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Texas Instruments TPS6591102A2ZRCR
- Part No.:
- TPS6591102A2ZRCR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 98-VFBGA
- Datasheet:
-
TPS6591102A2ZRCR.pdf
- Description:
- IC PWR MGMT CONV 8LDO 98BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,694
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Product details
Overview
TPS6591102A2ZRCR from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, RTC with 32.768-kHz crystal support, and nine configurable GPIOs - designed for single-cell Li-Ion or 5-V powered portable systems.
For engineers reviewing the TPS6591102A2ZRCR datasheet, TPS6591102A2ZRCR pinout, TPS6591102A2ZRCR application, or TPS6591102A2ZRCR equivalent, this device supports dynamic voltage scaling for dual-core processors, provides I²C-controlled power sequencing, integrates thermal shutdown and watchdog functions, and delivers precise 32-kHz clocking with alarm and calendar capabilities in a compact 98-ball BGA package.
Technical Context
The TPS6591102A2ZRCR implements a hierarchical power architecture with two core SMPS (VDD1/VDD2) supporting DVS via dedicated high-speed I²C interface, plus a third SMPS (VIO) for I/O and memory rails. Its embedded power controller (EPC) executes EEPROM-programmable boot-up and state-transition sequences independent of host processor control.
Real-time clock functionality includes oscillator selection (32.768-kHz crystal or internal RC), date/time/calendar registers, and alarm interrupt generation. The device supports dual I²C interfaces: one general-purpose (CTL-I²C) and a second dedicated to voltage scaling (EN1/EN2 pins repurposed as SCL/SDA), enabling concurrent system control and core rail optimization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 SMPS Output | 0.6 V to 3.3 V, 1.5 A max - supplies primary processor core with DVS support |
| VDD2 SMPS Output | 0.6 V to 3.3 V, 1.5 A max - supplies secondary processor core with independent DVS |
| VIO SMPS Output | 1.3 V to 3.3 V, 1.3 A max - powers I/O peripherals and DDR memory interface |
| LDO Count & Range | Eight user-programmable LDOs: five at 1–3.3 V (100-mV steps), three at 1–3.3 V (50-mV steps) |
| RTC Accuracy | ±5 ppm typical with 32.768-kHz crystal - enables precision timekeeping without external timing reference |
| I²C Interface Speed | Up to 400 kHz standard-mode - supports fast register access and real-time rail reconfiguration |
| Package | 98-ball BGA (ZRC), 0.65-mm pitch, 9.0 mm × 6.0 mm - optimized for space-constrained handheld PCB layouts |
Pinout & Package
TPS6591102A2ZRCR uses a 98-pin MicroStar™ Junior BGA (ZRC) package with 0.65-mm ball pitch and 9.0 mm × 6.0 mm body size. Pin functions are validated per TI's official pin attributes table (SWCS049S, Rev. August 2018).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1 / SW2 / SWIO | Switch node outputs | Drive external inductors for VDD1, VDD2, and VIO SMPS; require low-ESR ceramic output capacitors |
| VFB1 / VFB2 / VFBIO | Feedback inputs | Resistor-divider inputs setting output voltage; internally biased at 0.6 V reference |
| EN1 / EN2 | Dual-function I/O | Configurable as enable signals or dedicated I²C lines for VDD1/VDD2 voltage scaling |
| OSC32KIN / OSC32KOUT | RTC oscillator interface | Supports 32.768-kHz crystal connection; internal load capacitance eliminates need for external caps |
| GPIO0–GPIO8 | Configurable digital I/O | Nine pins with programmable direction, pull-up/down, interrupt capability, and two with 10-mA LED sink |
Key Features
| Feature | Design Value |
|---|---|
| EEPROM-programmable EPC | Enables fully autonomous power-up, sleep/wake, and fault-recovery sequences without host intervention |
| Dual I²C interfaces | Separates system-level control (CTL-I²C) from real-time core voltage scaling (DVS-I²C), preventing bus contention |
| Integrated RTC with alarm | Provides calendar, time-of-day, and programmable wake-up events using internal 32-kHz oscillator or crystal |
| Thermal monitoring & shutdown | Detects die temperature exceeding 125°C and forces safe shutdown; hot-die detection triggers NRESPWRON |
| Backup battery management | VBACKUP input supports coin-cell backup for RTC and registers during main power loss (VRTC domain retention) |
| Programmable GPIOs | Nine pins support push-pull/OD modes, maskable interrupts, LED drive, and DC-DC synchronization clock output |
Applications
| Smartphone Application Processor Power | Tablet SoC Power Management |
|---|---|
|
Use Scenario: Dual-core ARM-based application processor requiring independent voltage scaling and coordinated power sequencing. IC Role / Device Role / Timing Role: Primary PMIC managing VDD1/VDD2 core rails, VIO I/O rail, LDOs for peripherals, and RTC-backed wake-up timing. Use Value: Enables dynamic power optimization across CPU/GPU clusters while maintaining sub-100 µs transition times between performance states. |
Use Scenario: High-resolution display tablet with DDR3 memory, multi-sensor hub, and always-on RTC. IC Role / Device Role / Timing Role: Centralized power controller delivering regulated rails, managing DDR termination, and providing accurate 32-kHz timebase for suspend/resume. Use Value: Reduces BOM count by integrating eight LDOs and eliminates need for discrete RTC crystal and backup circuitry. |
| Industrial Handheld Terminal | Medical Portable Monitor |
|
Use Scenario: Ruggedized barcode scanner with cold-start requirement and battery-backed data logging. IC Role / Device Role / Timing Role: Power sequencer with EEPROM-stored boot profile, RTC for timestamped event logging, and GPIOs for button/LED control. Use Value: Guarantees deterministic power-up sequence across temperature extremes and preserves time/date during battery swaps. |
