Texas Instruments TPS65911AA2ZRCT

Overview

TPS65911AA2ZRCT from Texas Instruments is an integrated power management IC (PMIC) featuring three step-down DC-DC converters (VDD1, VDD2, VIO), one external-FET controller (VDDCtrl), eight programmable LDOs, embedded power controller with EEPROM, real-time clock (RTC), and nine configurable GPIOs. It delivers 1.5 A at 0.6–1.5 V on VDD1, 1.5 A at 0.6–2.2 V on VDD2, and 1.3 A at 1.5 V on VIO - optimized for dual-core processor systems powered by single-cell Li-ion or 5-V input.

For engineers reviewing the TPS65911AA2ZRCT datasheet, TPS65911AA2ZRCT pinout, TPS65911AA2ZRCT application, or TPS65911AA2ZRCT equivalent, this PMIC supports dynamic voltage scaling via dedicated I²C, thermal shutdown, 32.768-kHz RTC oscillator, programmable power sequencing, and LED/PWM generators - critical for portable SoC power architecture validation and BOM consolidation.

Technical Context

The TPS65911AA2ZRCT implements a hierarchical power architecture: two SMPS (VDD1/VDD2) support adaptive voltage scaling for CPU cores using separate high-speed I²C lines (EN1/EN2), while VIO supplies I/O and memory rails. The VDDCtrl controller drives external high-current FETs with adjustable slew rate (5 mV/µs) and overcurrent protection via TRIP pin.

Its embedded power controller (EPC) executes EEPROM-programmable boot-up and sleep sequences; the RTC includes calendar, alarm, and backup battery charging (VBACKUP); and nine GPIOs provide enable control, interrupt generation, LED drive (10 mA sink), and clock synchronization - all managed through register-mapped I²C interface (CTL-I²C).

Key Specifications

Pinout & Package

The TPS65911AA2ZRCT is housed in a 98-pin ZRC BGA package (MicroStar Junior™), measuring 9.0 mm × 6.0 mm with 0.65-mm ball pitch. Thermal performance is optimized via exposed die pad (AGND-connected) and multiple ground balls across top/bottom layers.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with TPS65911AA2ZRCT, TPS659121A2ZRCT offers lower sleep current and wider LDO range but removes VDDCtrl, while TPS65910AA2ZRCT retains full pin compatibility at the cost of feature reduction - making it viable only for constrained legacy upgrades.

Availability

TPS65911AA2ZRCT is available at Aetrix Electronics and suitable for smartphone, tablet, industrial handheld, and embedded vision applications requiring stable component supply, long-term lifecycle support, and qualified automotive-grade alternatives.

Supply support for TPS65911AA2ZRCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability PMIC design for mobile and industrial markets.

The TPS65911 product line was engineered specifically for heterogeneous multicore SoCs in portable systems - integrating sequencing, DVS, RTC, and flexible LDO/SMPS resources to replace discrete power solutions in space-constrained designs.

FAQ

What is the maximum output current capability of the VDD1 and VDD2 SMPS in the TPS65911AA2ZRCT?

The TPS65911AA2ZRCT supports up to 1.5 A on both VDD1 and VDD2 SMPS outputs. This rating applies across the full output voltage range (0.6 V to 3.3 V) under recommended operating conditions and proper thermal management. The actual achievable current depends on input voltage, ambient temperature, PCB layout, and inductor selection - refer to Section 5.14 and 5.15 of the datasheet for derating curves and thermal metrics specific to the TPS65911AA2ZRCT.

Does the TPS65911AA2ZRCT support dynamic voltage scaling for both processor cores simultaneously?

Yes, the TPS65911AA2ZRCT supports independent dynamic voltage scaling for VDD1 and VDD2 using two dedicated high-speed I²C interfaces routed through EN1 and EN2 pins. This allows real-time, asynchronous voltage updates for each core without interfering with the main CTL-I²C bus. The TPS65911AA2ZRCT's embedded power controller also enables coordinated DVS transitions as part of programmable power states stored in EEPROM.

Can the TPS65911AA2ZRCT operate without an external 32.768-kHz crystal?

Yes, the TPS65911AA2ZRCT includes an internal 32-kHz RC oscillator that can serve as the RTC clock source when OSC32KIN/OSC32KOUT pins are left unconnected. While less accurate than a crystal (±5% vs. ±20 ppm), the RC option eliminates BOM cost and board space for crystal and load capacitors - ideal for non-critical timekeeping applications. The TPS65911AA2ZRCT automatically selects the active source based on configuration bits.

How many LDOs does the TPS65911AA2ZRCT integrate, and what are their key programmability features?

The TPS65911AA2ZRCT integrates eight main LDOs (LDO1–LDO8) plus a dedicated RTC LDO (VRTC). Five LDOs support 1.0–3.3 V in 100-mV steps; LDO1, LDO2, and LDO4 support finer 50-mV steps. All are fully software-controllable via I²C, with individual enable/disable, voltage selection, and soft-start configuration - enabling precise rail optimization for diverse peripheral requirements in the TPS65911AA2ZRCT.

Is the TPS65911AA2ZRCT pin-compatible with other devices in the TPS6591x family?

The TPS65911AA2ZRCT shares the same 98-pin ZRC BGA package and pinout with TPS65910AA2ZRCT, enabling mechanical drop-in replacement. However, it is not pin-compatible with TPS659121A2ZRCT (which omits VDDCtrl-related pins) or TPS659112/TPS659114 variants (which differ in GPIO mapping and LDO count). Always validate signal routing and EEPROM configuration before substituting - the TPS65911AA2ZRCT's VDDCtrl interface and dual-DVS I²C are unique to its variant.