Texas Instruments TPS65911AA2NMAT

Overview

TPS65911AA2NMAT from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, real-time clock (RTC), and nine configurable GPIOs. It delivers 1.5 A at 0.6–1.5 V on VDD1, 1.5 A at 0.6–2.2 V on VDD2, and 1.3 A at 1.5 V on VIO - optimized for dual-core processor power sequencing in portable systems.

For engineers reviewing the TPS65911AA2NMAT datasheet, TPS65911AA2NMAT pinout, TPS65911AA2NMAT application, or TPS65911AA2NMAT equivalent, this device supports dynamic voltage scaling via dedicated I²C, thermal shutdown, 32.768-kHz RTC crystal interface, and programmable power-up sequences - critical for Li-ion-powered handheld SoC platforms requiring tight rail coordination and low-power state management.

Technical Context

The TPS65911AA2NMAT implements a hierarchical power architecture: two core SMPS (VDD1/VDD2) support adaptive voltage scaling under I²C control, while VIO supplies I/O and memory rails. The VDDCtrl controller drives external high-current FETs with adjustable slew rate (5 mV/µs) and overcurrent protection via TRIP pin.

Its embedded power controller (EPC) executes EEPROM-programmable sequencing, including cold reset (HDRST), power initialization (PWRDN), and SLEEP/ACTIVE transitions. The RTC subsystem includes oscillator input/output (OSC32KIN/OSC32KOUT), calendar/alarm functions, and VRTC LDO (300 mA, 1.0–3.3 V) backed by VBACKUP input.

Key Specifications

Pinout & Package

TPS65911AA2NMAT is housed in a 98-ball BGA MicroStar Junior™ package (ZRC suffix), 9.0 mm × 6.0 mm body size, 0.65-mm ball pitch. Thermal pad exposed on bottom for enhanced heat dissipation; requires solder mask defined pads and stencil-applied solder paste per TI SLOA122 guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with TPS65911AA2NMAT, TPS659121AA2NMAT adds DDR3L support for newer TI DSPs, while TPS6591133AA2NMAT offers identical hardware with preconfigured sequencing for DaVinci DM814x - both require no PCB changes but differ in factory-programmed EEPROM content and target processor alignment.

Availability

TPS65911AA2NMAT is available at Aetrix Electronics and suitable for smartphone application processor power, tablet SoC power management, automotive infotainment head units, and portable medical imaging devices requiring stable component supply across multi-year production cycles.

Supply support for TPS65911AA2NMAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in energy-efficient IC design.

The TPS65911 product line was engineered specifically for single-chip power management of heterogeneous multicore processors in portable and handheld systems - integrating sequencing, regulation, RTC, and GPIOs to replace 6+ discrete components.

FAQ

What is the maximum output current capability of the VDD1 SMPS in the TPS65911AA2NMAT?

The TPS65911AA2NMAT VDD1 SMPS delivers up to 1.5 A continuous output current across its 0.6 V to 1.5 V adjustable range. This rating is validated at 85°C ambient with proper PCB thermal design and applies to both steady-state and transient loads per Section 5.14 of the datasheet. The TPS65911AA2NMAT includes overcurrent protection that limits peak current to prevent damage during short-circuit events.

Does the TPS65911AA2NMAT support external 32.768-kHz crystal oscillators for RTC operation?

Yes, the TPS65911AA2NMAT supports external 32.768-kHz crystal oscillators via dedicated OSC32KIN and OSC32KOUT pins. Internal load capacitance is configurable through EEPROM registers, eliminating the need for external capacitors in most designs. The TPS65911AA2NMAT also includes a 32-kHz RC oscillator as a backup when crystal is unavailable or fails.

How many LDO regulators does the TPS65911AA2NMAT integrate, and what are their key specifications?

The TPS65911AA2NMAT integrates eight fully programmable LDO regulators: LDO1/LDO2 (320 mA, 1.0–3.3 V, 50-mV steps), LDO3/LDO4 (200/50 mA, 1.0–3.3 V, 100-mV steps), LDO5–LDO8 (300 mA each, 1.0–3.3 V, 100-mV steps). All are digitally controlled via I²C and support soft-start, current limiting, and thermal foldback - confirmed in Sections 5.17–5.20 of the TPS65911AA2NMAT datasheet.

Can the EN1 and EN2 pins of the TPS65911AA2NMAT be used simultaneously for power enable and I²C communication?

No - EN1 and EN2 are multiplexed pins: they operate either as general-purpose enable signals for power resources or as dedicated I²C clock/data lines for VDD1/VDD2 dynamic voltage scaling, but not both simultaneously. Configuration is determined at power-up via BOOT1 pin state and EEPROM settings. The TPS65911AA2NMAT datasheet explicitly prohibits concurrent use in Section 1.1 and Figure 1-1.

What thermal protection features are implemented in the TPS65911AA2NMAT?

The TPS65911AA2NMAT includes thermal shutdown protection that disables all SMPS and LDOs when junction temperature exceeds 125°C, plus hot-die detection that asserts NRESPWRON to signal thermal fault to the host processor. It also monitors die temperature continuously and reports status via I²C register bits - all verified in Section 5.9 and Section 6.13 of the official TPS65911AA2NMAT datasheet.