My Inquiry
My Account
Texas Instruments TPS659161RGZR
- Part No.:
- TPS659161RGZR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
TPS659161RGZR.pdf
- Description:
- PMU FOR PROCESSOR
- Quantity:
- Payment:
- Shipping:
Inventory:2,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPS659161RGZR from Texas Instruments is a highly integrated power management IC (PMIC) featuring five buck converters (including dual-phase 3.5-A SMPS1/SMPS2 configurable to 7-A) and five LDOs, operating from 3.135 V to 5.25 V input. It delivers dynamic voltage scaling (DVS), 12-bit sigma-delta GPADC with 8 channels, thermal monitoring, and OTP-programmable power sequencing - designed for industrial HMI and programmable logic controller (PLC) applications requiring multi-rail precision power control.
For engineers reviewing the TPS659161RGZR datasheet, TPS659161RGZR pinout, TPS659161RGZR application, or TPS659161RGZR equivalent, key selection criteria include verified dual-phase SMPS capability, hardware/software DVS support, I²C/SPI configurability, OTP-based sequence reliability, and 7-mm × 7-mm VQFN-48 thermal performance in safety-critical embedded systems.
Technical Context
The TPS659161RGZR implements a hierarchical power architecture: five step-down SMPS regulators (two 3.5-A capable, one 3-A, one 2-A, one 1.5-A) with differential remote sensing on SMPS1/SMPS2, plus five LDOs (300-mA bypass-capable, 100-mA low-noise, three 200-mA) for noise-sensitive domains. All SMPS operate at 2.2-MHz nominal switching frequency with external clock synchronization support (1.7–2.7 MHz).
Power sequencing is controlled by factory-programmed OTP memory enabling boot-up without host firmware; sequences are configurable between OFF/SLEEP/ACTIVE states. The integrated 12-bit GPADC monitors two external voltages, internal supply rails, output currents, and die temperature - feeding real-time health data to the host processor via interrupt-driven I²C/SPI interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3.135 V to 5.25 V - supports wide industrial supply rails including 3.3-V and 5-V system buses. |
| SMPS Output Current | Up to 7 A combined (dual-phase SMPS1+SMPS2) - enables high-current core rail delivery with reduced ripple and improved thermal distribution. |
| LDO Output Current | 300 mA (LDO1/LDO2), 100 mA (LDO3), 200 mA (LDO4/LDO5) - provides dedicated low-noise biasing for analog, RTC, and I/O domains. |
| GPADC Resolution | 12-bit sigma-delta with 8 input channels (2 external) - enables simultaneous monitoring of critical system parameters without external sensors. |
| Control Interfaces | SPI + dual I²C (one dedicated to DVS) - allows independent voltage scaling control and resource configuration with minimal host overhead. |
| Power Sequencing | OTP-programmable startup/shutdown sequences - ensures deterministic, software-free power-up for mission-critical industrial controllers. |
| Thermal Protection | High-temp warning + thermal shutdown - prevents device damage during overload or poor heatsinking in enclosed PLC enclosures. |
Pinout & Package
TPS659161RGZR is housed in a 7-mm × 7-mm, 48-pin VQFN package (RGZR) with 0.5-mm pitch and exposed thermal pad for enhanced thermal dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SMPS1_IN / SMPS2_IN | Primary input for dual-phase buck stage | Accepts 3.135–5.25 V system supply; shared input enables coordinated current sharing in 7-A mode. |
| SMPS1_FDBK / SMPS2_FDBK | Differential feedback inputs | Enable remote sensing across load to compensate for PCB trace IR drop and maintain ±1% output accuracy. |
| GPIO_3 | Multi-function I/O | Configurable as SYNCDCDC input to synchronize SMPS switching with external clock - critical for EMI reduction in multi-PMIC systems. |
| INT | Interrupt output | Open-drain signal indicating thermal warning, short-circuit event, or ADC threshold breach - triggers immediate host response. |
| BOOT | Boot configuration ball | Tri-level input determining default power-up sequence; tied to VRTC or ground to select OTP configuration variant at startup. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-phase SMPS capability | SMPS1 and SMPS2 combine into single 7-A output with interleaved timing - reduces input/output capacitor size and lowers RMS current stress. |
