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Texas Instruments TPS65921B1ZQZ
- Part No.:
- TPS65921B1ZQZ
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 120-VFBGA
- Datasheet:
-
TPS65921B1ZQZ.pdf
- Description:
- IC PWR MGMT 4 LDO TXRX 120BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
TPS65921B1ZQZ from Texas Instruments is a highly integrated power management IC (PMIC) with USB 2.0 HS transceiver, 3 buck converters (VDD1 up to 1.4 A), 4 configurable LDOs, 10-bit ADC, RTC, keypad interface, and clock management for OMAP™ application processors. It operates from 2.7–4.5 V input and supports 1-GHz processor operation via SmartReflex™ dynamic voltage scaling.
For engineers reviewing the TPS65921B1ZQZ datasheet, TPS65921B1ZQZ pinout, TPS65921B1ZQZ application, or TPS65921B1ZQZ equivalent, key selection considerations include VDD1 current capability (1.4 A), ULPI 1.1 interface compliance, 120-ball µBGA ZQZ package, thermal shutdown protection, and I²C-configurable resource allocation across mobile SoC power domains.
Technical Context
The TPS65921B1ZQZ integrates three synchronous step-down converters - VDD1 (1.4 A max), VDD2 (1.2 A), and VIO (1.2 A) - each with dedicated feedback loops and typical 30 µA quiescent current. Its USB subsystem implements a full-speed/HS 2.0 transceiver with integrated charge pump, 12-bit ULPI 1.1 interface, and OTG-compliant control logic.
On-chip clock resources include a 32-kHz crystal oscillator, HF clock slicer supporting 19.2/26/38.4 MHz outputs, and buffered HFCLKOUT/32KCLKOUT signals. Power sequencing is managed by embedded power control (EPC) logic synchronized with OMAP boot requirements and SmartReflex Class-3 signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 Output Current | Up to 1.4 A - enables direct supply of high-performance OMAP cores requiring >1.2 A at sub-1.5 V. |
| Input Voltage Range | 2.7 V to 4.5 V - compatible with single-cell Li-ion/Li-polymer battery systems without external regulation. |
| USB Interface | ULPI 1.1-compliant HS 2.0 transceiver with integrated 5-V charge pump - eliminates need for external USB PHY. |
| Package | 120-ball µBGA (ZQZ), 6.0 mm × 6.0 mm - optimized for space-constrained handheld PCB layouts. |
| SmartReflex Support | Class-3 dynamic voltage management for VDD1/VDD2 - reduces active power in OMAP-based systems during DVFS transitions. |
| ADC Resolution | 10-bit SAR ADC with 8-channel multiplexer - enables battery voltage, temperature, and auxiliary analog monitoring. |
| RTC Functionality | Real-time clock with alarm wake-up and backup mode (1.0–1.55 V) - maintains timekeeping during system sleep or main power loss. |
Pinout & Package
Package: 120-ball plastic ball grid array (PBGA), ZQZ, 6.0 mm × 6.0 mm, 0.4-mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1.IN | Main input for VDD1 buck converter | Accepts 2.7–4.5 V battery input; requires external 10–22 µF ceramic capacitor per TI spec for ≥1 GHz OMAP support. |
| VDD1.L | Switch node output of VDD1 buck | Connects to external inductor (0.7–1.3 µH, 2.1 A saturation); critical for EMI and efficiency optimization. |
| VDD1.OUT | Feedback sense point for VDD1 | Resistor-divider network sets output voltage (0.6–1.45 V); precision setting required for OMAP core rail stability. |
| I2C.CNTL.SDA / SCL | High-speed I²C control interface | Configures all regulators, clocks, ADC, and GPIOs; supports 400 kHz standard-mode and fast-mode timing. |
| HFCLKOUT | High-frequency clock output | Provides 19.2/26/38.4 MHz square wave (50% duty cycle) referenced to IO.1P8; drives OMAP UTMI+ macrocell directly. |
| 32KXIN / 32KXOUT | 32.768 kHz crystal oscillator terminals | Supports parallel-resonant tuning crystal (10 pF load, ≤200 ppm temp drift); internal 10 pF caps reduce external component count. |
| DP / DM | USB 2.0 differential data pair | Full-speed/HS-capable physical layer; requires controlled 90-Ω differential impedance routing and <5-mm length matching. |
| KPD.R0–R7 / C0–C7 | Keypad scan matrix I/O | Hardware-accelerated 8×8 keypad decoder; reduces host CPU overhead and enables low-power key wake-up events. |
Key Features
| Feature | Design Value |
|---|---|