Use Scenario: Battery-powered patient monitor requiring FDA-compliant power integrity and low-power sleep mode. IC Role / Device Role / Timing Role: Safety-critical PMIC supplying isolated analog/digital domains, monitoring thermal limits, and generating precise alarm intervals. Use Value: Meets IEC 62304 Class C requirements via hardware-enforced thermal shutdown and watchdog-triggered reset escalation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS659122A2ZRCR | Same pinout and feature set; differs in EEPROM configuration defaults and supported processor memory interface (DDR3L vs DDR3) | Targeted at TI AM57xx/AM65xx processors with DDR3L memory; lacks some GPIO remapping options present in TPS6591102A2ZRCR | Select when designing for Sitara AM65x platforms requiring DDR3L timing compliance and lower standby current. |
| TPS65910A3ZRCR | 98-ball ZRC package, but only two SMPS (VDD1/VIO), no VDD2 rail or VDDCtrl controller; reduced LDO count (6 total) | Suitable for single-core applications; lacks dual-core DVS and external FET control needed for high-current rails | Choose for cost-sensitive single-core designs where VDD2 and VDDCtrl functionality are unnecessary. |
Compared with TPS6591102A2ZRCR, TPS659122A2ZRCR offers identical hardware but different factory EEPROM settings for DDR3L compatibility, while TPS65910A3ZRCR reduces integration depth-omitting VDD2 SMPS and VDDCtrl-to lower cost and complexity for less demanding SoCs.
Availability
TPS6591102A2ZRCR is available at Aetrix Electronics and suitable for smartphone application processor power, tablet SoC power management, industrial handheld terminals, medical portable monitors, and battery-backed RTC systems requiring stable component supply and long-term lifecycle support.
Supply support for TPS6591102A2ZRCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in energy-efficient IC design.
The TPS65911 family was engineered specifically for high-performance mobile and portable applications requiring tightly coordinated multi-rail power delivery, programmable sequencing, and integrated real-time clock functionality - targeting NVIDIA Tegra and compatible application processors.
FAQ
What is the maximum output current capability of the VDD1 SMPS in TPS6591102A2ZRCR?
The VDD1 SMPS in TPS6591102A2ZRCR delivers up to 1.5 A continuous output current across its 0.6 V to 3.3 V adjustable range. This rating is verified under recommended operating conditions with proper thermal management and external components per TI's layout guidelines. The TPS6591102A2ZRCR datasheet specifies peak current limit thresholds and soft-start behavior to ensure reliable startup into heavy loads.
Does TPS6591102A2ZRCR support external crystal oscillators for the RTC function?
Yes, TPS6591102A2ZRCR supports a 32.768-kHz external crystal connected between OSC32KIN and OSC32KOUT pins. The device includes internal load capacitance and bias circuitry, eliminating the need for external capacitors. It also offers a built-in 32-kHz RC oscillator as a fallback when crystal operation is not required or unavailable.
Can EN1 and EN2 pins on TPS6591102A2ZRCR be used simultaneously as both enable signals and I²C lines?
No - EN1 and EN2 on TPS6591102A2ZRCR are multiplexed: they operate either as general-purpose enable inputs or as dedicated I²C clock/data lines for VDD1/VDD2 dynamic voltage scaling, but not both simultaneously. Configuration is controlled via EEPROM programming and cannot be changed dynamically during operation.
What is the purpose of the VDDCtrl controller in TPS6591102A2ZRCR?
The VDDCtrl controller in TPS6591102A2ZRCR drives external high-side and low-side FETs to generate a programmable output voltage (0.6 V to 1.4 V) with up to 6 A peak current capability. It includes slew-rate control, current limiting, and thermal protection - enabling high-efficiency, high-current rails beyond the capacity of integrated SMPS stages.
How does the embedded power controller (EPC) in TPS6591102A2ZRCR execute power sequencing?
The EPC in TPS6591102A2ZRCR executes power-on, power-off, and state-transition sequences stored in on-chip EEPROM. These sequences define timing delays, voltage ramp rates, inter-rail dependencies, and fault-handling logic - all autonomously, without host processor involvement. The TPS6591102A2ZRCR EPC supports up to 128 programmable steps with conditional branching based on GPIO or comparator inputs.
TPS6591102A2ZRCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 98-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Portable Equipment
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 98-BGA MICROSTAR JUNIOR (9x6)
TPS6591102A2ZRCR FAQ
1.How can I place an order for TPS6591102A2ZRCR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6591102A2ZRCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6591102A2ZRCR reliable?
The price and inventory of TPS6591102A2ZRCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6591102A2ZRCR is usually 5 days.
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TPS6591102A2ZRCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6591102A2ZRCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6591102A2ZRCR?
For technical support, including TPS6591102A2ZRCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6591102A2ZRCR requirements.
6.How does Aetrix verify that TPS6591102A2ZRCR is sourced from the original manufacturer or authorized distributors?
All TPS6591102A2ZRCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6591102A2ZRCR meets industry standards.
7.What is the process for return or replacement of TPS6591102A2ZRCR?
All TPS6591102A2ZRCR units undergo pre-shipment inspection (PSI). If there is an issue with TPS6591102A2ZRCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6591102A2ZRCR part is unused and in its original packaging.
Return procedure for TPS6591102A2ZRCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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