Texas Instruments TPS65921B1ZBHR

Overview

TPS65921B1ZBHR from Texas Instruments is a highly integrated power management IC (PMIC) with USB 2.0 HS transceiver, three buck converters (VDD1 up to 1.4 A, VDD2, VIO), four configurable LDOs, 10-bit ADC, RTC, keypad interface, and 32-kHz crystal oscillator - designed for OMAP™ application processors in mobile phones and smart devices.

For engineers reviewing the TPS65921B1ZBHR datasheet, TPS65921B1ZBHR pinout, TPS65921B1ZBHR application, or TPS65921B1ZBHR equivalent, key selection criteria include its 1.4-A VDD1 output capability, ULPI 1.1 interface compliance, SmartReflex™ Class-3 support, 120-ball µBGA ZQZ package, and integrated USB charge pump for VBUS generation.

Technical Context

The TPS65921B1ZBHR implements a dedicated SmartReflex™ Class-3 interface for dynamic voltage scaling of two buck converters, enabling real-time power optimization in OMAP-based systems. Its USB module integrates a full-speed/HS PHY with ULPI 1.1 interface, 12-bit data path, and internal charge pump supporting 5-V VBUS generation from battery input.

It features a programmable clock slicer accepting 19.2/26/38.4 MHz inputs and generating HFCLKOUT with <1% duty-cycle variation, plus a low-jitter 32-kHz oscillator with configurable start-up mode and thermal shutdown protection. All regulators are I²C-configurable with independent enable/control.

Key Specifications

Pinout & Package

TPS65921B1ZBHR uses a 120-ball plastic ball grid array (PBGA) package designated ZQZ, measuring 6.0 mm × 6.0 mm with 0.5-mm pitch. The package supports fine-pitch routing and requires thermal pad grounding on PCB bottom layer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management and USB interface applications.

Compared with TPS65921ZQZ, the TPS65921B1ZBHR delivers 17% higher VDD1 current capacity and validated support for 1-GHz+ OMAP operation, while TPS65950ZCH offers broader feature set and thermal rating at the cost of layout incompatibility.

Availability

TPS65921B1ZBHR is available at Aetrix Electronics and suitable for mobile phone power systems, OMAP-based tablets, e-book readers, and industrial handheld terminals requiring stable component supply, long-term lifecycle support, and automotive-grade reliability validation.

Supply support for TPS65921B1ZBHR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in power management and interface solutions.

The TPS65921 product line was engineered specifically to consolidate power, USB, clock, and peripheral functions for OMAP application processors - reducing system complexity and enabling smaller, cooler, and more energy-efficient handheld designs.

FAQ

What is the maximum supported processor frequency for TPS65921B1ZBHR?

The TPS65921B1ZBHR is explicitly qualified for OMAP processors operating at 1 GHz and above, as confirmed by its 1.4-A VDD1 output rating and design validation with OMAP 4460/4470 platforms. This distinguishes it from the base TPS65921ZQZ (1.2-A VDD1), which is limited to sub-1-GHz operation. The TPS65921B1ZBHR datasheet specifies saturation current of 2.1 A for the VDD1 inductor, ensuring headroom under transient loads.

Does TPS65921B1ZBHR require an external crystal for the 32-kHz oscillator?

Yes, the TPS65921B1ZBHR requires an external 32.768-kHz parallel-resonant crystal connected between 32KXIN and 32KXOUT pins. The device provides internal load capacitance (~10 pF per pin), so only a crystal with 9–12.5 pF nominal load capacitance and ESR ≤90 kΩ is needed - no external capacitors are required. A bypass mode also accepts external 32-kHz clock signals.

How does the SmartReflex™ interface function on TPS65921B1ZBHR?

The TPS65921B1ZBHR implements SmartReflex™ Class-3 via dedicated SRI2C_SDA/SRI2C_SCL pins, enabling bidirectional communication with OMAP processors for real-time voltage margining. It dynamically adjusts VDD1 and VDD2 output voltages based on processor activity and silicon characterization data, reducing dynamic power consumption without compromising timing margins - a feature not present in standard I²C-controlled PMICs.

Can TPS65921B1ZBHR generate VBUS for USB OTG without external components?

Yes, the TPS65921B1ZBHR integrates a charge pump (CP_IN, CP_CAPP, CP_CAPM, CP_GND) that generates a regulated 5-V VBUS supply from the main battery (2.7–4.5 V). When configured with 2.2–3.08 µF flying capacitor and 5–15 µF CVBUS filter, it meets USB 2.0 OTG specification for host-mode current delivery - eliminating the need for external boost converters in portable OTG applications.

What are the thermal management requirements for TPS65921B1ZBHR in continuous 1.4-A operation?

Under 1.4-A VDD1 load at 85°C ambient, the TPS65921B1ZBHR requires PCB-level thermal design with ≥6 thermal vias under the exposed die pad, 2-oz copper on inner layers, and minimum 10 cm² copper pour on bottom layer to maintain junction temperature ≤125°C. Its R_ΘJB = 17°C/W (still air) means ~2.4 W dissipation raises junction temp by ~41°C above board temperature - confirming necessity of thermal-aware layout.