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Texas Instruments TPS659127YFFT
- Part No.:
- TPS659127YFFT
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 81-UFBGA, DSBGA
- Datasheet:
-
TPS659127YFFT.pdf
- Description:
- TPS659127YFFT
- Quantity:
- Payment:
- Shipping:
Inventory:250
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Product details
Overview
TPS659127YFFT from Texas Instruments is a highly integrated power management IC (PMU) for application processors, featuring four step-down DC-DC converters (up to 2.5 A), ten LDOs (including two low-noise RF-LDOs), three RGB LED drivers, thermal monitoring, and I²C/SPI control. It supports dynamic voltage scaling and flexible power sequencing in space-constrained mobile platforms.
For engineers reviewing the TPS659127YFFT datasheet, TPS659127YFFT pinout, TPS659127YFFT application, or TPS659127YFFT equivalent, key selection considerations include verified DC-DC output current capability (2.5 A/1.6 A/0.75 A/2.5 A), LDO count and noise performance (e.g., 32 µA quiescent current, 1.6–3.3 V RF-LDO range), DSBGA-81 package compatibility, and dual-interface (I²C + SPI) configurability for system-level power orchestration.
Technical Context
The TPS659127YFFT implements a multi-rail, OTP-configurable power architecture with independent enable/control per DC-DC converter and LDO, supported by a 32-kHz RC oscillator for deterministic power-up/down sequencing. Its DC-DC converters operate in PWM or power-save mode with 100% duty-cycle capability and ±2% output accuracy in PWM mode.
It integrates programmable voltage scaling via dedicated AVS interface pins (CLK_REQ1/CLK_REQ2, PWR_REQ) and supports both hardware pin-based (EN1–EN4) and register-based control. The device includes thermal warning/shutdown, undervoltage lockout, long-button detection, and load switch functionality for SD card or RF-PA supply routing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| DC-DC Output Count | 4 configurable buck converters: DCDC1 (2.5 A), DCDC2 (0.75 A), DCDC3 (1.6 A), DCDC4 (2.5 A) |
| LDO Count & Type | 10 total: 8 general-purpose (0.8–3.3 V, 50-mV steps), 2 low-noise RF-LDOs (1.6–3.3 V, 250/300 mA) |
| Control Interface | I²C and SPI dual-mode interface; DEF_SPI_I2C-GPIO pin selects protocol; supports dynamic voltage scaling (AVS) |
| Package | DSBGA-81 (YFF), 3.6 mm × 3.6 mm, 0.4-mm pitch - optimized for ultra-thin mobile PCBs |
| Quiescent Current | 26 µA per DC-DC in power-save mode; 32 µA per LDO; ECO mode reduces DC-DC IQ to 3–9 µA |
| Thermal Protection | Integrated thermal monitoring with high-temp warning and automatic shutdown at junction >125°C |
| LED Drivers | 3-channel RGB LED sink (20 mA max/channel), dimmable via I²C, multiplexed with GPIO3–GPIO5 |
Pinout & Package
TPS659127YFFT uses an 81-ball DSBGA (YFF) package with 0.4-mm pitch and 3.6 mm × 3.6 mm body size. Ball assignment follows TI's standard YFF layout with dedicated analog/digital/power ground separation (AGND, DGND, PGND1–PGND4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VINDCDC1–VINDCDC4 | DC-DC input supply rails | Independent or shared inputs (e.g., VINDCDC_ANA ties all four); must be decoupled per spec (10–22 µF) |
| VDCDC1–VDCDC4 | DC-DC feedback sense inputs (+) | High-impedance voltage monitor nodes; require Kelvin connection to output caps for accuracy |
| SW1–SW4 | DC-DC switch node outputs | Connect directly to external inductors; high dv/dt nodes requiring tight layout and ground shielding |
| VLDO1–VLDO10 | LDO regulated outputs | 10 distinct outputs with programmable voltages; LDO4/LDO5 are RF-grade (low noise, 1.6–3.3 V) |
| EN1–EN4 | DC-DC enable/voltage scaling select | Hardware control pins enabling either on/off or switching between OP/AVS register-defined voltages |
| SCL_AVS / SDA_AVS | Dynamic voltage scaling interface | Dedicated I²C bus for real-time core voltage transitions without disturbing main system I²C traffic |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Power Sequencing | OTP-programmed startup/shutdown order across all 14 regulators and GPIOs - eliminates need for external sequencer logic |
