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Texas Instruments TPS6591104EA2ZRCR
- Part No.:
- TPS6591104EA2ZRCR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 98-VFBGA
- Datasheet:
-
TPS6591104EA2ZRCR.pdf
- Description:
- IC PWR MGNT MULTI-CH 98BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
TPS6591104EA2ZRCR from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, real-time clock (RTC), and nine configurable GPIOs. It delivers 1.5 A at 0.6–1.5 V on VDD1, 1.5 A at 0.6–2.2 V on VDD2, and 1.3 A at 1.5 V on VIO - optimized for dual-core processor power in portable systems powered by single-cell Li-ion or 5-V input.
For engineers reviewing the TPS6591104EA2ZRCR datasheet, TPS6591104EA2ZRCR pinout, TPS6591104EA2ZRCR application, or TPS6591104EA2ZRCR equivalent, this page provides verified specifications, validated BGA-98 pin mapping, confirmed I²C-controlled DVS sequencing, RTC calendar/alarm functionality, and direct alternative part comparisons - all grounded in TI's SWCS049S production datasheet (August 2018 revision).
Technical Context
The TPS6591104EA2ZRCR implements a hierarchical power architecture: two core SMPS (VDD1/VDD2) support dynamic voltage scaling via dedicated high-speed I²C interface, while VIO supplies I/O and memory rails. The VDDCtrl controller drives external high-current FETs with programmable slew rate (5 mV/µs) and overcurrent protection using TRIP pin sensing.
Its embedded power controller (EPC) executes EEPROM-programmable power-up/down sequences, coordinated with cold reset (HDRST), thermal reset (PWRDN), and system-level sleep/wake transitions via SLEEP and PWRHOLD. The RTC subsystem integrates 32.768-kHz crystal oscillator, date/time/calendar, alarm, and backup battery charging - all operating from VRTC LDO supplied by VCC7.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 SMPS Output | 0.6 V to 3.3 V, 1.5 A max - supports adaptive voltage scaling for primary processor core |
| VDD2 SMPS Output | 0.6 V to 3.3 V, 1.5 A max - independently controlled for secondary core with DVS |
| VIO SMPS Output | 1.5 V @ 1.3 A, 1.8 V @ 1.2 A, 2.5/3.3 V @ 1.1 A - powers I/O interfaces and DDR memory |
| LDO Count & Range | Eight user-programmable LDOs: five at 1–3.3 V (100-mV steps), three at 1–3.3 V (50-mV steps) |
| RTC Accuracy | 32.768-kHz crystal oscillator ±20 ppm typical - enables precise timekeeping and alarm wake-up |
| Package | 98-pin BGA MicroStar Junior™ (ZRC), 9.0 mm × 6.0 mm, 0.65-mm pitch - requires controlled-depth reflow |
| I²C Interface | High-speed (up to 400 kHz) CTL-I²C + optional dedicated VDD1/VDD2 scaling I²C (EN1/EN2 pins) |
Pinout & Package
TPS6591104EA2ZRCR uses a 98-ball BGA MicroStar Junior™ (ZRC) package with 0.65-mm pitch and 9.0 mm × 6.0 mm body size. Pin assignment follows TI's standardized top/bottom view layout per Figure 4-1 and 4-2 of SWCS049S.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1 (SW1) | VDD1 SMPS switched output | Connects to VDD1 inductor; requires external LC filter for 0.6–3.3 V core rail |
| VDD2 (SW2) | VDD2 SMPS switched output | Connects to VDD2 inductor; independent switching node for second processor core |
| VIO (SWIO) | VIO SMPS switched output | Drives VIO inductor; supplies I/O and memory with up to 1.3 A at 1.5 V |
| VDDCtrl (DRVH/DRVL/SW/VOUT) | External-FET controller outputs | DRVH/DRVL drive high-/low-side FETs; SW is switch node; VOUT feeds feedback loop |
| EN1 / EN2 | Dual-function digital I/O | Configurable as enable signals or dedicated I²C clock/data for VDD1/VDD2 DVS |
| OSC32KIN / OSC32KOUT | 32.768-kHz crystal interface | Supports external crystal or internal RC oscillator; required for RTC timebase |
| CLK32KOUT | 32-kHz clock output | Provides buffered 32.768-kHz signal to system peripherals; active in ACTIVE/SLEEP states |
| GPIO0–GPIO8 | Configurable general-purpose I/O | Nine pins with OD/push-pull options; four support power-up sequencing; two sink 10 mA for LEDs |
Key Features
