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Texas Instruments TPS659110A2ZRCR

Part No.:
TPS659110A2ZRCR
Manufacturer:
Texas Instruments
Category:
Power Management - Specialized
Package:
98-VFBGA
Datasheet:
AetrixTPS659110A2ZRCR.pdf
Description:
IC PMU 4DCDC/8LDO 98BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,612

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Product details

Overview

TPS659110A2ZRCR from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, real-time clock (RTC), and nine configurable GPIOs. It delivers 1.5 A at 0.6–1.5 V on VDD1, 1.5 A at 0.6–2.2 V on VDD2, and 1.3 A at 1.5 V on VIO - optimized for dual-core application processors in portable systems powered by single-cell Li-ion or 5-V input.

For engineers reviewing the TPS659110A2ZRCR datasheet, TPS659110A2ZRCR pinout, TPS659110A2ZRCR application, or TPS659110A2ZRCR equivalent, this PMIC supports dynamic voltage scaling via dedicated I²C, thermal shutdown, 32.768-kHz RTC oscillator, programmable power sequencing, and LED/PWM generators - critical for battery-powered handheld and embedded SoC platforms requiring multi-rail precision control and system-level power state management.

Technical Context

The TPS659110A2ZRCR implements a hierarchical power architecture: two core SMPS (VDD1/VDD2) support adaptive voltage scaling under I²C command, while VIO supplies I/O and memory rails. The VDDCtrl controller drives external high-current FETs with programmable slew rate and overcurrent protection via TRIP pin.

Its embedded power controller (EPC) executes EEPROM-programmable boot-up, sleep, and reset sequences; the RTC includes calendar, alarm, and backup battery charging; and nine GPIOs provide enable control, interrupt wakeup, LED drive (10 mA sink), and clock synchronization - all managed through a single high-speed I²C interface (CTL-I²C or dual-purpose EN1/EN2).

Key Specifications

Parameter Value and Actual Design Meaning
VDD1 SMPS Output 0.6–3.3 V, 1.5 A max - powers primary processor core with DVS support
VDD2 SMPS Output 0.6–3.3 V, 1.5 A max - powers secondary processor core with independent DVS
VIO SMPS Output 1.5 V fixed (or 1.2/1.8/2.5/3.3 V options), 1.3 A - supplies I/O and memory subsystems
LDO Count & Range Eight LDOs: five at 1–3.3 V / 100-mV steps, three at 1–3.3 V / 50-mV steps - fully I²C-controllable
RTC Accuracy 32.768-kHz crystal or internal 32-kHz RC oscillator - enables calendar/timekeeping without external timing component
I²C Interface High-speed mode (up to 400 kHz), dual-role EN1/EN2 pins - allows dedicated voltage-scaling channel or general control
Package 98-pin BGA MicroStar™ Junior (ZRC), 9.0 mm × 6.0 mm, 0.65-mm pitch - designed for compact portable PCB layouts

Pinout & Package

TPS659110A2ZRCR is housed in a 98-ball BGA MicroStar™ Junior (ZRC) package with 0.65-mm pitch and 9.0 mm × 6.0 mm body size. Thermal and electrical performance is optimized via multiple AGND, DGND, GNDC, and GNDIO balls distributed across bottom and top layers.

Pin/Terminal Circuit Role Design Meaning
VDD1, VDD2, VIO Core/I/O power outputs Three regulated SMPS outputs with adjustable voltage and current limiting - each with dedicated feedback (VFB1/VFB2/VFBIO) and switch-node (SW1/SW2/SWIO)
VDDCtrl (DRVH/DRVL/TRIP/VOUT) External-FET controller interface Drives high-side (DRVH) and low-side (DRVL) FETs; TRIP sets OCL threshold; VOUT feeds feedback loop - supports >6 A rail with external components
EN1, EN2 Dual-function digital I/O Configurable as global enable signals or dedicated I²C clock/data lines for VDD1/VDD2 voltage scaling - simplifies sequencing and reduces bus contention
GPIO0–GPIO8 Configurable digital I/O Nine pins supporting push-pull/OD modes; four integrate into power-up sequence; two sink 10 mA for LEDs; two support 3-MHz sync clock input - enables flexible system resource control
OSC32KIN/OSC32KOUT/CLK32KOUT RTC timing interface Supports 32.768-kHz crystal (external) or internal RC oscillator; CLK32KOUT provides buffered output for system clock distribution

