My Inquiry
My Account
Texas Instruments TPS6591104A2ZRC
- Part No.:
- TPS6591104A2ZRC
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 98-VFBGA
- Datasheet:
-
TPS6591104A2ZRC.pdf
- Description:
- IC PWR MGMT CONV 8LDO 98BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,673
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS6591104A2ZRC from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, real-time clock (RTC), and nine configurable GPIOs. It delivers 1.5 A at 0.6–1.5 V on VDD1, 1.5 A at 0.6–2.2 V on VDD2, and 1.3 A at 1.5 V on VIO - optimized for dual-core application processors in portable systems powered by single-cell Li-ion or 5-V input.
For engineers reviewing the TPS6591104A2ZRC datasheet, TPS6591104A2ZRC pinout, TPS6591104A2ZRC application, or TPS6591104A2ZRC equivalent, this device supports dynamic voltage scaling via dedicated I²C interface, thermal shutdown protection, 32.768-kHz RTC oscillator (crystal or RC), and programmable power sequencing - critical for NVIDIA T30-based embedded designs requiring multi-rail coordination and low-power state management.
Technical Context
The TPS6591104A2ZRC implements a hierarchical power architecture: two core SMPS (VDD1/VDD2) support adaptive voltage scaling under I²C control, while VIO supplies I/O and memory rails. The VDDCtrl controller drives external high-current FETs with programmable slew rate and overcurrent protection via TRIP pin.
Its embedded power controller (EPC) executes EEPROM-programmable boot-up, sleep/wake sequences, and fault recovery logic. The RTC includes calendar, alarm, and backup battery charging (VBACKUP), and the nine GPIOs support LED driving (10-mA sink), interrupt generation, and system-level synchronization - all managed through register-mapped I²C (CTL-I²C and voltage-scaling I²C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 SMPS Output | 0.6–3.3 V, 1.5 A max - powers primary processor core with DVS support |
| VDD2 SMPS Output | 0.6–3.3 V, 1.5 A max - powers secondary processor core with independent DVS |
| VIO SMPS Output | 1.5 V @ 1.3 A, 1.8 V @ 1.2 A, 2.5/3.3 V @ 1.1 A - supplies I/O and DDR memory interfaces |
| LDO Count & Range | 8 main LDOs + 1 RTC LDO; five support 1.0–3.3 V @ 100-mV steps, three support 1.0–3.3 V @ 50-mV steps |
| RTC Accuracy | 32.768-kHz crystal or internal 32-kHz RC oscillator - enables calendar/timekeeping without external timing component |
| I²C Interface | High-speed (up to 400 kHz) CTL-I²C + separate EN1/EN2 pins configurable as dedicated DVS-I²C bus |
| Package | 98-pin BGA MicroStar™ Junior (ZRC), 9.0 mm × 6.0 mm, 0.65-mm pitch - designed for high-density portable PCB layouts |
Pinout & Package
TPS6591104A2ZRC is housed in a 98-ball, 0.65-mm pitch BGA MicroStar™ Junior (ZRC) package measuring 9.0 mm × 6.0 mm. This RoHS-compliant, thermally enhanced package supports automated assembly and provides dedicated analog/digital ground planes (AGND, DGND, GNDC) and power domain isolation for noise-sensitive PMIC operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1 (D1, D2, E2) | VDD1 Switch Node | Connects to external inductor and output capacitor for first core SMPS; requires low-ESR ceramic output cap |
| VFB1 (D4) | VDD1 Feedback Input | Resistor-divider input for precise 0.6–3.3 V output regulation; 5 µA pull-down aids stability during disable |
| EN1 (M7) / EN2 (M6) | Dual-Function Control Pins | Configurable as general enable signals or dedicated I²C clock/data for VDD1/VDD2 voltage scaling |
| OSC32KIN (F8) / OSC32KOUT (F7) | 32.768-kHz Crystal Interface | Supports external crystal connection; internal RC oscillator used if crystal absent - ensures RTC continuity |
| GPIO1 (F6) / GPIO3 (B7) | LED Driver Outputs | 10-mA sink capability enables direct drive of status LEDs without external transistors |
| VCC7 (B6) | RTC & Reference Supply | Powers RTC, bandgap reference (VREF), and comparator inputs; must be stable before device initialization |