| OTP-based power sequencing | Factory-programmed sequences ensure reliable, zero-software boot - eliminates dependency on host bootloader for safe power-up in PLC/HMI systems. |
| Dynamic voltage scaling (DVS) | Hardware- and software-controlled DVS on 3.5-A and 3-A SMPS - enables real-time processor core voltage adjustment to match workload and reduce active power by up to 40%. |
| Integrated GPADC | 12-bit sigma-delta converter with internal temperature, current, and supply monitoring - replaces discrete sense circuitry and simplifies BOM for thermal-aware designs. |
| Fail-safe GPIO architecture | Five GPIOs rated to 5.25 V with OTP-configurable pull direction - ensures robust interfacing with legacy industrial I/O without level shifters. |
Applications
| Industrial Automation | Human Machine Interface (HMI) |
|---|---|
|
Use Scenario: Powering programmable logic controllers (PLCs) with multiple voltage domains (CPU core, FPGA I/O, analog sensors, communication interfaces). IC Role / Device Role / Timing Role: Central PMIC managing 5 independent SMPS and 5 LDOs with OTP-defined sequencing - ensures deterministic power-up of CPU, memory, and peripherals before firmware execution. Use Value: Eliminates need for discrete DC/DCs and sequencers; reduces board area by >35% while guaranteeing safe startup under brownout conditions. |
Use Scenario: Supplying touch-screen controllers, display drivers, and ARM-based application processors in factory-floor HMIs. IC Role / Device Role / Timing Role: Dual-phase 7-A SMPS powers processor core; low-noise 100-mA LDO supplies touchscreen controller ADC; GPADC monitors panel temperature. Use Value: Enables adaptive brightness and thermal throttling via real-time die temperature feedback - extends display lifetime in high-ambient-temperature environments. |
| Camera Surveillance System | Programmable Logic Controller (PLC) |
|
Use Scenario: Powering multi-sensor IP cameras with image signal processors (ISPs), DDR memory, and Ethernet PHYs. IC Role / Device Role / Timing Role: Three SMPS deliver 1.2 V (core), 1.8 V (memory), and 3.3 V (I/O); two LDOs provide clean 1.2 V and 2.5 V for analog front-end and clock buffers. Use Value: Differential remote sensing maintains <±1% output regulation across long PCB traces to camera modules - prevents ISP lockup due to voltage droop. |
Use Scenario: Supporting modular I/O expansion in DIN-rail mounted PLCs with hot-swap capability and watchdog supervision. IC Role / Device Role / Timing Role: SMPS1/SMPS2 supply main CPU and FPGA; LDOVRTC powers real-time clock during backup; watchdog timer resets host on firmware hang. Use Value: OTP-configured power-down sequence preserves RTC state and enables fast wake-from-sleep (<100 ms) - meets IEC 61131-3 cycle-time requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS659171RGZR | Same pinout and OTP architecture but adds USB OTG support and enhanced GPIO count (8 vs 7); identical SMPS/LDO specs and sequencing engine. | Required when system includes USB peripheral connectivity or needs additional general-purpose I/O for sensor polling. | Select TPS659171RGZR only if USB OTG functionality or extra GPIOs are needed - otherwise TPS659161RGZR offers lower cost and identical power performance. |
| TPS659121RGZR | Reduced feature set: four SMPS (max 3.5-A), four LDOs, no GPADC, no OTP sequencing - uses SPI-only control and lacks thermal shutdown. | Suitable for cost-sensitive, non-safety-critical applications where simplified power tree and no thermal monitoring are acceptable. | Choose TPS659121RGZR only for basic multi-rail systems without ADC monitoring, OTP reliability, or thermal protection - not a drop-in replacement. |
Compared with TPS659171RGZR and TPS659121RGZR, the TPS659161RGZR uniquely balances full-feature integration (GPADC, OTP sequencing, dual-phase SMPS) with industrial-grade reliability - making it optimal for HMI and PLC designs requiring deterministic startup, real-time health monitoring, and EMI-controlled switching.
Availability
TPS659161RGZR is available at Aetrix Electronics and suitable for industrial automation, human machine interface (HMI), and programmable logic controller (PLC) applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-critical deployments.