Key Features

Feature Design Value
EEPROM-programmable EPC Enables field-updatable power sequencing logic - eliminates hardware redesign for boot/sleep/reset behavior changes
Dedicated DVS I²C interface Separate EN1/EN2 pins allow concurrent voltage scaling of VDD1 and VDD2 without interfering with main CTL-I²C bus traffic
RTC with calendar & alarm Integrated date/time/calendar + alarm interrupt - removes need for external RTC IC and associated crystal/load capacitors
Backup battery charger Charges VBACKUP from VCC7 with programmable current - maintains RTC operation during main power loss
Programmable LED/PWM generators Two ON/OFF pulse generators + one PWM generator - drive status LEDs or backlight without MCU intervention
Thermal monitoring & shutdown Detects hot-die condition and asserts NRESPWRON/NRESPWRON2 - ensures safe operation under sustained load or ambient temperature rise

Applications

Smartphone Application Processor Power Tablet SoC Power Management

Use Scenario: Powers NVIDIA T30 dual-core Cortex-A9 SoC with DDR2/DDR3 memory, display interface, and peripheral I/O.

IC Role / Device Role / Timing Role: Central PMIC managing core voltages (VDD1/VDD2), I/O rail (VIO), RTC, and power sequencing per boot specification.

Use Value: Enables dynamic voltage scaling per workload, reducing active power by up to 40% versus fixed-voltage solutions while maintaining timing compliance.

Use Scenario: Supplies Freescale i.MX6 quad-core ARM SoC with GPU, MIPI-DSI, USB PHY, and LPDDR2 memory in 7–10 inch tablets.

IC Role / Device Role / Timing Role: Delivers tightly regulated, sequenced rails with sub-100 µs response to DVS commands and RTC-synchronized wake events.

Use Value: Integrates eight LDOs and RTC into single ZRC package - cuts BOM count by ≥12 components and saves ≥85 mm² PCB area.

Industrial Handheld Terminal Medical Portable Monitor

Use Scenario: Powers ARM-based barcode scanner with cellular modem, OLED display, and capacitive touch controller on single-cell Li-ion battery.

IC Role / Device Role / Timing Role: Manages battery-to-rail conversion, GPIO-controlled peripheral enables, and RTC-backed data logging timestamping.

Use Value: Backup battery charging (VBACKUP) and nonvolatile EEPROM sequencing ensure reliable cold-start and audit-trail continuity after power loss.

Use Scenario: Supplies clinical-grade patient monitor with ECG front-end, SPI flash, SD card, and color TFT display operating from 5-V wall adapter or internal battery.

IC Role / Device Role / Timing Role: Provides isolated analog/digital domains (AGND/DGND), precise LDOs for sensor biasing, and fail-safe thermal shutdown.

Use Value: Dual comparator inputs (VCCS) and maskable GPIO interrupts enable custom safety interlocks - meeting IEC 60601-1 leakage and fault-response requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS659112 Supports DM8168/AM3894 processors; lacks DDR3 support and VIO programmability; no RTC calendar functionality Targeted at TI DaVinci-based video processors - not suitable for DDR3 or calendar-dependent applications Select only for legacy DaVinci designs where TPS659110A2ZRCR's DDR3/RTC features are unused
TPS659114 Optimized for Freescale i.MX6; adds DDR3 support and enhanced VIO flexibility; identical pinout and LDO count but different EEPROM mapping Designed for i.MX6 family boot sequences - requires revalidation of power-up timing and register initialization Prefer for new i.MX6 designs; TPS659110A2ZRCR remains optimal for NVIDIA T30 and DDR2/DDR3 dual-support use cases

Compared with TPS659112 and TPS659114, the TPS659110A2ZRCR uniquely supports both DDR2 and DDR3 memory interfaces, includes full RTC calendar/alarm, and retains backward compatibility with T30 reference designs - making it the only variant qualified for mixed-memory SoC platforms requiring production longevity and feature completeness.