| Dynamic Voltage Scaling (DVS) | Dual-path AVS interface (CLK_REQ1/CLK_REQ2 + PWR_REQ) enables sub-10-µs voltage transitions for processor DVFS compliance |
| Capless LDO Architecture | LDO1–LDO3, LDO6–LDO8 support capless operation; output capacitance placed at load improves PSRR and transient response |
| RF-Optimized LDOs | LDO4 and LDO5 deliver <15 µVRMS noise (10 Hz–100 kHz) and support 250/300 mA loads - suitable for RF transceivers and PLLs |
| Integrated Load Switch | Two independent load switches (LSI/LSO, EN_LS0/EN_LS1) with controlled slew rate - replaces discrete FETs for SD card or peripheral power gating |
Applications
| Smartphone Baseband Power | Tablet Application Processor PMU |
|---|---|
Use Scenario: Powers OMAP/ARM-based application processor cores, memory I/O, and RF front-end in LTE smartphones. IC Role / Device Role / Timing Role: Central PMU managing 4x DC-DC rails (core, GPU, memory, RF-PA bias) and 10x LDOs (camera sensor, audio codec, GPS, SIM) with synchronized sequencing. Use Value: Enables single-chip power solution reducing BOM count by ≥12 discrete regulators; DVS support meets ARM big.LITTLE voltage transition requirements. | Use Scenario: Supplies multi-core SoC (e.g., TI AM57xx) in industrial tablets requiring robust thermal management and long battery life. IC Role / Device Role / Timing Role: Primary power controller delivering dynamically scaled core voltage (DCDC1), I/O rail (DCDC2), DDR termination (DCDC3), and always-on domain (LDOAO + LDO10). Use Value: ECO mode cuts DC-DC quiescent current to 3–9 µA, extending standby time; thermal shutdown protects against enclosure overheating during sustained compute loads. |
| Wireless Router Baseband | GPS/GLONASS Module Power |
Use Scenario: Powers QCA/Atheros Wi-Fi/BT combo chipsets in compact 802.11ac routers with strict EMI and thermal constraints. IC Role / Device Role / Timing Role: Delivers clean, low-noise supplies: DCDC4 powers PA (via bypass switch), LDO4/LDO5 feed RF transceiver, LDO1–LDO3 serve baseband logic and memory. Use Value: RF-LDOs achieve <15 µVRMS noise and >60 dB PSRR @ 100 MHz - preserves receiver sensitivity and reduces adjacent-channel interference. | Use Scenario: Supplies u-blox M8/M9 GNSS modules in automotive telematics units where cold-start timing and supply stability are critical. IC Role / Device Role / Timing Role: Provides precise 1.8 V (LDO2), 3.3 V (LDO7), and 2.85 V (LDO3) rails with <±2% DC-DC accuracy and fast wake-up from sleep mode via SLEEP/PWR_REQ pin. Use Value: 32-kHz RC oscillator ensures deterministic power-up sequence within 5 ms; undervoltage lockout prevents brownout-induced GPS data corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS659121YFFT | Same YFF package and pinout; default DC-DC/LDO voltages differ (e.g., DCDC1_OP = 0.85 V vs 1.1375 V); lacks CONFIG1=HIGH option for TPS659122 | Targeted for OMAP4/5 designs with fixed lower-voltage core domains; no support for higher-voltage TPS659122 CONFIG1=HIGH configurations | Select when legacy OMAP4/5 platform requires identical sequencing but lower nominal core voltage (≤0.9 V). |
| TPS659122YFFT | Identical package and pinout; default LDO/DC-DC settings differ significantly (e.g., LDO9 = 3.3 V/1.85 V vs 3.0 V/1.85 V); supports CONFIG1=HIGH/LOW OTP variants | Designed for newer AM437x/AM57xx SoCs requiring higher default I/O voltages (e.g., 3.3 V LDO9) and flexible startup configuration | Choose for AM437x/AM57xx platforms needing 3.3 V LDO9 and dual CONFIG1 modes - verify OTP defaults match your firmware initialization. |
Compared with TPS659121YFFT and TPS659122YFFT, the TPS659127YFFT shares identical packaging, pinout, and functional architecture but is specifically configured with factory-programmed OTP defaults aligned to a defined reference design - ensuring guaranteed startup behavior without software calibration overhead.
