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Texas Instruments TPS6591102AA2ZRCR
- Part No.:
- TPS6591102AA2ZRCR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 98-VFBGA
- Datasheet:
-
TPS6591102AA2ZRCR.pdf
- Description:
- IC PWR MGMT 9LDO 98BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,049
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Product details
Overview
TPS6591102AA2ZRCR from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, RTC with 32.768-kHz crystal support, and nine GPIOs - designed for single-cell Li-ion or 5-V powered portable systems requiring multi-rail sequencing and dynamic voltage scaling.
For engineers reviewing the TPS6591102AA2ZRCR datasheet, TPS6591102AA2ZRCR pinout, TPS6591102AA2ZRCR application, or TPS6591102AA2ZRCR equivalent, this device serves as a flexible, I²C-configurable PMIC for processor core and I/O rail management in resource-constrained handheld platforms where thermal monitoring, backup battery support, and programmable power-up sequences are critical.
Technical Context
The TPS6591102AA2ZRCR implements a hierarchical power architecture: dual-core SMPS (VDD1/VDD2) support independent DVS via dedicated high-speed I²C interface, while VIO SMPS delivers up to 1.3 A at 1.5 V for memory and peripherals. The VDDCtrl controller supports external high-current FETs with programmable slew rate and overcurrent protection using TRIP pin sensing.
Its embedded power controller (EPC) executes EEPROM-programmable sequencing across 12 power domains, including LDO enable timing, reset coordination (HDRST/PWRDN/NRESPWRON), and SLEEP state transitions. The RTC subsystem integrates oscillator, calendar, alarm, and VRTC LDO (250 µA quiescent, 1.2–3.3 V output), all backed by VBACKUP input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 SMPS Output | 0.6–3.3 V, 1.5 A max - powers primary processor core with DVS support |
| VDD2 SMPS Output | 0.6–3.3 V, 1.5 A max - powers secondary processor core with independent DVS |
| VIO SMPS Output | 1.5 V @ 1.3 A, 1.8 V @ 1.2 A, 2.5/3.3 V @ 1.1 A - supplies I/O and DDR memory rails |
| LDO Count & Range | Eight user-programmable LDOs: five at 1–3.3 V (100-mV steps), three at 1–3.3 V (50-mV steps) |
| RTC Accuracy | ±5 ppm typical with 32.768-kHz crystal; ±500 ppm with internal 32-kHz RC oscillator |
| I²C Interface | High-speed mode (3.4 Mbps), dual-role: general control (CTL-I²C) and dedicated VDD1/VDD2 scaling |
| Package | 98-pin BGA MicroStar™ Junior (ZRC), 9.0 mm × 6.0 mm, 0.65-mm pitch |
Pinout & Package
TPS6591102AA2ZRCR is housed in a 98-ball BGA MicroStar™ Junior (ZRC) package with 0.65-mm pitch, optimized for compact portable PCB layouts and thermal dissipation via bottom-side AGND/GNDC balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1 / SW2 / SWIO | Switch node outputs | Drive external inductors for VDD1, VDD2, and VIO SMPS; require low-ESR ceramic output capacitors |
| VFB1 / VFB2 / VFBIO | Feedback inputs | Resistive divider inputs setting VDD1/VDD2/VIO output voltages; 5-µA bias current enables high-impedance dividers |
| EN1 / EN2 | Multi-function digital I/O | Configurable as enable signals for power resources or dedicated I²C clock/data lines for DVS |
| GPIO0–GPIO8 | Configurable digital I/O | Nine pins supporting push-pull/OD modes; four integrate into power-up sequence; two sink 10 mA for LED drive |
| OSC32KIN / OSC32KOUT | RTC crystal interface | Supports 32.768-kHz tuning-fork crystal; internal load capacitance eliminates external caps in basic configurations |
Key Features
| Feature | Design Value |
|---|---|
| EEPROM-programmable EPC | Enables field-updatable power sequencing logic without hardware changes or firmware updates |
| Dual dedicated I²C interfaces | Separate CTL-I²C for system control and DVS-I²C for real-time core voltage scaling with minimal latency |
