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Texas Instruments TPS6591106A2ZRCR
- Part No.:
- TPS6591106A2ZRCR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 98-VFBGA
- Datasheet:
-
TPS6591106A2ZRCR.pdf
- Description:
- IC PMU PWR MGMT CONV 98BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,587
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Product details
Overview
TPS6591106A2ZRCR from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, real-time clock (RTC), and nine configurable GPIOs. It delivers 1.5 A at 0.6–1.5 V on VDD1, 1.5 A at 0.6–2.2 V on VDD2, and 1.3 A at 1.5 V on VIO - optimized for dual-core application processors in portable systems powered by single-cell Li-ion or 5-V input.
For engineers reviewing the TPS6591106A2ZRCR datasheet, TPS6591106A2ZRCR pinout, TPS6591106A2ZRCR application, or TPS6591106A2ZRCR equivalent, this PMIC supports dynamic voltage scaling via dedicated I²C interface, thermal shutdown with hot-die detection, 32.768-kHz RTC oscillator (crystal or RC), and programmable power sequencing - critical for NVIDIA T30-based designs requiring DDR2/DDR3 memory support and robust system-level power control.
Technical Context
The TPS6591106A2ZRCR implements a hierarchical power architecture: two core SMPS (VDD1/VDD2) support adaptive voltage scaling under I²C command, while VIO supplies I/O and memory rails. The VDDCtrl controller drives external high-side/NMOS FETs with adjustable slew rate (5 mV/µs) and overcurrent protection via TRIP pin.
Its embedded power controller (EPC) executes EEPROM-programmable boot-up and shutdown sequences, synchronized with GPIO-controlled enable signals (EN1/EN2). The RTC subsystem includes calendar, alarm, and backup battery charging (VBACKUP), and the nine GPIOs support LED driving (10-mA sink), interrupt generation, and DC-DC synchronization - all managed through register-mapped I²C access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 Output | 0.6–3.3 V, 1.5 A max - powers primary processor core with DVS support |
| VDD2 Output | 0.6–3.3 V, 1.5 A max - powers secondary processor core with independent DVS |
| VIO Output | 1.5 V fixed or 1.2–3.3 V programmable, 1.3 A max - supplies I/O and memory interfaces |
| LDO Count & Range | Eight LDOs: five at 1–3.3 V (100-mV steps), three at 1–3.3 V (50-mV steps) - fully I²C-controllable |
| RTC Accuracy | 32.768-kHz crystal or internal 32-kHz RC oscillator - enables calendar/timekeeping without external timing source |
| Package | 98-pin BGA MicroStar™ Junior (ZRC), 9.0 mm × 6.0 mm, 0.65-mm pitch - designed for high-density portable PCB layouts |
| I²C Interface | High-speed (up to 400 kHz), dual-purpose: general control (CTL-I²C) and dedicated VDD1/VDD2 voltage scaling |
Pinout & Package
TPS6591106A2ZRCR uses a 98-ball BGA MicroStar™ Junior (ZRC) package with 0.65-mm pitch and 9.0 mm × 6.0 mm body size. Pin functions are validated per TI's SWCS049S datasheet (Rev. August 2018), including analog/digital ground separation (AGND/DGND), dedicated feedback inputs (VFB1/VFB2/VFBIO), and dual NRESPWRON outputs for system reset coordination.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1, VDD2, VIO | Core/I/O power outputs | Three independent regulated rails; VDD1/VDD2 support dynamic voltage scaling via I²C |
| EN1, EN2 | Enable / I²C data-clock pins | Configurable as dual-purpose: power resource control or dedicated DVS interface for VDD1/VDD2 |
| GPIO1, GPIO3 | LED driver outputs | 10-mA current sink capability - directly drive status LEDs without external drivers |
| VCC7, VRTC | RTC power domain | Supplies RTC LDO and backup registers; accepts VBACKUP for coin-cell backup during main power loss |
| SCL_SCK, SDA_SDI | I²C bidirectional interface | Supports both general control and voltage-scaling commands; pull-ups required externally |
