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Texas Instruments TPS6591104A2ZRCR
- Part No.:
- TPS6591104A2ZRCR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 98-VFBGA
- Datasheet:
-
TPS6591104A2ZRCR.pdf
- Description:
- IC PWR MGMT MULTI-CH 98BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,747
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Product details
Overview
TPS6591104A2ZRCR from Texas Instruments is an integrated power management IC (PMIC) designed for single-cell Li-ion, 3-cell Ni-MH, or 5-V powered portable systems. It integrates three step-down DC-DC converters (VDD1: 0.6–3.3 V, 1.5 A; VDD2: 0.6–3.3 V, 1.5 A; VIO: 1.3–3.3 V, 1.3 A), one external-FET controller (VDDCtrl), eight programmable LDOs (up to 320 mA), embedded power controller with EEPROM, RTC with 32.768-kHz crystal support, and nine GPIOs - enabling full power sequencing in handheld processors like NVIDIA T30.
For engineers reviewing the TPS6591104A2ZRCR datasheet, TPS6591104A2ZRCR pinout, TPS6591104A2ZRCR application, or TPS6591104A2ZRCR equivalent, this page delivers verified electrical specs, validated BGA-98 pin functions, confirmed I²C-controlled DVS capability, thermal shutdown behavior, and real-world use cases in battery-powered mobile SoC platforms requiring multi-rail sequencing and dynamic voltage scaling.
Technical Context
The TPS6591104A2ZRCR implements a hierarchical power architecture: dual core SMPS (VDD1/VDD2) support independent dynamic voltage scaling via dedicated high-speed I²C interface, while VIO supplies I/O and memory rails. The embedded power controller (EPC) executes EEPROM-programmable boot-up, sleep, and reset sequences without host intervention.
It integrates analog subsystems including a 32.768-kHz RTC oscillator (crystal or internal RC), two comparators tied to VCCS, watchdog timer, PWM/LED pulse generators, and thermal monitoring with hot-die detection. All LDOs (LDO1–LDO8 + VRTC) are digitally adjustable via I²C with 50-mV or 100-mV step resolution depending on regulator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 SMPS Output | 0.6 V to 3.3 V, 1.5 A - supports processor core rail with DVS for active power optimization |
| VDD2 SMPS Output | 0.6 V to 3.3 V, 1.5 A - independent second core rail, synchronized switching possible |
| VIO SMPS Output | 1.3 V to 3.3 V, 1.3 A - powers I/O peripherals and DDR2/DDR3 memory interfaces |
| LDO1/LDO2 Current | 320 mA each, 1.0–3.3 V in 50-mV steps - precision low-noise supply for analog/RF blocks |
| RTC Accuracy | ±5 ppm with 32.768-kHz crystal - enables calendar/timekeeping with alarm and wake-on-event |
| I²C Interface Speed | Up to 400 kHz - supports fast register access for real-time voltage scaling and configuration |
| Package | 98-pin BGA MicroStar Junior™ (9.0 mm × 6.0 mm, 0.65-mm pitch) - optimized for compact portable PCB layout |
Pinout & Package
TPS6591104A2ZRCR uses a 98-ball ZRC BGA package (MicroStar Junior™, 9.0 mm × 6.0 mm, 0.65-mm pitch) with mixed analog/digital power and signal ball mapping. Thermal performance is enhanced by 11 AGND balls and dedicated GNDC/VBACKUP/REFGND connections.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1 (D1,D2,E2) | VDD1 Switch Node | Connects to external inductor and output capacitor for first core SMPS |
| VFB1 (D4) | VDD1 Feedback Input | Monitors regulated output voltage; sets target via resistor divider |
| EN1 (M7) / EN2 (M6) | Enable or I²C Clock/Data | Dual-mode pins: hardware enable or dedicated high-speed I²C for DVS control |
| GPIO1 (F6) / GPIO3 (B7) | LED Driver Outputs | 10-mA sink capability - directly drive status LEDs without external drivers |
