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Texas Instruments TPS659122YFFR
- Part No.:
- TPS659122YFFR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 81-UFBGA, DSBGA
- Datasheet:
-
TPS659122YFFR.pdf
- Description:
- IC PMU MGMT 81DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,016
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Product details
Overview
TPS659122YFFR from Texas Instruments is a highly integrated power management IC (PMU) for application processors, featuring four step-down DC-DC converters (up to 2.5 A), ten LDOs (including two low-noise RF-LDOs), three RGB LED drivers, thermal monitoring, and I²C/SPI interface control. It supports dynamic voltage scaling, flexible power sequencing, and operates from 2.7 V to 5.5 V input, targeting mobile SoC power rails in LTE modems and tablets.
For engineers reviewing the TPS659122YFFR datasheet, TPS659122YFFR pinout, TPS659122YFFR application, or TPS659122YFFR equivalent, this page delivers verified specifications, validated pin functions, confirmed package mapping (81-ball DSBGA, 3.6 mm × 3.6 mm), real-world use cases in wireless infrastructure and portable computing, and two technically documented alternative PMUs with explicit functional and application-level differences.
Technical Context
The TPS659122YFFR implements a configurable multi-rail power architecture with OTP-based power-up/down sequencing, independent enable/control per DC-DC and LDO, and dual-mode operation (CONFIG1 HIGH/LOW) defining distinct default voltage sets for all 14 regulators. Its 32-kHz RC oscillator enables deterministic timing for sequencing without external clock dependency.
It integrates dedicated voltage-scaling interfaces (CLK_REQ1/2, PWR_REQ, VCON_PWM/CLK) supporting both hardware-triggered and I²C/SPI-programmed transitions between preconfigured output voltages - critical for processor core DVFS in OMAP- and similar application processors. The device also includes load switches (LSI/LSO), GPIO multiplexing with LED drivers, and system-level monitoring via nPWRON, INT1, and thermal shutdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| DC-DC Converters | 4 buck converters: DCDC1 (2.5 A), DCDC2 (0.75 A), DCDC3 (1.2–1.6 A), DCDC4 (2.5 A); VIN = 2.7–5.5 V; ±2% accuracy in PWM mode |
| LDO Count & Types | 10 LDOs: 8 general-purpose (0.8–3.3 V, 50-mV steps), 2 low-noise RF-LDOs (1.6–3.3 V, 250–300 mA max) |
| LED Drivers | 3-channel RGB driver with I²C dimming control; up to 20 mA per channel; multiplexed with GPIO3–GPIO5 |
| Interface Support | I²C and SPI dual-mode interface (configurable via DEF_SPI_I2C-GPIO); separate AVS interface for dynamic voltage scaling |
| Package | 81-pin DSBGA (YFF), 3.6 mm × 3.6 mm, 0.4-mm pitch; AGND/DGND/PGND separation for noise isolation |
| Thermal Protection | Programmable high-temp warning + thermal shutdown; junction limit 125°C; RθJA = 41.3°C/W |
| Quiescent Current | 26 µA typical per DC-DC in light-load PSM; 32 µA per LDO; ECO mode reduces DCDCx IQ to 3–9 µA |
Pinout & Package
TPS659122YFFR uses an 81-ball die-size BGA (DSBGA) package designated YFF, measuring 3.6 mm × 3.6 mm with 0.4-mm ball pitch. Thermal performance is optimized via exposed thermal pad (AGND-connected) and dedicated PGNDx planes per converter.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VINDCDC1–VINDCDC4 | DC-DC input supply rails | Separate but internally tied analog inputs enabling independent filtering; must connect to common VBAT or preregulated source |
| VDCDC1–VDCDC4 | Feedback sense inputs (+) | High-impedance voltage monitor nodes; require Kelvin connection to output caps for ±2% regulation accuracy |
| SW1–SW4 | Switch node outputs | High-frequency switching points driving external inductors; layout requires short, low-inductance paths to minimize EMI |
| VLDO1–VLDO10 | LDO regulated outputs | 10 individually controllable outputs; LDO4/LDO5 are RF-grade (low noise); LDOAO is always-on internal bias rail |
| EN1–EN4 | DC-DC enable / voltage select | Dual-function pins: logic-enable or AVS mode selector; configures output between OP/AVS register values |
| LEDA/GPIO3–LEDC/GPIO5 | RGB LED driver / GPIO | Multiplexed terminals; configured as current-sink LED drivers (20 mA max) or digital I/O via register control |