Supply support for TPS659161RGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of experience delivering high-reliability components for industrial and automotive markets.
The TPS65916 product line was engineered specifically for complex industrial control systems - integrating sequencing, monitoring, and multi-rail conversion into a single chip to simplify design, improve reliability, and reduce time-to-market for PLCs and HMIs.
FAQ
What is the maximum combined output current capability of the TPS659161RGZR's SMPS regulators?
The TPS659161RGZR supports dual-phase operation of SMPS1 and SMPS2, delivering up to 7 A total output current. This configuration uses interleaved switching to reduce input/output ripple and thermal stress. Individual SMPS regulators provide 3.5-A (SMPS1/SMPS2), 3-A (SMPS3), 2-A (SMPS4), and 1.5-A (SMPS5) - all operating from the same 3.135–5.25 V input range. The TPS659161RGZR datasheet confirms this rating under thermal-limited conditions with proper PCB layout and heatsinking.
Does the TPS659161RGZR support dynamic voltage scaling (DVS) for processor core rails?
Yes, the TPS659161RGZR supports hardware- and software-controlled DVS on its 3.5-A (SMPS1/SMPS2) and 3-A (SMPS3) buck regulators. DVS registers allow real-time voltage adjustment in 10-mV or 20-mV steps across 0.7–3.3 V output range. This capability is used to dynamically match processor core voltage to workload - reducing active power consumption in ARM-based HMIs and PLCs. The TPS659161RGZR implements DVS via dedicated I²C interface and SPI register access.
How does the OTP memory in the TPS659161RGZR affect system startup reliability?
The TPS659161RGZR uses factory-programmed one-time programmable (OTP) memory to store power-up/down sequences, default voltage settings, and GPIO configurations - enabling fully autonomous, software-free startup. If OTP bit-integrity error detection triggers, the TPS659161RGZR halts power-up and holds RESET_OUT low, preventing undefined system states. This makes the TPS659161RGZR ideal for industrial applications where bootloader failure must not compromise safety or functional integrity.
Can the TPS659161RGZR monitor system temperature and trigger protective actions?
Yes, the TPS659161RGZR integrates thermal monitoring with two thresholds: high-temperature warning and thermal shutdown. Its 12-bit GPADC measures internal die temperature continuously, and the thermal block asserts the INT pin when thresholds are exceeded. Upon thermal shutdown, the TPS659161RGZR disables all SMPS and LDOs except LDOVRTC, then holds RESET_OUT low until temperature falls below hysteresis. This behavior is documented in the TPS659161RGZR electrical characteristics section for thermal monitoring.
What package type and thermal characteristics does the TPS659161RGZR use?
The TPS659161RGZR is packaged in a 7-mm × 7-mm, 48-pin VQFN (RGZR) with 0.5-mm pitch and exposed thermal pad. Its thermal resistance θJA is 32.5°C/W (JEDEC standard board), and θJC is 3.5°C/W - enabling operation up to 85°C ambient with standard 2-oz copper and thermal vias. The package supports reflow soldering per JEDEC J-STD-020 and is rated for industrial temperature range (–40°C to +105°C junction). These values are specified in the TPS659161RGZR thermal information table.
TPS659161RGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 3.135 ~ 5.25V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VQFN (7x7)
TPS659161RGZR FAQ
1.How can I place an order for TPS659161RGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS659161RGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS659161RGZR reliable?
The price and inventory of TPS659161RGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS659161RGZR is usually 5 days.
3.What payment methods are accepted for TPS659161RGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS659161RGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS659161RGZR?
TPS659161RGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS659161RGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS659161RGZR?
For technical support, including TPS659161RGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS659161RGZR requirements.
6.How does Aetrix verify that TPS659161RGZR is sourced from the original manufacturer or authorized distributors?
All TPS659161RGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS659161RGZR meets industry standards.
7.What is the process for return or replacement of TPS659161RGZR?
All TPS659161RGZR units undergo pre-shipment inspection (PSI). If there is an issue with TPS659161RGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS659161RGZR part is unused and in its original packaging.
Return procedure for TPS659161RGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPS659161RGZR Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