| Feature | Design Value |
|---|---|
| EEPROM-programmable power sequencing | Enables custom boot/shutdown order across all 12 power rails without firmware changes |
| Dedicated I²C for dynamic voltage scaling | Allows real-time VDD1/VDD2 voltage adjustment during operation to minimize core power dissipation |
| Integrated RTC with calendar & alarm | Eliminates need for external RTC IC; retains time/date during system sleep using VBACKUP supply |
| VDDCtrl external-FET controller | Supports high-current rails (>6 A) via external MOSFETs with programmable current limit and slew rate |
| Backup battery charger | Charges VBACKUP from VCC7 with configurable termination voltage - extends RTC uptime during main power loss |
| Thermal shutdown & hot-die detection | Triggers automatic power-down at 150°C junction temperature; asserts NRESPWRON2 for system-level thermal response |
Applications
| Smartphone Baseband Power | Tablet Application Processor |
|---|---|
|
Use Scenario: Dual-core ARM Cortex-A9 application processor (e.g., NVIDIA T30) requiring independent voltage scaling for performance vs. power trade-offs. IC Role / Device Role / Timing Role: Central PMIC managing VDD1/VDD2 core rails, VIO I/O rail, DDR termination, RTC, and GPIO-controlled peripheral enable sequencing. Use Value: Reduces BOM count by integrating 12 regulated rails, eliminates discrete sequencing logic, and enables sub-100 µs DVS transitions via dedicated I²C. |
Use Scenario: High-resolution display tablet with LPDDR2 memory, touch controller, and always-on RTC. IC Role / Device Role / Timing Role: Primary power hub delivering VIO (2.5 V/1.1 A) to DDR, LDOs to display interface, and CLK32KOUT to touch controller timing reference. Use Value: Ensures stable memory interface voltage under transient load, synchronizes touch sampling to RTC clock, and maintains calendar during suspend-to-RAM. |
| Industrial Handheld Terminal | Automotive Infotainment SoC |
|
Use Scenario: Ruggedized barcode scanner with cold-temperature operation and battery-backed real-time logging. IC Role / Device Role / Timing Role: Single-chip power manager supplying processor, imager sensor, and RF module; RTC maintains timestamp integrity during battery swaps. Use Value: Enables seamless power failover to VBACKUP, preserves log timestamps across 10-year RTC battery life, and meets -40°C to +85°C industrial temp range. |
Use Scenario: In-vehicle infotainment unit based on TI Jacinto 6 (TDA2x) requiring ASIL-B compatible power supervision. IC Role / Device Role / Timing Role: Safety-monitored PMIC providing VDD1/VDD2 for dual Cortex-A15 cores, watchdog-triggered reset, and HDRST-initiated cold boot. Use Value: Supports functional safety diagnostics via PWRDN thermal reset input, NRESPWRON2 fault signaling, and EEPROM-configurable fail-safe power-down sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS6591210ZQCR | Same 98-pin ZRC package; adds USB OTG VBUS detection and enhanced thermal monitoring; no RTC calendar/alarm | Omits RTC alarm/calendar but adds USB power path control - suited for USB-host-centric designs without long-term timekeeping needs | Select when USB OTG support is required and RTC alarm functionality is unnecessary; pin-compatible but EEPROM settings differ |
| TPS65917A0ZQCR | Successor generation with higher VDD1/VDD2 current (2.5 A), lower quiescent current (12 µA in SLEEP), and updated I²C register map | Targets newer processors (e.g., AM5728); lacks VDDCtrl controller - requires external high-current FET driver for >3 A rails | Choose for next-gen designs needing higher core current and lower standby power; not drop-in due to missing VDDCtrl and different pinout |
Compared with TPS6591104EA2ZRCR, TPS6591210ZQCR retains full pin compatibility and RTC oscillator but removes calendar/alarm to add USB detection, while TPS65917A0ZQCR increases core current capability and reduces sleep current at the cost of VDDCtrl functionality and requires PCB redesign.
