinations to replace discrete power solutions in space-constrained designs.
FAQ
What is the primary function of the TPS6591102A2ZRC in a portable system?
The TPS6591102A2ZRC serves as a fully integrated power management IC that delivers and sequences 12 regulated power rails-including dual-core SMPS with dynamic voltage scaling, an I/O SMPS, an external-FET controller, eight LDOs, and a real-time clock-for application processors in smartphones, tablets, and handheld devices. Its EEPROM-programmable EPC enables deterministic boot timing without host intervention.
Does the TPS6591102A2ZRC support dynamic voltage scaling for both processor cores?
Yes, the TPS6591102A2ZRC supports independent dynamic voltage scaling for VDD1 and VDD2 through a dedicated high-speed I²C interface (EN1/EN2 pins), allowing real-time adjustment of core voltages based on CPU load-verified in TI's SWCS049S datasheet Section 1.1 and Electrical Characteristics Tables 5.14–5.15.
What package type and pin count does the TPS6591102A2ZRC use?
The TPS6591102A2ZRC uses a 98-ball BGA MicroStar Junior™ package (ZRC code), with 9.0 mm × 6.0 mm body size and 0.65-mm ball pitch. Pin configuration is documented in Figures 4-1 and 4-2 of the SWCS049S datasheet, and thermal pad connections are confirmed across 13 AGND balls.
Can the TPS6591102A2ZRC operate from a single Li-ion battery?
Yes, the TPS6591102A2ZRC is explicitly designed for single-cell Li-ion (3.0–4.5 V), Li-polymer, or 5-V input sources-as stated in Section 1.3 of the SWCS049S datasheet-and supports full functionality including RTC backup, LDO regulation, and SMPS operation across its specified input ranges.
How does the embedded power controller (EPC) in the TPS6591102A2ZRC improve system reliability?
The EPC in the TPS6591102A2ZRC executes EEPROM-stored power-up/down sequences independent of host software, ensuring repeatable, glitch-free rail activation-even during brownout or cold-start conditions. This eliminates dependency on bootloader timing and prevents improper sequencing that could damage SoCs or memory interfaces.
TPS6591102A2ZRC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 98-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Portable Equipment
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 98-BGA MICROSTAR JUNIOR (9x6)
TPS6591102A2ZRC FAQ
1.How can I place an order for TPS6591102A2ZRC through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6591102A2ZRC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6591102A2ZRC reliable?
The price and inventory of TPS6591102A2ZRC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6591102A2ZRC is usually 5 days.
3.What payment methods are accepted for TPS6591102A2ZRC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS6591102A2ZRC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS6591102A2ZRC?
TPS6591102A2ZRC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6591102A2ZRC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6591102A2ZRC?
For technical support, including TPS6591102A2ZRC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6591102A2ZRC requirements.
6.How does Aetrix verify that TPS6591102A2ZRC is sourced from the original manufacturer or authorized distributors?
All TPS6591102A2ZRC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6591102A2ZRC meets industry standards.
7.What is the process for return or replacement of TPS6591102A2ZRC?
All TPS6591102A2ZRC units undergo pre-shipment inspection (PSI). If there is an issue with TPS6591102A2ZRC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6591102A2ZRC part is unused and in its original packaging.
Return procedure for TPS6591102A2ZRC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS6591102A2ZRC Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
