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Texas Instruments TPS6591104EA2ZRC

Part No.:
TPS6591104EA2ZRC
Manufacturer:
Texas Instruments
Category:
Power Management - Specialized
Package:
98-VFBGA
Datasheet:
AetrixTPS6591104EA2ZRC.pdf
Description:
IC PWR MGMT MULTI-CH 98BGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,334

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Product details

Overview

TPS6591104EA2ZRC from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, RTC with 32.768-kHz crystal support, and nine configurable GPIOs - designed for single-cell Li-ion or 5-V powered portable systems requiring multi-rail sequencing and dynamic voltage scaling.

For engineers reviewing the TPS6591104EA2ZRC datasheet, TPS6591104EA2ZRC pinout, TPS6591104EA2ZRC application, or TPS6591104EA2ZRC equivalent, this device supports precise I²C-controlled voltage scaling for dual-core processors, thermal shutdown protection, watchdog functionality, and flexible power-up sequencing via programmable state machine - critical for NVIDIA T30-based embedded platforms.

Technical Context

The TPS6591104EA2ZRC implements a dedicated embedded power controller (EPC) with EEPROM-based configuration to manage complex power-up/down sequences across 12+ regulated rails. Its dual-core SMPS (VDD1/VDD2) support independent dynamic voltage scaling via a dedicated high-speed I²C interface, while the VIO converter delivers up to 1.3 A at 1.5 V for I/O and memory subsystems.

It integrates a full-featured RTC with calendar, alarm, and 32-kHz oscillator (crystal or RC), plus two independent enable inputs (EN1/EN2) that can alternatively serve as dedicated I²C clock/data lines for voltage scaling. Nine GPIOs include LED drivers (10-mA sink), interrupt generation, and synchronization capability with external 3-MHz clock.

Key Specifications

Parameter Value and Actual Design Meaning
VDD1 SMPS Output 0.6–3.3 V, 1.5 A max - powers primary processor core with DVS support
VDD2 SMPS Output 0.6–3.3 V, 1.5 A max - powers secondary processor core with independent DVS
VIO SMPS Output 1.5 V @ 1.3 A, 1.8 V @ 1.2 A, 2.5/3.3 V @ 1.1 A - supplies I/O and memory rails
LDO Count & Range Eight user-programmable LDOs: five at 1–3.3 V (100-mV steps), three at 1–3.3 V (50-mV steps)
RTC Accuracy 32.768-kHz crystal oscillator support with calendar, alarm, and backup register retention
I²C Interface High-speed I²C (CTL-I²C) + optional dedicated EN1/EN2 I²C for VDD1/VDD2 scaling
Package 98-pin BGA MicroStar™ Junior (ZRC), 9.0 mm × 6.0 mm, 0.65-mm pitch

Pinout & Package

TPS6591104EA2ZRC is housed in a 98-ball, 0.65-mm pitch BGA package (ZRC) measuring 9.0 mm × 6.0 mm, optimized for compact portable designs with thermal pad grounding and dense power rail routing.

Pin/Terminal Circuit Role Design Meaning
SW1 / SW2 / SWIO Switch-node outputs Drive external inductors for VDD1, VDD2, and VIO DC-DC converters
VFB1 / VFB2 / VFBIO Feedback inputs Enable precise output voltage regulation via external resistor dividers
EN1 / EN2 Multi-function digital I/O Configurable as global enable signals or dedicated I²C clock/data for core voltage scaling
GPIO0–GPIO8 Configurable general-purpose I/O Support push-pull/OD modes; four programmable as power-up sequence enablers; two drive LEDs (10 mA sink)
OSC32KIN / OSC32KOUT RTC oscillator interface Connect external 32.768-kHz crystal; internal RC option available if crystal omitted
CLK32KOUT RTC clock output Provides 32-kHz clock signal to system components during ACTIVE/SLEEP states
HDRST / PWRDN / NRESPWRON Reset control terminals HDRST = cold reset; PWRDN = thermal reset input; NRESPWRON = system power-off reset output

Key Features

Feature Design Value
EEPROM-programmable EPC Enables fully customizable power sequencing without firmware changes - ideal for platform-specific boot requirements
Dual-core DVS via dedicated I²C Independent voltage scaling of VDD1 and VDD2 using separate EN1/EN2 pins as I²C clock/data - reduces software overhead
RTC with calendar & alarm Retains time/date/alarm settings in backup mode; supports wake-up events without host intervention
LED pulse generators & PWM Two hardware LED pulsers + one PWM generator eliminate need for MCU GPIO timing resources
Thermal monitoring & shutdown Integrated hot-die detection triggers automatic shutdown before junction exceeds 150°C - protects SoC and PMIC
Backup battery management VBACKUP input supports coin-cell or supercapacitor for RTC and backup registers during main power loss

Applications

Smartphone Baseband NVIDIA T30 Tablet

Use Scenario: Powering dual-core ARM Cortex-A9 CPU, DDR2 memory, and peripheral I/O in a handheld form factor with battery life optimization.

IC Role / Device Role: Central PMIC managing all voltage rails, sequencing, real-time clock, and thermal safety for the application processor.

Use Value: Enables adaptive voltage scaling per core, reducing dynamic power by up to 40% versus fixed-voltage operation while maintaining timing margins.

Use Scenario: Supplying NVIDIA T30 SoC with tightly coordinated VDD1/VDD2 ramp-up, VIO for DDR2 interface, and RTC-backed suspend/resume.

IC Role / Device Role: System-level power orchestrator with EEPROM-configured boot sequence matching T30's power-on requirements.