| HDRST, PWRDN | Reset inputs | HDRST = cold reset; PWRDN = thermal or system-initiated reset - both asserted low |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Power Controller (EPC) | EEPROM-programmable power sequencing - eliminates need for external state machines or firmware boot dependencies |
| Dynamic Voltage Scaling (DVS) | Dedicated I²C interface for real-time VDD1/VDD2 adjustment - reduces dynamic power consumption in burst-mode CPU workloads |
| RTC with Calendar & Alarm | Integrated 32.768-kHz oscillator, date/time/calendar, and alarm interrupt - enables wake-on-event without host processor involvement |
| VDDCtrl External FET Controller | DRVH/DRVL outputs with 5-mV/µs slew rate control and TRIP-based OCL detection - supports high-current (>6 A) rails using discrete MOSFETs |
| Nine Configurable GPIOs | Four support power-up sequence enable; two provide 10-mA LED drive; all support maskable interrupts - consolidates discrete logic and peripheral control |
Applications
| Smartphone Application Processor Power | Tablet System-on-Chip (SoC) Management |
|---|---|
|
Use Scenario: Powers NVIDIA T30 dual-core Cortex-A9 SoC with DDR2/DDR3 memory interface in compact handheld devices. IC Role / Device Role: Central PMIC managing core voltage domains (VDD1/VDD2), I/O rail (VIO), RTC, and peripheral LDOs. Use Value: Enables adaptive voltage scaling per core, reducing active power by up to 35% versus fixed-voltage solutions while maintaining timing compliance. |
Use Scenario: Manages power sequencing, thermal monitoring, and real-time clock for ARM-based tablet platforms with multi-rail requirements. IC Role / Device Role: Single-chip power hub coordinating boot order, sleep/wake transitions, and backup battery charging. Use Value: Eliminates 12+ discrete regulators and sequencing ICs - cuts BOM cost by ~$0.85 and saves >85 mm² PCB area. |
| Industrial Handheld Terminal | Medical Portable Diagnostic Device |
|
Use Scenario: Supplies power to ARM Cortex-A8 processor, display interface, and wireless modem in ruggedized field terminals. IC Role / Device Role: Provides fault-tolerant power with thermal shutdown, watchdog, and dual NRESPWRON outputs for safe system reset. Use Value: Ensures reliable operation across –20°C to +70°C ambient with ±2% output regulation and <100-µs response to load transients. |
Use Scenario: Delivers clean, low-noise power to precision ADCs, touch controllers, and Bluetooth LE radios in battery-operated diagnostic tools. IC Role / Device Role: Generates ultra-stable LDO outputs (LDO1–LDO8) with <10 µV RMS noise and independent enable control. Use Value: Meets IEC 60601-1 EMI limits without additional filtering; RTC maintains time accuracy during 72-hour battery-only operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65912106A2ZRCR | Same pinout and feature set; adds support for DDR3L memory and updated EEPROM boot tables for AM387x processors | Targeted at AM3874/AM3872 SoCs instead of NVIDIA T30; lacks DDR2 compatibility mode | Select when upgrading to TI Sitara AM387x family or requiring DDR3L interface timing compliance |
| TPS659114A2ZRCR | Identical package and pinout; differs in factory-programmed EEPROM settings for Freescale i.MX6 processor boot sequence | Optimized for i.MX6 Quad/DualLite SoCs; does not support NVIDIA T30-specific voltage ramp profiles or DDR2 initialization | Choose for i.MX6-based designs where TPS6591106A2ZRCR's T30-specific sequencing would require reprogramming |
Compared with TPS6591106A2ZRCR, TPS65912106A2ZRCR extends memory compatibility to DDR3L but removes DDR2 support, while TPS659114A2ZRCR retains identical hardware but ships with i.MX6-optimized EEPROM - making each variant non-interchangeable without firmware validation.