| Three Buck Converters | VDD1 (1.4 A), VDD2 (1.2 A), VIO (1.2 A) - independently programmable output voltages (0.6–1.5 V) with SmartReflex Class-3 support for OMAP DVFS. |
| USB HS 2.0 Transceiver | Integrated ULPI 1.1 interface + 5-V charge pump - eliminates discrete USB PHY and external VBUS switch in portable designs. |
| Configurable LDO Set | Four general-purpose LDOs (VMMC1, VDAC, VAUX2, VPLL1) + six internal LDOs - software-defined rail assignment simplifies multi-rail SoC power architecture. |
| Embedded Power Control | Hardware sequencer synchronizes power-up/down of OMAP subsystems - ensures correct reset timing and avoids latch-up during boot. |
| 10-Bit MADC | 8-input multiplexer with programmable sampling rate - monitors battery voltage, die temperature, and auxiliary analog sensors without MCU intervention. |
| Thermal Protection | Hot-die detection + automatic thermal shutdown - triggers at 125°C junction, latches until manual reset via TEST.RESET or power cycle. |
Applications
| Mobile Smartphone Power System | OMAP-Based Tablet Platform |
|---|---|
|
Use Scenario: Powering dual-core OMAP 4/5 SoC with dynamic voltage/frequency scaling, USB OTG connectivity, and real-time audio/video processing. IC Role / Device Role / Timing Role: Central PMIC managing core, I/O, memory, and peripheral rails; provides HFCLKOUT/32KCLKOUT timing references and ULPI-linked USB PHY. Use Value: Reduces BOM count by integrating 3 DC-DCs, 4 LDOs, USB transceiver, ADC, RTC, and keypad controller - enabling compact, thermally efficient smartphone mainboard design. |
Use Scenario: Supplying high-current VDD1 rail (>1.3 A) to 1-GHz+ OMAP application processor while maintaining USB 2.0 HS host/device functionality and battery fuel gauging. IC Role / Device Role / Timing Role: Primary power controller with SmartReflex Class-3 interface for OMAP DVFS coordination; delivers stable 1.2-V core rail with <10-mV load transient deviation. Use Value: Enables seamless transition between performance and low-power states without external sequencing logic - critical for tablet battery life extension and thermal management. |
| E-Book Reader with Touch Keypad | Handheld Industrial Scanner |
|
Use Scenario: Supporting e-ink display controller, capacitive/touch keypad, SD card interface, and Bluetooth module from single Li-ion cell. IC Role / Device Role / Timing Role: Multi-rail power source with programmable LDOs (VMMC1 for SD, VDAC for display bias, VAUX2 for sensor bias); keypad scan engine handles 8×8 matrix autonomously. Use Value: Eliminates need for discrete LDOs and keypad controller ICs - reduces PCB area and firmware complexity while extending battery runtime via ultra-low-quiescent LDOs. |
Use Scenario: Powering barcode scanner engine, CMOS image sensor, RF module, and ruggedized UI in battery-operated field equipment. IC Role / Device Role / Timing Role: Robust power manager with thermal shutdown, RTC alarm wake-up, and 10-bit ADC for battery voltage/temperature telemetry. Use Value: Ensures reliable operation under wide ambient temperatures (–40°C to 85°C) and harsh conditions - validated for industrial-grade lifecycle and ESD immunity (250 V CDM). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management and USB interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65921ZQZ | Lower VDD1 current rating (1.2 A vs. 1.4 A); identical pinout and register map. | Not suitable for OMAP systems operating ≥1 GHz where peak VDD1 demand exceeds 1.2 A. | Select TPS65921ZQZ only if target SoC frequency is <1 GHz and thermal margin allows reduced current headroom. |
| TPS65950ZCH | Successor device with enhanced USB 2.0 PHY, higher integration (integrated charger), and updated SmartReflex v2.0 protocol. | Requires firmware update for register compatibility; supports newer OMAP 44xx/54xx families with extended feature set. | Choose TPS65950ZCH for new designs targeting OMAP 4460/5430 and requiring integrated battery charging or improved USB robustness. |
Compared with TPS65921ZQZ, the TPS65921B1ZQZ delivers 0.2-A higher VDD1 current for 1-GHz+ OMAP operation, while TPS65950ZCH adds charger functionality and protocol enhancements - making TPS65921B1ZQZ optimal for cost-sensitive, high-frequency legacy OMAP platforms needing proven reliability.