Use Value: Eliminates external sequencing logic and reduces BOM count by integrating 12+ regulators, RTC, and watchdog in one ZRC package.

Industrial Handheld Terminal Medical Portable Monitor

Use Scenario: Battery-powered rugged terminal requiring reliable cold-start, low-power sleep, and LED status indication.

IC Role / Device Role: Primary power controller delivering regulated rails, driving status LEDs, and enabling wake-on-interrupt via GPIOs.

Use Value: Integrated LED pulsers and 10-mA GPIO sink capability simplify UI design; RTC alarm wakes system on scheduled data upload.

Use Scenario: Life-critical patient monitor needing uninterrupted timekeeping, fail-safe reset behavior, and backup power retention.

IC Role / Device Role: Safety-assured PMIC providing POR, thermal reset (PWRDN), cold reset (HDRST), and VRTC-backed real-time clock.

Use Value: Dual reset inputs and backup battery support ensure continuous RTC operation and deterministic recovery after brownouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS659112 Supports DM8168/AM389x processors; lacks DDR2 memory support and VIO current rating for T30 DDR2 interface Targeted at TI DaVinci/ARM Cortex-A8 platforms, not NVIDIA T30 Select only for AM3894/DM8168-based designs requiring identical pinout but different processor support
TPS659114 Optimized for Freescale i.MX6; includes DDR3 support and different LDO voltage step granularity (25-mV for key rails) Designed for i.MX6 Quad/DualLite SoCs; incompatible EEPROM boot tables and GPIO mapping Use for i.MX6-based portable systems - not drop-in compatible due to distinct power tree configuration and register layout

Compared with TPS6591104EA2ZRC, TPS659112 offers broader industrial processor support but omits T30-specific DDR2 timing and VIO current capability, while TPS659114 provides higher DDR bandwidth and finer LDO resolution but requires complete revalidation for NVIDIA platforms.

Availability

TPS6591104EA2ZRC is available at Aetrix Electronics and suitable for smartphone baseband, NVIDIA T30 tablet, and industrial handheld terminal applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for TPS6591104EA2ZRC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of experience in high-reliability PMIC design for mobile and industrial markets.

The TPS65911 family was engineered specifically for multi-core application processors like NVIDIA T30, delivering tightly coupled power sequencing, dynamic voltage scaling, and integrated RTC - targeting portable systems where space, efficiency, and boot reliability are critical.

FAQ

What is the primary processor compatibility of the TPS6591104EA2ZRC?

The TPS6591104EA2ZRC is explicitly designed for NVIDIA T30 SoCs with DDR2 memory support. Its EEPROM-configured power-up sequence, VDD1/VDD2 DVS timing, and VIO current capability match T30's boot and runtime requirements - confirmed in TI's Device Comparison Table and supported by application notes for Tegra platforms.

Does the TPS6591104EA2ZRC support external crystal or internal RC for the RTC?

Yes, the TPS6591104EA2ZRC supports both 32.768-kHz crystal (via OSC32KIN/OSC32KOUT pins) and internal RC oscillator for RTC operation. The crystal option delivers ±20 ppm accuracy; the RC alternative enables cost-sensitive designs where absolute timekeeping precision is secondary to fast startup and reduced BOM.

How many LDOs does the TPS6591104EA2ZRC provide, and what are their voltage step resolutions?

The TPS6591104EA2ZRC integrates eight user-programmable LDOs: LDO1, LDO2, and LDO4 support 50-mV steps from 1.0 V to 3.3 V; LDO3, LDO5–LDO8 use 100-mV steps over the same range. All are controlled via I²C and retain settings across power cycles when backed by VCC7 or VBACKUP.

Can EN1 and EN2 be used simultaneously as enable signals and I²C lines?

No - EN1 and EN2 are multiplexed functions: they operate either as general-purpose enable inputs *or* as dedicated I²C clock/data lines for VDD1/VDD2 voltage scaling, but not both concurrently. Configuration is set at boot via EEPROM and cannot be dynamically switched during operation.

What thermal protection features does the TPS6591104EA2ZRC include?

The TPS6591104EA2ZRC includes thermal shutdown that activates above 150°C junction temperature and hot-die detection that asserts interrupt INT1 before shutdown threshold is reached. Both features are hardware-monitored and independent of firmware, ensuring fail-safe response even during system hang or bootloader failure.

TPS6591104EA2ZRC Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
98-VFBGA
Packaging:
Tray
Product Status:
Obsolete
Applications:
Portable Equipment
Current - Supply:
-
Voltage - Supply:
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
98-BGA MICROSTAR JUNIOR (9x6)

TPS6591104EA2ZRC FAQ

1.How can I place an order for TPS6591104EA2ZRC through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS6591104EA2ZRC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS6591104EA2ZRC reliable?

The price and inventory of TPS6591104EA2ZRC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6591104EA2ZRC is usually 5 days.

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Once your TPS6591104EA2ZRC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS6591104EA2ZRC?

For technical support, including TPS6591104EA2ZRC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6591104EA2ZRC requirements.

6.How does Aetrix verify that TPS6591104EA2ZRC is sourced from the original manufacturer or authorized distributors?

All TPS6591104EA2ZRC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6591104EA2ZRC meets industry standards.

7.What is the process for return or replacement of TPS6591104EA2ZRC?

All TPS6591104EA2ZRC units undergo pre-shipment inspection (PSI). If there is an issue with TPS6591104EA2ZRC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS6591104EA2ZRC part is unused and in its original packaging.

Return procedure for TPS6591104EA2ZRC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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