| VDDCtrl external-FET controller | Supports high-current rails up to 6 A via external MOSFETs with adjustable slew rate and OCL detection |
| RTC with backup capability | Maintains time/calendar during main power loss using VBACKUP input; includes alarm and wake-on-event interrupt |
| Thermal shutdown & hot-die detection | Triggers automatic shutdown at >125°C junction; asserts NRESPWRON on thermal fault for system-level reset coordination |
| Programmable GPIOs with LED drivers | Two GPIOs deliver 10-mA sink current for direct LED drive; all nine support maskable interrupts for wakeup events |
Applications
| Smartphone Application Processor Power | Tablet SoC Core & I/O Management |
|---|---|
Use Scenario: Powers NVIDIA T30 dual-core Cortex-A9 application processor in smartphone form factor with Li-ion battery input. IC Role / Device Role / Timing Role: Primary PMIC managing VDD1/VDD2 DVS, VIO memory rail, RTC, and boot sequencing per EEPROM configuration. Use Value: Enables adaptive performance scaling and <100-µA RTC backup current, extending standby time beyond 14 days on coin-cell backup. |
Use Scenario: Supplies Freescale i.MX6 QuadPlus SoC in 10-inch tablet with DDR3L memory and display interface. IC Role / Device Role / Timing Role: Delivers sequenced 1.2-V core, 1.35-V GPU, and 3.3-V I/O rails; coordinates PWRHOLD/SLEEP transitions for fast suspend/resume. Use Value: Reduces board area by consolidating 12 power domains into single ZRC package; eliminates discrete sequencing logic and external RTC. |
| Industrial Handheld Terminal | Medical Portable Monitor |
Use Scenario: Powers ARM-based terminal running Linux with barcode scanner, Wi-Fi, and ruggedized display under 5-V adapter input. IC Role / Device Role / Timing Role: Manages VDD1/VDD2 cores, VIO for peripherals, eight LDOs for sensors/UARTs, and watchdog-triggered safe shutdown. Use Value: Ensures deterministic power-up within 120 ms and thermal fault response <500 µs - meeting IEC 60601-1 safety timing requirements. |
Use Scenario: Powers clinical-grade portable ECG monitor with analog front-end, LCD, Bluetooth LE, and 72-hour battery life target. IC Role / Device Role / Timing Role: Supplies ultra-low-noise 2.5-V LDOs for ADC reference, 3.3-V for microcontroller, and RTC-backed timestamping of vital signs. Use Value: Achieves <15 µV RMS output noise on LDO3/LDO4 and 250-µA RTC quiescent current - enabling >72-hr operation on 1,200-mAh cell. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65912102AA2ZRCR | Same pinout and register map; adds USB OTG VBUS detection and enhanced I²C error recovery | Better suited for designs requiring host-mode USB charging negotiation and robust bus fault handling | Select when USB OTG functionality or improved I²C resilience under noisy conditions is required |
| TPS65917ZQW | 100-ball BGA (0.65-mm pitch); supports DDR3L/DDR4; lacks VDDCtrl controller and RTC crystal oscillator | Targeted at newer TI Sitara AM6x processors; requires external RTC and discrete high-current FET driver | Choose for AM65x/AM62x-based designs needing DDR4 support but accepting increased BOM count and layout complexity |
Compared with TPS6591102AA2ZRCR, TPS65912102AA2ZRCR offers identical power architecture with added USB features, while TPS65917ZQW trades RTC integration and VDDCtrl flexibility for DDR4 compatibility - making the original optimal for legacy T30/i.MX6 platforms requiring self-contained timing and high-current scalability.
Availability
TPS6591102AA2ZRCR is available at Aetrix Electronics and suitable for smartphone power management, industrial handheld terminals, medical portable monitors, and tablet SoC applications requiring stable component supply and long-term lifecycle support.