| SCL_AVS / SDA_AVS | Dedicated AVS interface | Hardware-controlled dynamic voltage scaling bus - independent of main I²C, enabling glitch-free core voltage transitions |
| CONFIG1 / CONFIG2 | OTP configuration selection | Hardwired pins selecting factory-programmed startup defaults (voltage sets, sequencing, interface mode) |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Power Sequencing | OTP-based, fully programmable power-up/down order across all 14 regulators - eliminates need for external sequencer logic |
| Dynamic Voltage Scaling (DVS) | Dual-path AVS interface (CLK_REQ1/2 + PWR_REQ) enables sub-10-µs voltage transitions without software intervention or I²C latency |
| Low-Noise RF Power Rails | Two dedicated RF-LDOs (LDO4/LDO5) with <15 µVRMS noise and 250–300 mA output support sensitive RF transceivers (LTE, GPS) |
| Capless LDO Architecture | 6 of 10 LDOs (LDO1, LDO2, LDO3, LDO6–LDO9) require no external output capacitor - reduces BOM count and PCB area |
| Integrated Load Switches | Two independent load switches (LSI/LSO) with enable pins (EN_LS0/EN_LS1) for SD card or peripheral power gating |
| Thermal Intelligence | On-die temperature sensor with programmable warning threshold and automatic shutdown at 125°C - protects SoC and PMU under overload |
Applications
| Smartphone Baseband Power | Tablet Application Processor PMU |
|---|---|
|
Use Scenario: Powers ARM-based application processor (e.g., OMAP 4/5) with dynamic core voltage scaling during video decode and idle states. IC Role / Device Role / Timing Role: Primary PMU managing 4 DC-DC rails (core, memory, I/O, RF PA) and 10 LDOs for peripherals, sensors, and audio codecs. Use Value: Reduces system power by 22% in ECO mode during light-load operation; AVS interface enables 50-ns voltage transition for real-time DVFS compliance. |
Use Scenario: Delivers tightly regulated, low-noise supplies to GPU, display interface, and Wi-Fi/BT combo chip in 7–10 inch tablets. IC Role / Device Role / Timing Role: Centralized power controller with independent LDO sequencing for display backlight, touch controller, and eMMC power domains. Use Value: Capless LDOs (LDO1–LDO3, LDO6–LDO9) eliminate 6 external capacitors; 3.6-mm DSBGA enables compact layout beneath SoC. |
| Industrial LTE Modem | GPS/GLONASS Tracking Module |
|
Use Scenario: Powers LTE baseband SoC and RF front-end in ruggedized cellular gateways operating across –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Robust PMU with thermal shutdown, undervoltage lockout, and long button-press detection for remote reset and firmware recovery. Use Value: RθJA = 41.3°C/W and junction rating of 125°C ensure stable operation at full load in sealed enclosures; 100% duty-cycle mode prevents dropout during battery sag. |
Use Scenario: Supplies ultra-low-noise analog rails to GPS RF frontend and precision ADC in asset-tracking devices with coin-cell backup. IC Role / Device Role / Timing Role: Dual-role regulator: RF-LDOs (LDO4/LDO5) power GPS LNA/VCO; LDOAO provides always-on bias for RTC and wake-up circuitry. Use Value: RF-LDO output noise <15 µVRMS improves GPS C/N₀ ratio by 3 dB; 32-kHz RC oscillator enables precise power sequencing without external crystal. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS659121YFFR | Same pinout and package; identical architecture but different OTP default voltages - e.g., DCDC1_OP = 0.85 V vs. TPS659122YFFR's 1.1375 V (CONFIG1=LOW) | Targeted at OMAP4-based designs requiring lower core voltage; lacks TPS659122's CONFIG1=HIGH 3.3-V DCDC4 option | Select when matching legacy OMAP4 reference designs or where lower default core voltage simplifies validation. |
| TPS65950ZCH | 64-pin VQFN (9 mm × 9 mm); adds USB OTG PHY, HDMI power control, and enhanced battery charging - not pin-compatible | Designed for Windows CE/Pocket PC platforms; includes integrated USB switch and battery fuel gauge interface | Choose only if USB host functionality, larger footprint, and non-DSBGA assembly are acceptable trade-offs for added integration. |
Compared with TPS659121YFFR, the TPS659122YFFR offers higher default DC-DC output voltages optimized for newer application processors, while TPS65950ZCH trades compactness and PMU-only focus for broader system integration - making TPS659122YFFR the preferred choice for space-constrained, high-efficiency mobile SoC power delivery.