Availability
TPS659127YFFT is available at Aetrix Electronics and suitable for smartphone baseband power, tablet application processor PMU, and wireless router baseband applications requiring stable component supply, long-term lifecycle assurance, and full traceability.
Supply support for TPS659127YFFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in energy-efficient IC design.
The TPS65912x product line was engineered to consolidate power delivery for high-performance mobile application processors - integrating DC-DC, LDO, LED, and sequencing functions into a single DSBGA package for space- and thermally constrained handheld devices.
FAQ
What is the package type and ball count for TPS659127YFFT?
The TPS659127YFFT uses an 81-ball DSBGA (Die Size Ball Grid Array) package designated YFF, with 3.6 mm × 3.6 mm body size and 0.4-mm pitch. This ultra-compact package is optimized for thin-profile mobile PCBs and matches the footprint of TPS659121YFFT and TPS659122YFFT for drop-in compatibility in layout-constrained designs.
Does TPS659127YFFT support both I²C and SPI interfaces simultaneously?
No - the TPS659127YFFT supports either I²C or SPI, selected at boot via the DEF_SPI_I2C-GPIO pin (E7). When set to logic 0, pins C4/D4/E4/D5 function as SPI (SCK/MOSI/MISO/CE); when set to logic 1, they become I²C (SCL/SDA) and GPIO1/GPIO2. The dedicated AVS interface (SCL_AVS/SDA_AVS) operates independently as a secondary I²C bus for voltage scaling.
What are the output current capabilities of the DC-DC converters in TPS659127YFFT?
The TPS659127YFFT features four DC-DC converters with verified continuous output currents: DCDC1 delivers up to 2.5 A (VINDCDC1 ≥ 2.8 V), DCDC2 up to 0.75 A (VINDCDC2 ≥ 2.8 V), DCDC3 up to 1.6 A (VINDCDC3 ≥ 2.8 V), and DCDC4 up to 2.5 A (VINDCDC4 ≥ 2.8 V). All support 100% duty cycle for lowest dropout operation.
How does thermal protection work in TPS659127YFFT?
The TPS659127YFFT integrates a thermal monitoring circuit that triggers a high-temperature warning interrupt (INT1) at ~115°C junction temperature and initiates automatic thermal shutdown at >125°C. The shutdown is latched until power cycle or reset, protecting downstream SoC components from thermal damage during sustained high-load operation or poor PCB heatsinking.
Can TPS659127YFFT power RF circuits requiring ultra-low noise?
Yes - TPS659127YFFT includes two dedicated low-noise RF-LDOs (LDO4 and LDO5) with 1.6–3.3 V output range, 250 mA/300 mA capability, and <15 µVRMS output noise (10 Hz–100 kHz). These meet stringent RF supply requirements for transceivers, PLLs, and GPS front-ends where PSRR >60 dB at 100 MHz is critical.
TPS659127YFFT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 81-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 32µA
- Voltage - Supply:
- 1.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 81-DSBGA (3.6x3.6)
TPS659127YFFT FAQ
1.How can I place an order for TPS659127YFFT through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS659127YFFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS659127YFFT reliable?
The price and inventory of TPS659127YFFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS659127YFFT is usually 5 days.
3.What payment methods are accepted for TPS659127YFFT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS659127YFFT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS659127YFFT?
TPS659127YFFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS659127YFFT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS659127YFFT?
For technical support, including TPS659127YFFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS659127YFFT requirements.
6.How does Aetrix verify that TPS659127YFFT is sourced from the original manufacturer or authorized distributors?
All TPS659127YFFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS659127YFFT meets industry standards.
7.What is the process for return or replacement of TPS659127YFFT?
All TPS659127YFFT units undergo pre-shipment inspection (PSI). If there is an issue with TPS659127YFFT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS659127YFFT part is unused and in its original packaging.
Return procedure for TPS659127YFFT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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