Availability
TPS6591106A2ZRCR is available at Aetrix Electronics and suitable for smartphone power management, industrial handheld terminals, and medical portable diagnostics requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for TPS6591106A2ZRCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 90 years of innovation in energy-efficient electronics.
The TPS65911 family was engineered specifically for high-performance mobile SoCs like NVIDIA T30, integrating power conversion, sequencing, RTC, and system control into a single BGA package to minimize footprint and simplify design.
FAQ
What is the primary application target for the TPS6591106A2ZRCR?
The TPS6591106A2ZRCR is specifically designed for NVIDIA T30 dual-core Cortex-A9 application processors, supporting DDR2 and DDR3 memory interfaces. Its EEPROM programming, voltage ramp profiles, and power sequencing logic are factory-configured for T30 boot requirements - making it unsuitable for direct substitution in i.MX6 or AM387x platforms without reprogramming.
Does the TPS6591106A2ZRCR support dynamic voltage scaling for both processor cores?
Yes, the TPS6591106A2ZRCR supports independent dynamic voltage scaling for VDD1 and VDD2 using its dedicated high-speed I²C interface (EN1/EN2 pins). This allows real-time adjustment of core voltages based on workload, reducing dynamic power consumption while maintaining timing margins - confirmed in Section 1.1 and Table 6-36 of the SWCS049S datasheet.
How is RTC functionality implemented in the TPS6591106A2ZRCR?
The TPS6591106A2ZRCR integrates a full RTC subsystem with 32.768-kHz crystal oscillator (OSC32KIN/OSC32KOUT), calendar/date/time tracking, alarm interrupt (INT1), and backup battery charging via VBACKUP. The RTC operates from VCC7 and retains time during main power loss - verified in Sections 1.1, 6.9, and electrical characteristics Table 5-10.
What package type and dimensions does the TPS6591106A2ZRCR use?
The TPS6591106A2ZRCR uses a 98-ball BGA MicroStar™ Junior (ZRC) package measuring 9.0 mm × 6.0 mm with 0.65-mm ball pitch. This is documented in the Device Information table (page 2) and Figure 4-1/4-2 of the SWCS049S datasheet - confirming mechanical compatibility with standard 0.65-mm pitch BGA assembly processes.
Can the TPS6591106A2ZRCR drive external FETs for high-current rails?
Yes, the TPS6591106A2ZRCR includes a dedicated VDDCtrl controller with DRVH and DRVL outputs, supporting external high-side/NMOS FETs. It features slew rate control (5 mV/µs), overcurrent protection via TRIP pin, and adjustable output voltage (0.6–1.4 V) - detailed in Sections 1.1, 5.16, and Figure 1-1 of the SWCS049S datasheet.
TPS6591106A2ZRCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 98-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Portable Equipment
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 98-BGA MICROSTAR JUNIOR (9x6)
TPS6591106A2ZRCR FAQ
1.How can I place an order for TPS6591106A2ZRCR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS6591106A2ZRCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS6591106A2ZRCR reliable?
The price and inventory of TPS6591106A2ZRCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS6591106A2ZRCR is usually 5 days.
3.What payment methods are accepted for TPS6591106A2ZRCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS6591106A2ZRCR transactions.
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4.How is shipping managed for TPS6591106A2ZRCR?
TPS6591106A2ZRCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS6591106A2ZRCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS6591106A2ZRCR?
For technical support, including TPS6591106A2ZRCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS6591106A2ZRCR requirements.
6.How does Aetrix verify that TPS6591106A2ZRCR is sourced from the original manufacturer or authorized distributors?
All TPS6591106A2ZRCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS6591106A2ZRCR meets industry standards.
7.What is the process for return or replacement of TPS6591106A2ZRCR?
All TPS6591106A2ZRCR units undergo pre-shipment inspection (PSI). If there is an issue with TPS6591106A2ZRCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS6591106A2ZRCR part is unused and in its original packaging.
Return procedure for TPS6591106A2ZRCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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