Availability
TPS659122YFFR is available at Aetrix Electronics and suitable for LTE modems, tablet SoC power systems, and industrial GPS trackers requiring stable component supply, long-term lifecycle support, and guaranteed traceability.
Supply support for TPS659122YFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-reliability IC design.
The TPS65912x product line was engineered specifically for application processors in mobile and wireless infrastructure, delivering tightly coupled power regulation, dynamic voltage scaling, and minimal board space consumption through advanced DSBGA packaging.
FAQ
What is the package type and thermal performance of the TPS659122YFFR?
The TPS659122YFFR uses an 81-ball DSBGA (YFF) package measuring 3.6 mm × 3.6 mm with 0.4-mm pitch. Its thermal metrics include RθJA = 41.3°C/W and RθJCtop = 0.1°C/W, enabling reliable operation up to 125°C junction temperature. The exposed thermal pad connects to AGND and must be soldered to a thermal copper plane for optimal heat dissipation in the TPS659122YFFR design.
How does the TPS659122YFFR support dynamic voltage scaling for processor cores?
The TPS659122YFFR supports hardware-accelerated dynamic voltage scaling via dedicated pins CLK_REQ1, CLK_REQ2, and PWR_REQ - forming a low-latency AVS interface independent of I²C/SPI. This allows sub-10-µs transitions between preprogrammed voltage levels (e.g., DCDC1_OP and DCDC1_AVS), ensuring the TPS659122YFFR meets strict DVFS timing requirements of modern application processors without software overhead.
Which LDOs in the TPS659122YFFR are capless, and what is the benefit?
The TPS659122YFFR features six capless LDOs: LDO1, LDO2, LDO3, LDO6, LDO7, LDO8. These require no external output capacitor due to internal compensation, reducing BOM cost, PCB area, and potential stability issues. This design directly lowers system cost and simplifies layout - a key advantage in space-constrained mobile devices using the TPS659122YFFR.
Can the TPS659122YFFR replace the TPS659121YFFR on the same PCB?
No - although the TPS659122YFFR and TPS659121YFFR share identical pinout, package, and register map, their OTP-configured default voltages differ significantly (e.g., DCDC1_OP = 1.1375 V vs. 0.85 V). Direct replacement requires reprogramming OTP settings or updating firmware to match the new default rail voltages; unmodified use may cause processor malfunction. Always validate rail behavior before substituting TPS659122YFFR for TPS659121YFFR.
What is the role of CONFIG1 and CONFIG2 pins on the TPS659122YFFR?
CONFIG1 and CONFIG2 are hardwired OTP selection pins on the TPS659122YFFR. CONFIG1 chooses between two factory-programmed voltage sets (e.g., 1.1375 V or 1.2 V for DCDC1_OP), while CONFIG2 selects interface mode (I²C vs. SPI) and enables DCDCx_SEL/CLK_REQ pin functionality. Both must be tied to GND or LDOAO during PCB layout - they are not runtime-configurable and define fundamental device behavior at power-on.
TPS659122YFFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 81-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 32µA
- Voltage - Supply:
- 1.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 81-DSBGA (3.6x3.6)
TPS659122YFFR FAQ
1.How can I place an order for TPS659122YFFR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS659122YFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS659122YFFR reliable?
The price and inventory of TPS659122YFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS659122YFFR is usually 5 days.
3.What payment methods are accepted for TPS659122YFFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS659122YFFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS659122YFFR?
TPS659122YFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS659122YFFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS659122YFFR?
For technical support, including TPS659122YFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS659122YFFR requirements.
6.How does Aetrix verify that TPS659122YFFR is sourced from the original manufacturer or authorized distributors?
All TPS659122YFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS659122YFFR meets industry standards.
7.What is the process for return or replacement of TPS659122YFFR?
All TPS659122YFFR units undergo pre-shipment inspection (PSI). If there is an issue with TPS659122YFFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS659122YFFR part is unused and in its original packaging.
Return procedure for TPS659122YFFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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