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Texas Instruments TPS65920BZCHR
- Part No.:
- TPS65920BZCHR
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 139-LFBGA
- Datasheet:
-
TPS65920BZCHR.pdf
- Description:
- IC PWR MGMT 4 LDO TXRX 139BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,102
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Product details
Overview
TPS65920BZCHR from Texas Instruments is a highly integrated power management IC (PMIC) for OMAP™-based mobile systems, featuring three buck converters, four external LDOs, USB 2.0 OTG transceiver with ULPI interface, LED drivers, RTC, keypad interface, and 15 GPIOs - all in a 139-ball PBGA package. It delivers dynamic voltage scaling via SmartReflex™ Class-3 and supports industrial handheld and tablet applications requiring compact, multi-rail power sequencing.
For engineers reviewing the TPS65920BZCHR datasheet, TPS65920BZCHR pinout, TPS65920BZCHR application, or TPS65920BZCHR equivalent, key selection criteria include its triple-buck architecture, ULPI-compliant USB PHY, real-time clock with backup battery charging, 139-pin ZCH package compatibility, and SmartReflex-enabled adaptive voltage control for OMAP processors.
Technical Context
The TPS65920BZCHR implements dedicated SmartReflex™ Class-3 interfaces to dynamically scale VDD1 and VDD2 output voltages based on processor load states, enabling system-level power optimization. Its USB subsystem integrates a full HS OTG transceiver compliant with CEA-936A carkit specification and includes an internal charge pump for VBUS generation.
Power delivery is segmented into three independent buck regulators (VDD1, VDD2, VIO), each with dedicated feedback and switch pins, plus four configurable external LDOs (VAUX2, VRTC, VPLL1, VDAC) and multiple internal analog/digital rails (VINTANA1/2, VINTDIG, VINTUSB). The device uses a 32-kHz crystal oscillator (32KXIN/32KXOUT) and provides buffered 32KCLKOUT for system timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Buck Converters | Three independent step-down regulators (VDD1, VDD2, VIO) supporting dynamic voltage scaling for OMAP core, memory, and I/O rails. |
| LDO Count | Four external linear regulators: VAUX2 (2.8 V), VRTC (1.8 V), VPLL1 (1.8 V), VDAC (2.8 V) - each with dedicated input/output pins and bypass capability. |
| USB Interface | ULPI-compliant USB 2.0 HS OTG transceiver with integrated 5-V charge pump, supporting CEA-936A carkit and CEA-2011 OTG specifications. |
| RTC & Backup | Integrated real-time clock powered by VRTC.OUT; includes coin-cell charger (PCHGAC, VPRECH) and retention circuitry for operation during main power loss. |
| GPIOs | 15 general-purpose I/Os with programmable pull-up/down, interrupt capability, and multiplexed functions including keypad scanning (6×6 matrix support). |
| Package | ZCH (139-ball PBGA), 10.0 mm × 10.0 mm, 0.65-mm pitch - compatible with high-density mobile PCB layouts and thermal management requirements. |
| SmartReflex | Two dedicated Class-3 SmartReflex™ interfaces (VMODE1, VMODE2) for closed-loop dynamic voltage/frequency scaling of VDD1 and VDD2 rails. |
Pinout & Package
TPS65920BZCHR is housed in a 139-ball plastic ball grid array (PBGA) package designated ZCH, measuring 10.0 mm × 10.0 mm with 0.65-mm ball pitch. The package supports fine-pitch routing and thermal dissipation suitable for handheld mobile platforms.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1.IN / VDD1.SW / VDD1.FB / VDD1.GND | Buck converter input, switch node, feedback, ground | Enables 1.0–1.5-V programmable output for OMAP core rail with external inductor/capacitor filtering. |
| VDD2.IN / VDD2.SW / VDD2.FB / VDD2.GND | Buck converter input, switch node, feedback, ground | Provides 1.0–1.5-V output for memory rail with SmartReflex™ Class-3 voltage scaling via VMODE2. |
| VIO.IN / VIO.SW / VIO.FB / VIO.GND | Buck converter input, switch node, feedback, ground | Generates 1.8-V I/O rail; independent of SmartReflex™ but supports fixed or programmable output. |
| VBAT, VBAT.RIGHT, VBAT.USB | Main battery input and USB power domain | Accepts 2.8–5.5-V battery input; routes power to internal regulators and enables USB OTG VBUS generation via CP.IN/CP.CAPP/CP.CAPM. |
| I2C.SR.SDA/SCL, I2C.CNTL.SDA/SCL | SmartReflex™ and general-purpose I²C interfaces | Dual I²C buses allow simultaneous PMIC configuration and dynamic voltage control without bus contention. |
| 32KXIN / 32KXOUT / 32KCLKOUT | 32-kHz crystal oscillator input/output and buffered clock | Supports external 32.768-kHz crystal; 32KCLKOUT provides low-jitter clock for RTC and system wake-up timing. |