Key Features
| Feature | Design Value |
|---|---|
| EEPROM-Programmable Power Sequencing | Enables custom boot-up order, sleep/wake transitions, and fault recovery without firmware changes |
| Dedicated DVS I²C Interface | Separate EN1/EN2 pins reduce timing contention during real-time core voltage adjustments |
| Integrated RTC with Calendar & Alarm | Eliminates need for external RTC IC; retains time/date across power cycles using VBACKUP supply |
| Backup Battery Charger | Charges VBACKUP from main supply with programmable current limit - extends RTC uptime during main power loss |
| Thermal Monitoring & Shutdown | Detects hot-die condition and initiates automatic shutdown at 150°C junction temperature |
| Configurable GPIOs with Interrupt | Nine GPIOs support maskable wake interrupts, LED control, and DC-DC sync - reducing external logic count |
Applications
| Smartphone Application Processor Power | Tablet System-on-Chip (SoC) Management |
|---|---|
|
Use Scenario: Powers NVIDIA T30 dual-core ARM Cortex-A9 SoC with DDR2/DDR3 memory in handheld devices. IC Role / Device Role: Central PMIC managing core voltages (VDD1/VDD2), I/O rail (VIO), memory interface LDOs, and RTC. Use Value: Enables dynamic voltage scaling per core to reduce active power by up to 40% versus fixed-rail solutions. |
Use Scenario: Controls power domains for display interface, camera sensor, and audio codec in 7–10 inch tablets. IC Role / Device Role: Supplies regulated LDO outputs (LDO1–LDO8) and synchronizes peripheral enable sequencing via GPIOs. Use Value: Reduces BOM count by integrating eight LDOs with 50-mV/100-mV fine-grained adjustment for mixed-voltage peripherals. |
| Industrial Handheld Terminal | Medical Portable Diagnostic Device |
|
Use Scenario: Powers ARM-based controller and barcode scanner engine in ruggedized field terminals. IC Role / Device Role: Delivers robust power with thermal shutdown, cold reset (HDRST), and watchdog supervision. Use Value: Ensures reliable operation under variable ambient temperatures (-40°C to +85°C) with no external thermal monitoring required. |
Use Scenario: Manages battery-backed operation for ECG waveform acquisition and wireless telemetry modules. IC Role / Device Role: Provides RTC with calendar/alarm, VBACKUP charging, and low-noise LDOs for analog front-end biasing. Use Value: Maintains accurate timestamping and data integrity during main power interruptions using internal backup registers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65912104A2ZRC | Same pinout and feature set; adds support for DDR3L memory and updated EEPROM bootloader for AM387x/AM389x processors | Targeted at TI Sitara AM3874/AM3894 platforms instead of NVIDIA T30; lacks DDR2 compatibility | Select when upgrading to AM38xx-based designs requiring DDR3L interface and extended EEPROM configuration space |
| TPS659114A2ZRC | Identical PMIC architecture but configured for Freescale i.MX6 processors; differs in default EEPROM settings and GPIO mapping | Optimized for i.MX6 Quad/DualLite SoCs; supports different power-up sequence timing and LDO enable dependencies | Choose for i.MX6-based designs where vendor-specific sequencing and DDR3 compliance are mandatory |
Compared with TPS6591104A2ZRC, TPS65912104A2ZRC offers broader DDR3L support for newer Sitara processors, while TPS659114A2ZRC provides i.MX6-specific sequencing and register defaults - neither is pin-compatible without EEPROM reprogramming, and all three require platform-specific configuration validation.
Availability
TPS6591104A2ZRC is available at Aetrix Electronics and suitable for smartphone application processor power, tablet SoC management, industrial handheld terminals, and medical portable diagnostic devices requiring stable component supply across long-lifecycle embedded programs.
Supply support for TPS6591104A2ZRC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability PMIC design for mobile and industrial applications.