| OSC32KIN (F8) / OSC32KOUT (F7) | RTC Crystal Interface | Supports 32.768-kHz tuning fork crystal; internal oscillator fallback if crystal fails |
| VCC7 (B6) | RTC & Reference Supply | Powers RTC, bandgap reference (VREF), and comparator inputs; backup-capable |
Key Features
| Feature | Design Value |
|---|---|
| EEPROM-Programmable Power Sequencing | Boot, sleep, and reset sequences fully configurable without host CPU involvement |
| Dual-Core Dynamic Voltage Scaling (DVS) | Independent VDD1/VDD2 regulation via dedicated I²C interface reduces active power by >30% under load variation |
| Integrated RTC with Calendar & Alarm | Real-time clock maintains date/time across deep sleep; alarm wakes system on scheduled event |
| Configurable GPIOs with LED Sink | Nine GPIOs include four with enable functionality in power-up sequence; two support 10-mA LED drive |
| Thermal Monitoring & Hot-Die Detection | On-die temperature sensor triggers automatic shutdown at 125°C; hot-die flag alerts host before shutdown |
Applications
| Smartphone Application Processor Power | Tablet SoC Power Management |
|---|---|
|
Use Scenario: Powers NVIDIA T30 dual-core Cortex-A9 SoC in smartphone form factor with DDR2 memory and camera ISP. IC Role / Device Role / Timing Role: Primary PMIC managing VDD1/VDD2 core rails, VIO I/O rail, DDR termination, and RTC-backed suspend/resume timing. Use Value: Enables sub-100 µA deep-sleep current via programmable sequencing and RTC wake; DVS extends battery life during video playback. |
Use Scenario: Supplies Freescale i.MX6-based tablet platform with display interface, Wi-Fi/BT combo module, and eMMC storage. IC Role / Device Role / Timing Role: Central power hub delivering sequenced 1.2-V core, 1.5-V GPU, 3.3-V I/O, and 1.8-V display rails with precise timing alignment. Use Value: Reduces board area by consolidating 12 discrete regulators; EEPROM sequencing eliminates external CPLD for boot reliability. |
| Industrial Handheld Terminal | Medical Portable Monitor |
|
Use Scenario: Powers ARM-based barcode scanner with ruggedized design, capacitive touchscreen, and 4G modem. IC Role / Device Role / Timing Role: Manages battery-to-rail conversion, cold-start sequencing, and thermal-safe operation during extended field use. Use Value: Hot-die detection prevents thermal runaway in sealed enclosures; backup battery input (VBACKUP) sustains RTC during main power loss. |
Use Scenario: Supplies patient monitor SoC with ECG front-end, OLED display, and Bluetooth LE telemetry under strict safety requirements. IC Role / Device Role / Timing Role: Provides isolated, low-noise LDOs for analog sensor biasing and clean digital rails; RTC ensures accurate timestamping of vital signs. Use Value: VRTC LDO and REFGND separation minimize noise coupling into sensitive analog measurement paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS659112ZRCR | Supports DM8168/AM389x processors; lacks DDR3 support and VIO voltage range above 2.5 V | Targeted at TI DaVinci-based industrial vision systems, not mobile SoCs | Choose only when interfacing with C6A8168 or AM3894 - incompatible with NVIDIA T30 or i.MX6 memory interfaces |
| TPS659114ZRCR | Optimized for Freescale i.MX6 DDR3; adds 1.35-V DDR3 termination LDO and tighter VIO tolerance (±1.5%) | Designed specifically for i.MX6 Quad/DualPlus platforms with LPDDR2/DDR3 memory | Select for i.MX6 designs requiring DDR3 termination and higher VIO accuracy; not drop-in for T30 due to EEPROM map differences |
Compared with TPS6591104A2ZRCR, TPS659112ZRCR omits DDR3 support and has reduced VIO flexibility, while TPS659114ZRCR adds DDR3-specific features but requires revalidation of EEPROM sequencing - neither offers pin-to-pin compatibility nor identical register mapping.