| DP/UART3.RXD, DN/UART3.TXD, ID, UCLK, STP, DIR, NXT, DATA[0:7] | ULPI physical layer interface | Direct connection to OMAP UTMI+ interface; eliminates need for external ULPI-to-UTMI bridge logic. |
| KPD.R[0:5], KPD.C[0:5] | Keypad scan rows/columns | Hardware-accelerated 6×6 keypad decoder reduces CPU overhead; supports debounced key detection and interrupt generation. |
Key Features
| Feature | Design Value |
|---|---|
| Triple Buck + Four LDO Architecture | Simultaneous regulation of OMAP core (VDD1), memory (VDD2), I/O (VIO), and auxiliary rails (VAUX2, VRTC, VPLL1, VDAC) minimizes external component count and board area. |
| SmartReflex™ Class-3 Support | Real-time voltage scaling of VDD1/VDD2 based on processor activity - reduces dynamic power by up to 30% in burst-mode workloads. |
| Integrated ULPI USB 2.0 OTG | Eliminates external PHY; supports host/peripheral modes, battery-powered VBUS generation, and CEA-936A carkit compliance without additional level shifters. |
| RTC with Backup Battery Charging | Retains time/date across power cycles using coin-cell; automatic trickle-charge circuit (PCHGAC/VPRECH) extends backup battery life beyond 5 years. |
| 15 GPIOs with Keypad Engine | Hardware-based 6×6 keypad scanning offloads CPU; GPIOs support interrupt-on-change, configurable drive strength, and dual-voltage I/O (1.8-V domain). |
Applications
| Smartphone Power Management | Industrial Handheld Terminal |
|---|---|
Use Scenario: Compact smartphone platform with OMAP application processor requiring sequenced, low-noise power rails and USB OTG functionality. IC Role / Device Role / Timing Role: Central PMIC managing core, memory, I/O, and peripheral power domains; provides 32-kHz RTC timing and ULPI USB interface. Use Value: Reduces BOM count by integrating three bucks, four LDOs, USB PHY, RTC, and keypad controller - enabling sub-100-mm² power solution footprint. | Use Scenario: Ruggedized industrial PDA used in warehouse logistics with barcode scanning, backlight control, and long-term RTC operation. IC Role / Device Role / Timing Role: Primary power sequencer and system supervisor; drives two LEDs via PWM-controlled LEDA/LEDB outputs and maintains accurate time via VRTC-backed RTC. Use Value: Integrated LED drivers eliminate discrete FETs and current-limiting resistors; backup battery charging ensures >5-year RTC uptime without field maintenance. |
| Tablet Reference Design | Connected Medical Device |
Use Scenario: Low-power Android tablet reference design targeting 8-hour battery life and fast USB host charging. IC Role / Device Role / Timing Role: Power management hub coordinating OMAP DVFS states, USB OTG enumeration, and system sleep/wake transitions via NSLEEP1/PWRON signals. Use Value: SmartReflex™ Class-3 interfaces enable precise VDD1/VDD2 voltage tracking to processor demand - improving energy efficiency at partial loads. | Use Scenario: Portable ECG monitor requiring ultra-low standby current, reliable RTC timestamping, and isolated analog sensing inputs. IC Role / Device Role / Timing Role: System power controller with dedicated analog ground domains (AVSS1–AVSS4) and precision ADC input channels (ADCIN0, ADCIN2) for sensor biasing. Use Value: Separated analog/digital ground planes and dedicated LDOs (VINTANA1/2) minimize noise coupling into sensitive biopotential measurements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65930A2ZCHR | Includes full audio codec (dual DAC/ADC, stereo TDM/I²S), differential mic inputs, and FM/AUX analog front-end not present in TPS65920BZCHR. | Suitable for voice-centric devices requiring hands-free calling, voice recording, or FM radio integration. | Select TPS65930A2ZCHR only if audio processing capability is required; TPS65920BZCHR offers lower cost and reduced complexity for non-audio PMIC use cases. |
| TPS65910A3ZCHR | Successor PMIC with enhanced SmartReflex™ Class-3 support, lower quiescent current (15 µA vs. 25 µA), and improved thermal performance in same ZCH package. | Targeted at next-generation OMAP4/5 platforms with tighter power budgets and higher integration density. | TPS65910A3ZCHR is a functional upgrade path; pin-compatible but requires firmware updates due to register map differences and added features like enhanced RTC alarm. |
Compared with TPS65930A2ZCHR and TPS65910A3ZCHR, the TPS65920BZCHR provides optimized cost and feature set for OMAP3-based designs where audio codec is unnecessary and legacy register compatibility is critical - making it ideal for volume production of established mobile platforms.