Supply support for TPS6591102AA2ZRCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability PMIC design for mobile and industrial markets.
The TPS65911 family was engineered specifically for multi-core application processors in battery-powered portable devices, emphasizing programmable sequencing, dynamic voltage scaling, and integrated RTC - targeting NVIDIA Tegra and Freescale i.MX platforms.
FAQ
What is the maximum supported output current for the VIO SMPS in TPS6591102AA2ZRCR?
The VIO SMPS in TPS6591102AA2ZRCR delivers up to 1.3 A at 1.5 V, 1.2 A at 1.8 V, and 1.1 A at both 2.5 V and 3.3 V. These ratings are validated under recommended operating conditions with proper thermal management and external components per TI's layout guidelines. The TPS6591102AA2ZRCR datasheet specifies these values in Section 5.13, Electrical Characteristics: VIO SMPS.
Does TPS6591102AA2ZRCR support external 32.768-kHz crystal operation for the RTC?
Yes, TPS6591102AA2ZRCR supports external 32.768-kHz crystal operation via OSC32KIN and OSC32KOUT pins. It also includes an internal 32-kHz RC oscillator as fallback. Crystal mode achieves ±5 ppm accuracy; RC mode provides ±500 ppm. The TPS6591102AA2ZRCR uses internal load capacitance, eliminating need for external caps in standard configurations.
How many LDOs does TPS6591102AA2ZRCR integrate, and what are their voltage resolution steps?
TPS6591102AA2ZRCR integrates eight user-programmable LDOs: LDO1, LDO2, and LDO4 support 50-mV resolution from 1.0 V to 3.3 V; LDO3, LDO5–LDO8 support 100-mV resolution across the same range. All are controlled via I²C and feature soft-start, current limiting, and thermal foldback - confirmed in Sections 5.17–5.20 of the TPS6591102AA2ZRCR datasheet.
Can EN1 and EN2 pins on TPS6591102AA2ZRCR be used simultaneously as I²C clock and data lines?
Yes - EN1 and EN2 on TPS6591102AA2ZRCR can be configured as a dedicated high-speed I²C interface (SCL/SDA) for dynamic voltage scaling of VDD1 and VDD2, independent of the main CTL-I²C bus. This dual-I²C capability is documented in Section 1.1 Features and Section 6.12 of the TPS6591102AA2ZRCR technical documentation.
What package type and dimensions does TPS6591102AA2ZRCR use?
TPS6591102AA2ZRCR uses a 98-pin BGA MicroStar™ Junior (ZRC) package measuring 9.0 mm × 6.0 mm with 0.65-mm ball pitch. This package is specified in Section 9 of the TPS6591102AA2ZRCR datasheet and supports automated assembly and thermal dissipation via exposed ground balls on the bottom side.
TPS6591102AA2ZRCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 98-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Portable Equipment
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 98-BGA MICROSTAR JUNIOR (9x6)
TPS6591102AA2ZRCR FAQ
1.How can I place an order for TPS6591102AA2ZRCR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6591102AA2ZRCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6591102AA2ZRCR reliable?
The price and inventory of TPS6591102AA2ZRCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6591102AA2ZRCR is usually 5 days.
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TPS6591102AA2ZRCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6591102AA2ZRCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6591102AA2ZRCR?
For technical support, including TPS6591102AA2ZRCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6591102AA2ZRCR requirements.
6.How does Aetrix verify that TPS6591102AA2ZRCR is sourced from the original manufacturer or authorized distributors?
All TPS6591102AA2ZRCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6591102AA2ZRCR meets industry standards.
7.What is the process for return or replacement of TPS6591102AA2ZRCR?
All TPS6591102AA2ZRCR units undergo pre-shipment inspection (PSI). If there is an issue with TPS6591102AA2ZRCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6591102AA2ZRCR part is unused and in its original packaging.
Return procedure for TPS6591102AA2ZRCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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