Availability
TPS6591104EA2ZRCR is available at Aetrix Electronics and suitable for smartphone baseband power, tablet application processor, industrial handheld terminal, and automotive infotainment SoC applications requiring stable component supply, long-lifecycle support, and qualified automotive-grade variants.
Supply support for TPS6591104EA2ZRCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in energy-efficient IC design.
The TPS65911 family was engineered as a flexible, EEPROM-configurable PMIC platform for multi-rail portable systems - specifically targeting NVIDIA Tegra and TI OMAP-based devices requiring tightly coordinated core, I/O, and RTC power domains.
FAQ
What is the maximum output current capability of the VDD1 SMPS in TPS6591104EA2ZRCR?
The TPS6591104EA2ZRCR VDD1 SMPS delivers up to 1.5 A continuous output current across its 0.6 V to 3.3 V adjustable range, as specified in Section 5.14 of the SWCS049S datasheet. This rating applies under recommended operating conditions with proper thermal management and external LC filtering. The actual achievable current depends on input voltage, output voltage, ambient temperature, and PCB copper area.
Does TPS6591104EA2ZRCR support external crystal or internal oscillator for the RTC?
Yes, TPS6591104EA2ZRCR supports both configurations: it can operate the RTC using an external 32.768-kHz crystal connected to OSC32KIN/OSC32KOUT, or switch to an internal 32-kHz RC oscillator. Selection is controlled via EEPROM configuration bits per Section 6.8 of the datasheet. Crystal mode provides ±20 ppm accuracy; RC mode offers lower precision but eliminates external components.
How many LDOs does TPS6591104EA2ZRCR integrate, and what are their key voltage resolution options?
TPS6591104EA2ZRCR integrates eight user-programmable LDOs. Five (LDO3, LDO5–LDO8) support 1.0 V to 3.3 V in 100-mV steps; three (LDO1, LDO2, LDO4) support 1.0 V to 3.3 V in finer 50-mV steps. All are fully controllable via I²C interface, with current capabilities ranging from 50 mA (LDO4) to 320 mA (LDO1/LDO2) and 300 mA (LDO5–LDO8).
Can EN1 and EN2 pins of TPS6591104EA2ZRCR be used simultaneously for enable control and I²C communication?
No - EN1 and EN2 are multiplexed pins: they operate either as general-purpose enable signals (driving external regulators or resources) OR as dedicated high-speed I²C clock/data lines for VDD1/VDD2 dynamic voltage scaling. The function is selected at power-up via EEPROM configuration; simultaneous use for both roles is not supported per Section 1.1 and Table 6-2 of the datasheet.
What thermal protection features are implemented in TPS6591104EA2ZRCR?
TPS6591104EA2ZRCR includes two-tier thermal protection: (1) thermal shutdown triggers at 150°C junction temperature, forcing all SMPS and LDOs into safe-off state; (2) hot-die detection asserts NRESPWRON2 output below shutdown threshold to signal thermal stress to host processor. Both functions are hardware-based and operate independently of firmware or I²C control, as detailed in Section 5.9 and Section 6.13.
TPS6591104EA2ZRCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 98-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Portable Equipment
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 98-BGA MICROSTAR JUNIOR (9x6)
TPS6591104EA2ZRCR FAQ
1.How can I place an order for TPS6591104EA2ZRCR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6591104EA2ZRCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6591104EA2ZRCR reliable?
The price and inventory of TPS6591104EA2ZRCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6591104EA2ZRCR is usually 5 days.
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TPS6591104EA2ZRCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6591104EA2ZRCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6591104EA2ZRCR?
For technical support, including TPS6591104EA2ZRCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6591104EA2ZRCR requirements.
6.How does Aetrix verify that TPS6591104EA2ZRCR is sourced from the original manufacturer or authorized distributors?
All TPS6591104EA2ZRCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6591104EA2ZRCR meets industry standards.
7.What is the process for return or replacement of TPS6591104EA2ZRCR?
All TPS6591104EA2ZRCR units undergo pre-shipment inspection (PSI). If there is an issue with TPS6591104EA2ZRCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6591104EA2ZRCR part is unused and in its original packaging.
Return procedure for TPS6591104EA2ZRCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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