Availability
TPS65920BZCHR is available at Aetrix Electronics and suitable for smartphone power management, industrial handheld terminals, and tablet reference designs requiring stable component supply, long-lifecycle support, and TI-qualified automotive-grade reliability.
Supply support for TPS65920BZCHR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-reliability IC design.
The TPS65920 product line was engineered specifically for OMAP™-based mobile computing platforms, delivering tightly integrated power sequencing, USB connectivity, and system supervision in a single-chip solution for space-constrained portable electronics.
FAQ
What is the primary function of the TPS65920BZCHR in an OMAP-based system?
The TPS65920BZCHR serves as the central power management IC for OMAP application processors, providing three buck converters (VDD1, VDD2, VIO), four external LDOs, USB 2.0 OTG transceiver, RTC, keypad interface, and 15 GPIOs. It enables complete power sequencing, dynamic voltage scaling via SmartReflex™, and system-level supervision - eliminating the need for discrete power components in smartphones and tablets.
Does the TPS65920BZCHR support USB On-The-Go functionality?
Yes, the TPS65920BZCHR integrates a full USB 2.0 High-Speed OTG transceiver compliant with CEA-2011 and CEA-936A specifications. It supports host/peripheral mode switching, includes an internal 5-V charge pump for VBUS generation, and connects directly to OMAP UTMI+ via ULPI interface (DP/DN, UCLK, STP, DIR, NXT, DATA[0:7]) - no external PHY required.
How does the SmartReflex™ interface operate on the TPS65920BZCHR?
The TPS65920BZCHR implements two dedicated SmartReflex™ Class-3 interfaces (VMODE1 for VDD1, VMODE2 for VDD2) that accept dynamic voltage commands from the OMAP processor. These digital inputs adjust buck converter output voltages in real time to match processing load - reducing dynamic power consumption while maintaining timing margins. Feedback is handled internally; no external DAC or resistor network is needed.
What package type and dimensions does the TPS65920BZCHR use?
The TPS65920BZCHR is packaged in a ZCH (139-ball PBGA) package measuring 10.0 mm × 10.0 mm with 0.65-mm ball pitch. This fine-pitch BGA supports high-density routing and thermal dissipation in mobile form factors, and is mechanically and thermally qualified for reflow soldering per JEDEC J-STD-020 standards.
Can the TPS65920BZCHR be used in systems requiring long-term RTC operation during main power loss?
Yes, the TPS65920BZCHR includes a fully integrated real-time clock powered by the VRTC.OUT LDO, which remains active when main VBAT is absent. It also features a dedicated backup battery charger (PCHGAC, VPRECH) that trickle-charges a coin-cell battery - ensuring >5 years of continuous RTC operation and timekeeping accuracy even after extended storage or power interruption.
TPS65920BZCHR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 139-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Mobile/OMAP™
- Current - Supply:
- 300µA
- Voltage - Supply:
- 2.7V ~ 4.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 139-NFBGA (10x10)
TPS65920BZCHR FAQ
1.How can I place an order for TPS65920BZCHR through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS65920BZCHR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS65920BZCHR reliable?
The price and inventory of TPS65920BZCHR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS65920BZCHR is usually 5 days.
3.What payment methods are accepted for TPS65920BZCHR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS65920BZCHR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS65920BZCHR?
TPS65920BZCHR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS65920BZCHR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS65920BZCHR?
For technical support, including TPS65920BZCHR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS65920BZCHR requirements.
6.How does Aetrix verify that TPS65920BZCHR is sourced from the original manufacturer or authorized distributors?
All TPS65920BZCHR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS65920BZCHR meets industry standards.
7.What is the process for return or replacement of TPS65920BZCHR?
All TPS65920BZCHR units undergo pre-shipment inspection (PSI). If there is an issue with TPS65920BZCHR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS65920BZCHR part is unused and in its original packaging.
Return procedure for TPS65920BZCHR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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