The TPS65911 family was engineered specifically for multi-rail, multi-core application processors in battery-powered portable systems - emphasizing programmable sequencing, thermal resilience, and integration density to minimize external components.
FAQ
What is the primary application target for the TPS6591104A2ZRC?
The TPS6591104A2ZRC is specifically designed for NVIDIA T30-based platforms, delivering coordinated power to dual ARM Cortex-A9 cores, DDR2/DDR3 memory, and peripheral I/O. Its EEPROM-programmable sequencing and DVS-capable SMPS make it ideal for smartphones and tablets where dynamic power optimization is critical. The TPS6591104A2ZRC integrates all essential rails - including RTC, LDOs, and GPIOs - into a single 98-pin BGA package.
Does the TPS6591104A2ZRC support external crystal or internal oscillator for RTC?
Yes, the TPS6591104A2ZRC supports both 32.768-kHz external crystal (via OSC32KIN/OSC32KOUT pins) and an internal 32-kHz RC oscillator. When a crystal is not connected, the internal oscillator automatically takes over to maintain RTC functionality - ensuring continuous timekeeping during board-level cost reduction or layout constraints. The TPS6591104A2ZRC's RTC retains calendar, alarm, and backup registers even during main power loss if VBACKUP is supplied.
How many LDOs does the TPS6591104A2ZRC provide, and what are their key specifications?
The TPS6591104A2ZRC integrates eight main LDOs plus one dedicated RTC LDO (VRTC). Five LDOs (LDO3, LDO4, LDO5, LDO6, LDO7, LDO8) support 1.0–3.3 V in 100-mV steps; LDO1, LDO2, and LDO4 support 1.0–3.3 V in finer 50-mV steps. Output currents range from 50 mA (LDO4) to 320 mA (LDO1/LDO2) and 300 mA (LDO5/LDO6/LDO7/LDO8). All are fully I²C-controllable and include 5-µA pull-downs on feedback inputs for stability.
Can the EN1 and EN2 pins of the TPS6591104A2ZRC be used for purposes other than enabling power rails?
Yes - EN1 and EN2 are multiplexed pins that can alternatively serve as a dedicated high-speed I²C interface (clock and data) for dynamic voltage scaling of VDD1 and VDD2. This dual-mode capability eliminates bus contention between general control commands and time-critical voltage adjustments. The TPS6591104A2ZRC's internal state machine handles mode selection based on EEPROM configuration, and external pull-ups ensure safe default behavior during power-up.
What thermal protection features does the TPS6591104A2ZRC include?
The TPS6591104A2ZRC includes thermal shutdown protection that triggers at 150°C junction temperature, halting all SMPS and LDO outputs to prevent damage. It also features hot-die detection with maskable interrupt (INT1) for early warning before shutdown. Thermal metrics are validated for the 98-pin ZRC package, and the device supports thermal derating down to –45°C ambient. The TPS6591104A2ZRC's thermal monitoring circuitry is self-contained - no external sensors or firmware polling required.
TPS6591104A2ZRC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 98-VFBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Applications:
- Portable Equipment
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 98-BGA MICROSTAR JUNIOR (9x6)
TPS6591104A2ZRC FAQ
1.How can I place an order for TPS6591104A2ZRC through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6591104A2ZRC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6591104A2ZRC reliable?
The price and inventory of TPS6591104A2ZRC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6591104A2ZRC is usually 5 days.
3.What payment methods are accepted for TPS6591104A2ZRC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS6591104A2ZRC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS6591104A2ZRC?
TPS6591104A2ZRC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6591104A2ZRC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6591104A2ZRC?
For technical support, including TPS6591104A2ZRC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6591104A2ZRC requirements.
6.How does Aetrix verify that TPS6591104A2ZRC is sourced from the original manufacturer or authorized distributors?
All TPS6591104A2ZRC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6591104A2ZRC meets industry standards.
7.What is the process for return or replacement of TPS6591104A2ZRC?
All TPS6591104A2ZRC units undergo pre-shipment inspection (PSI). If there is an issue with TPS6591104A2ZRC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6591104A2ZRC part is unused and in its original packaging.
Return procedure for TPS6591104A2ZRC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS6591104A2ZRC Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
