Texas Instruments TPS659118A2ZRCT

Overview

TPS659118A2ZRCT from Texas Instruments is an integrated power management IC (PMIC) designed for multi-rail portable systems powered by single-cell Li-ion, 3-cell Ni-MH, or 5-V input. It delivers three step-down DC-DC converters (VDD1: 0.6–3.3 V, 1.5 A; VDD2: 0.6–3.3 V, 1.5 A; VIO: 1.3–3.3 V, 1.3 A), eight programmable LDOs (LDO1–LDO8, up to 320 mA), and embedded power sequencing via EEPROM-configurable EPC. It supports dynamic voltage scaling for dual-core processors in handheld computing and multimedia applications.

For engineers reviewing the TPS659118A2ZRCT datasheet, TPS659118A2ZRCT pinout, TPS659118A2ZRCT application, or TPS659118A2ZRCT equivalent, this page provides verified technical context, confirmed pin functions, real-world use cases, and validated alternative options - all grounded in TI's official SWCS049S revision August 2018 documentation and ZRC BGA package specifications.

Technical Context

The TPS659118A2ZRCT implements a dedicated Embedded Power Controller (EPC) with EEPROM-based programmability for full power-up/down sequencing, state-machine-driven GPIO control, and thermal event response. Its dual-core SMPS (VDD1/VDD2) support independent I²C-controlled dynamic voltage scaling, while the VIO converter supplies I/O and memory rails with 1.3–3.3 V output range and 1.3 A capability.

It integrates a 32.768-kHz RTC with crystal or internal RC oscillator, nine configurable GPIOs (four with enable sequencing, two with 10-mA LED sink), dual I²C interfaces (CTL-I²C + dedicated DVS-I²C), watchdog, PWM/LED pulse generators, and two comparators tied to VCCS. All eight LDOs are digitally controllable via I²C, with five supporting 100-mV steps and three (LDO1/LDO2/LDO4) offering finer 50-mV resolution.

Key Specifications

Pinout & Package

TPS659118A2ZRCT is housed in a 98-ball BGA MicroStar Junior™ (ZRC) package with 0.65-mm pitch and 9.0 mm × 6.0 mm body size. Pin functions are validated per TI SWCS049S Figure 4-1/4-2 and Section 4.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management applications.

Compared with TPS659118A2ZRCT, TPS659121A2ZRCR offers USB OTG support but fewer LDOs, while TPS65917A2ZRCR adds charging and GPIOs at the cost of EEPROM reconfiguration and non-drop-in layout compatibility - both require validation against sequencing and thermal profiles.

Availability

TPS659118A2ZRCT is available at Aetrix Electronics and suitable for smartphone application processor power, tablet SoC power management, automotive infotainment head units, and portable medical imaging devices requiring stable component supply across extended product lifecycles.

Supply support for TPS659118A2ZRCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-reliability IC design.

The TPS65911 family was engineered specifically for multi-core mobile SoCs requiring tightly coordinated power sequencing, dynamic voltage scaling, and integrated RTC - targeting OMAP, Jacinto, and Sitara processor platforms.

FAQ

What is the maximum output current supported by the VDD1 and VDD2 SMPS in TPS659118A2ZRCT?

The TPS659118A2ZRCT supports up to 1.5 A continuous output current on both VDD1 and VDD2 SMPS channels, with adjustable output voltage ranging from 0.6 V to 3.3 V. This rating is validated under recommended operating conditions (T_A ≤ 85°C, proper PCB thermal design) and includes built-in overcurrent protection and thermal shutdown safeguards. The TPS659118A2ZRCT datasheet (SWCS049S, Section 5.14–5.15) specifies these values with ±5% tolerance across voltage and temperature ranges.

Does TPS659118A2ZRCT support external crystal for the RTC, and what is the accuracy specification?

Yes, the TPS659118A2ZRCT supports a 32.768-kHz external crystal connected to OSC32KIN/OSC32KOUT pins, delivering ±5 ppm accuracy over –40°C to +85°C. It also includes an internal RC oscillator as fallback. The RTC maintains calendar, time, date, and alarm functionality with VRTC backup supply, and retains operation down to 1.2 V on VBACKUP. This specification is documented in Section 5.10 and Section 6.9 of the TPS659118A2ZRCT datasheet.

How many LDOs does TPS659118A2ZRCT integrate, and what are their key voltage resolution capabilities?

The TPS659118A2ZRCT integrates eight fully programmable LDOs: LDO1 and LDO2 (320 mA, 1.0–3.3 V, 50-mV step), LDO3 and LDO4 (200/50 mA, 1.0–3.3 V, 100-mV step), LDO5–LDO8 (300 mA each, 1.0–3.3 V, 100-mV step). All are controlled via I²C, with output voltage set through dedicated register fields. This granularity enables precise analog supply tuning - critical for ADC references and RF biasing - as confirmed in Sections 5.17–5.20 of the TPS659118A2ZRCT datasheet.

Can TPS659118A2ZRCT be used with DDR3L memory, and which specific processor families is it qualified for?

Yes, the TPS659118A2ZRCT is explicitly qualified for DDR3L memory interfaces, as noted in TI's Device Comparison Table (Section 3) for the TPS659118 variant supporting 66AK2G02 processors. It meets DDR3L VDDQ (1.35 V) and VDD (1.35 V) requirements via its VIO SMPS (1.3–3.3 V, 1.3 A) and supports JEDEC-compliant ramp rates and sequencing. It is factory-validated for TI KeyStone II 66AK2Gxx SoCs and compatible with other DDR3L-capable processors requiring programmable multi-rail sequencing.

What is the function of the EN1 and EN2 pins on TPS659118A2ZRCT, and how do they differ from standard enable inputs?

The EN1 and EN2 pins on TPS659118A2ZRCT serve dual roles: they act as general-purpose enable signals for power resources *or*, when configured via EEPROM, become a dedicated high-speed I²C interface (clock and data) exclusively for dynamic voltage scaling of VDD1 and VDD2. This separation prevents interference between system-level control and real-time core voltage adjustments. Their behavior is defined in the EPC state machine and requires no external glue logic - a feature unique to the TPS659118A2ZRCT among TI's PMIC portfolio.