Texas Instruments TPS65920A2ZCHR

Overview

TPS65920A2ZCHR from Texas Instruments is a highly integrated power management IC (PMIC) designed for OMAP™-based mobile applications. It integrates three buck converters, four external LDOs, USB 2.0 OTG transceiver with charge pump, LED drivers, RTC, embedded power controller (EPC), and 15 GPIOs - all in a single 139-ball PBGA package. It supports smart voltage scaling via SmartReflex™ Class-3 interface and enables compact, low-power handheld systems.

For engineers reviewing the TPS65920A2ZCHR datasheet, TPS65920A2ZCHR pinout, TPS65920A2ZCHR application, or TPS65920A2ZCHR equivalent, key selection criteria include its triple-buck architecture with dynamic voltage scaling support, ULPI-compliant USB 2.0 OTG transceiver, dual LED driver with PWM control, real-time clock with backup battery charging, and keypad scanning capability for resource-constrained mobile platforms.

Technical Context

The TPS65920A2ZCHR implements a multi-rail power subsystem optimized for OMAP application processors, featuring three independent step-down converters (VDD1, VDD2, VIO) with feedback pins and switch nodes, plus four externally configurable LDOs (VAUX2, VRTC, VPLL1, VDAC). Its SmartReflex™ Class-3 interface enables dynamic voltage and frequency scaling by communicating directly with the processor's power management unit.

The device includes a full USB 2.0 High-Speed OTG transceiver compliant with CEA-936A carkit specification and CEA-2011 OTG standard, supported by an internal 5-V charge pump (VBUS supply), ULPI interface (12-bit data bus + control signals), and dedicated USB power rails (VINTUSB1P5, VINTUSB1P8, VUSB.3P1). It lacks audio codec functionality - distinguishing it from the TPS65930 variant.

Key Specifications

Pinout & Package

ZCH package: 139-ball plastic ball grid array (PBGA), 10.0 mm × 10.0 mm body size, 0.65-mm ball pitch, thermally enhanced for mobile PMIC applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management IC applications.

Compared with TPS65930A2ZCHR, the TPS65920A2ZCHR omits audio codec circuitry - reducing die size, cost, and power consumption where voice processing is unnecessary. Against TPS659121ZQCR, it retains SmartReflex™ hardware DVS and keypad scanning - offering deterministic, low-latency power control without firmware dependency.

Availability

TPS65920A2ZCHR is available at Aetrix Electronics and suitable for smartphone, tablet, industrial handheld, and connected medical device applications requiring stable component supply, long-term lifecycle support, and automotive-grade reliability validation.

Supply support for TPS65920A2ZCHR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-reliability IC design.

The TPS65920 belongs to TI's OMAP-optimized PMIC product line, engineered specifically to meet the dynamic voltage scaling, USB OTG, RTC retention, and system-level power sequencing demands of mobile and portable computing platforms.

FAQ

What is the primary function of the TPS65920A2ZCHR in a mobile system?

The TPS65920A2ZCHR serves as the central power management IC for OMAP-based mobile devices, integrating three buck converters, four LDOs, USB 2.0 OTG transceiver, RTC with backup charging, LED drivers, keypad scanner, and 15 GPIOs. Unlike the TPS65930A2ZCHR, the TPS65920A2ZCHR excludes audio codec functionality - making it ideal for non-audio-centric handheld applications where power efficiency and integration density are prioritized.

Does the TPS65920A2ZCHR support USB On-The-Go functionality?

Yes, the TPS65920A2ZCHR includes a fully compliant USB 2.0 High-Speed OTG transceiver with integrated 5-V charge pump, ULPI interface (DATA0–DATA7, DIR, NXT, STP, UCLK), and CEA-2011/CEA-936A certification. It supports both host and peripheral modes and connects directly to OMAP UTMI+ interfaces without requiring an external PHY - enabling compact, low-cost USB connectivity in smartphones and tablets.

How does the SmartReflex™ interface operate on the TPS65920A2ZCHR?

The TPS65920A2ZCHR implements SmartReflex™ Class-3, which accepts dynamic voltage scaling commands directly from the OMAP processor via VMODE1/VMODE2 pins and dedicated control logic. This hardware-accelerated interface adjusts VDD1 and VDD2 output voltages in real time based on processor load state - reducing dynamic power consumption without firmware intervention or I2C transaction latency.

Can the TPS65920A2ZCHR be used in place of the TPS65930A2ZCHR?

No - the TPS65920A2ZCHR cannot substitute for the TPS65930A2ZCHR in audio-enabled systems because it lacks the integrated audio codec (dual 16-bit DAC/ADC, I2S/TDM interface, microphone bias, predrivers). While both share identical PMIC, USB, RTC, and GPIO subsystems, the TPS65920A2ZCHR is functionally a subset. Pin compatibility exists, but audio functionality will be absent if swapped without redesign.

What thermal and packaging specifications apply to the TPS65920A2ZCHR?

The TPS65920A2ZCHR uses the ZCH package: a 139-ball PBGA with 10.0 mm × 10.0 mm body size and 0.65-mm pitch. It is rated for –40°C to +85°C ambient operation and features thermal characteristics validated per TI SWCS037I Rev I, including θ_JA = 32.5°C/W and θ_JC = 5.2°C/W. The package includes exposed thermal pad (connected to AGND) and supports standard Pb-free reflow profiles.