Availability

TPS659110A2ZRCR is available at Aetrix Electronics and suitable for smartphone application processor power, tablet SoC power management, industrial handheld terminals, and medical portable monitors requiring stable component supply, long-lifecycle support, and validated thermal performance across -40°C to +85°C ambient.

Supply support for TPS659110A2ZRCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies - with over 50 years of innovation in energy-efficient IC design and manufacturing.

The TPS65911 product line delivers highly integrated, EEPROM-configurable PMICs for mobile and embedded SoCs - engineered to reduce system power consumption, simplify layout, and accelerate time-to-market for battery-powered and thermally constrained applications.

FAQ

What is the primary application target for the TPS659110A2ZRCR?

The TPS659110A2ZRCR is specifically designed for powering NVIDIA T30 dual-core Cortex-A9 application processors in smartphones and tablets. It supports both DDR2 and DDR3 memory interfaces, integrates RTC with calendar/alarm, and provides programmable power sequencing - making it ideal for portable devices requiring multi-rail precision control and battery life optimization.

Does the TPS659110A2ZRCR include an integrated real-time clock?

Yes, the TPS659110A2ZRCR includes a full-featured RTC with 32.768-kHz crystal oscillator support, date/time/calendar tracking, alarm capability, and backup battery charging via the VBACKUP pin. The RTC operates independently using VCC7 and maintains time during system sleep or main power loss when a backup cell is connected.

How many LDO regulators does the TPS659110A2ZRCR provide, and what are their voltage ranges?

The TPS659110A2ZRCR provides eight LDO regulators: five (LDO3, LDO5–LDO8) support 1.0–3.3 V in 100-mV steps; three (LDO1, LDO2, LDO4) support 1.0–3.3 V in 50-mV steps. All eight are fully controllable via the high-speed I²C interface and powered from dedicated input supplies (VCC3–VCC6).

Can the TPS659110A2ZRCR support dynamic voltage scaling for both processor cores?

Yes, the TPS659110A2ZRCR supports independent dynamic voltage scaling (DVS) for both VDD1 and VDD2 SMPS outputs. This is enabled via a dedicated high-speed I²C interface using the EN1 (clock) and EN2 (data) pins - allowing real-time voltage adjustment without interfering with the main CTL-I²C bus used for system configuration.

What package type and pin count does the TPS659110A2ZRCR use?

The TPS659110A2ZRCR uses a 98-pin BGA MicroStar™ Junior (ZRC) package with 0.65-mm ball pitch and a 9.0 mm × 6.0 mm body size. Pin functions include three SMPS switch nodes (SW1/SW2/SWIO), nine configurable GPIOs, dual I²C interfaces, RTC timing pins, and dedicated enable/control signals - all documented in the official TI datasheet SWCS049S.

TPS659110A2ZRCR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
98-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Portable Equipment
Current - Supply:
-
Voltage - Supply:
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
98-BGA MICROSTAR JUNIOR (9x6)

TPS659110A2ZRCR FAQ

1.How can I place an order for TPS659110A2ZRCR through Aetrix?

Please submit a Request for Quotation (RFQ) for TPS659110A2ZRCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPS659110A2ZRCR reliable?

The price and inventory of TPS659110A2ZRCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS659110A2ZRCR is usually 5 days.

3.What payment methods are accepted for TPS659110A2ZRCR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS659110A2ZRCR transactions.

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4.How is shipping managed for TPS659110A2ZRCR?

TPS659110A2ZRCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPS659110A2ZRCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPS659110A2ZRCR?

For technical support, including TPS659110A2ZRCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS659110A2ZRCR requirements.

6.How does Aetrix verify that TPS659110A2ZRCR is sourced from the original manufacturer or authorized distributors?

All TPS659110A2ZRCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS659110A2ZRCR meets industry standards.

7.What is the process for return or replacement of TPS659110A2ZRCR?

All TPS659110A2ZRCR units undergo pre-shipment inspection (PSI). If there is an issue with TPS659110A2ZRCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPS659110A2ZRCR part is unused and in its original packaging.

Return procedure for TPS659110A2ZRCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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