Availability
TPS6591104A2ZRCR is available at Aetrix Electronics and suitable for smartphone, tablet, industrial handheld, and portable medical device applications requiring stable component supply, long-term lifecycle support, and guaranteed traceability.
Supply support for TPS6591104A2ZRCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with over 50 years of innovation in energy-efficient IC design.
The TPS65911 family was engineered to consolidate power delivery for heterogeneous mobile SoCs - integrating sequencing, DVS, RTC, and GPIOs into a single BGA package to reduce bill-of-materials and improve system-level power efficiency.
FAQ
What is the primary function of the TPS6591104A2ZRCR in a mobile SoC platform?
The TPS6591104A2ZRCR serves as the central power management IC for mobile SoCs like NVIDIA T30, providing three regulated DC-DC outputs (VDD1, VDD2, VIO), eight LDOs, EEPROM-programmable power sequencing, RTC, and GPIOs. Its integrated architecture replaces multiple discrete regulators and controllers, reducing PCB area and simplifying firmware-driven voltage scaling in the TPS6591104A2ZRCR.
Does the TPS6591104A2ZRCR support dynamic voltage scaling for both processor cores simultaneously?
Yes, the TPS6591104A2ZRCR supports independent dynamic voltage scaling for VDD1 and VDD2 via its dedicated high-speed I²C interface (EN1/EN2 used as SCL/SDA). Each core rail can be adjusted in real time with 50-mV or 100-mV steps, enabling fine-grained power optimization during varying computational loads in the TPS6591104A2ZRCR.
How does the TPS6591104A2ZRCR handle thermal protection and system safety?
The TPS6591104A2ZRCR includes on-die thermal monitoring with hot-die detection at 125°C and automatic thermal shutdown. It also provides a maskable interrupt (INT1) and status flag to alert the host processor before shutdown. These features ensure safe operation in thermally constrained handheld enclosures using the TPS6591104A2ZRCR.
Can the TPS6591104A2ZRCR operate from a backup battery source?
Yes, the TPS6591104A2ZRCR accepts backup power on VBACKUP (pin D7) to maintain RTC operation and backup registers during main power loss. The VRTC LDO (pin B5) remains active from VBACKUP, preserving calendar/time/alarm functionality - a critical capability confirmed in the TPS6591104A2ZRCR datasheet.
What package type and pin count does the TPS6591104A2ZRCR use?
The TPS6591104A2ZRCR uses a 98-ball ZRC BGA package (MicroStar Junior™) with 9.0 mm × 6.0 mm body size and 0.65-mm pitch. This package includes dedicated AGND, GNDC, REFGND, and VBACKUP balls to support low-noise analog performance and robust thermal dissipation in the TPS6591104A2ZRCR.
TPS6591104A2ZRCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 98-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Portable Equipment
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 98-BGA MICROSTAR JUNIOR (9x6)
TPS6591104A2ZRCR FAQ
1.How can I place an order for TPS6591104A2ZRCR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6591104A2ZRCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6591104A2ZRCR reliable?
The price and inventory of TPS6591104A2ZRCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6591104A2ZRCR is usually 5 days.
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TPS6591104A2ZRCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6591104A2ZRCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6591104A2ZRCR?
For technical support, including TPS6591104A2ZRCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6591104A2ZRCR requirements.
6.How does Aetrix verify that TPS6591104A2ZRCR is sourced from the original manufacturer or authorized distributors?
All TPS6591104A2ZRCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6591104A2ZRCR meets industry standards.
7.What is the process for return or replacement of TPS6591104A2ZRCR?
All TPS6591104A2ZRCR units undergo pre-shipment inspection (PSI). If there is an issue with TPS6591104A2ZRCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6591104A2ZRCR part is unused and in its original packaging.
Return procedure for TPS6591104A2ZRCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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