Availability
TPS65921B1ZQZ is available at Aetrix Electronics and suitable for mobile smartphones, OMAP-based tablets, and handheld industrial scanners requiring stable component supply, long-term lifecycle support, and automotive-grade thermal robustness.
Supply support for TPS65921B1ZQZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies for industrial, automotive, and consumer applications.
The TPS65921 product line was designed specifically to address the complex, multi-rail power sequencing, dynamic voltage scaling, and peripheral interface needs of OMAP application processors in portable computing devices.
FAQ
What distinguishes TPS65921B1ZQZ from the base TPS65921ZQZ?
The TPS65921B1ZQZ is a variant engineered for higher-performance OMAP systems, featuring increased VDD1 output current capability of 1.4 A (vs. 1.2 A in TPS65921ZQZ). This enables stable operation at 1-GHz processor frequencies where peak core current demands exceed 1.2 A. All other functional blocks - including USB transceiver, LDOs, ADC, RTC, and pinout - remain identical, ensuring drop-in compatibility in existing layouts when thermal and layout margins permit the higher current.
Does TPS65921B1ZQZ support USB On-The-Go (OTG) functionality?
Yes, TPS65921B1ZQZ fully supports USB 1.3 OTG-compliant operation through its integrated HS 2.0 transceiver and ULPI 1.1 interface. It provides VBUS sensing, ID pin detection, and charge pump-based 5-V CP supply for VBUS generation - enabling host/peripheral role switching without external circuitry. The device meets USB 2.0 electrical specifications for both full-speed and high-speed signaling when paired with compliant OMAP UTMI+ macrocells.
How is SmartReflex™ implemented in TPS65921B1ZQZ?
TPS65921B1ZQZ implements SmartReflex Class-3 dynamic voltage management via dedicated SRI2C_SDA/SRI2C_SCL pins that interface directly with OMAP's SmartReflex controller. This allows real-time, closed-loop adjustment of VDD1 and VDD2 output voltages based on processor activity and temperature - reducing dynamic power consumption without software intervention. The PMIC responds to voltage requests within microseconds, maintaining tight regulation (<±2%) during rapid DVFS transitions.
What are the thermal limitations and protections for TPS65921B1ZQZ?
TPS65921B1ZQZ features hot-die detection and thermal shutdown protection triggered at 125°C junction temperature. Its ZQZ package has RΘJA = 46°C/W under still air, and thermal performance is validated up to 85°C ambient. The device includes thermal warning flags accessible via I²C status registers, allowing firmware to initiate throttling before shutdown. For sustained 1.4-A VDD1 operation, TI recommends ≥200 mm² copper pour on inner layers and thermal vias under the package to maintain safe junction temperatures.
Can TPS65921B1ZQZ operate without an external 32.768-kHz crystal?
No - TPS65921B1ZQZ requires an external 32.768-kHz parallel-resonant crystal connected to 32KXIN/32KXOUT pins to enable RTC, alarm wake-up, and low-power clock functions. The oscillator includes internal 10-pF load capacitance and supports crystals with ±30 ppm tolerance at 25°C and ±200 ppm over –40°C to 85°C. Bypass mode (using external 32-kHz clock) is not supported; the crystal is mandatory for all RTC and sleep-mode timing operations.
TPS65921B1ZQZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 120-VFBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Applications:
- Handheld/Mobile Devices, OMAP™
- Current - Supply:
- 300µA
- Voltage - Supply:
- 2.7V ~ 4.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 120-BGA Microstar Junior (6x6)
TPS65921B1ZQZ FAQ
1.How can I place an order for TPS65921B1ZQZ through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS65921B1ZQZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS65921B1ZQZ reliable?
The price and inventory of TPS65921B1ZQZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS65921B1ZQZ is usually 5 days.
3.What payment methods are accepted for TPS65921B1ZQZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS65921B1ZQZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS65921B1ZQZ?
TPS65921B1ZQZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS65921B1ZQZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS65921B1ZQZ?
For technical support, including TPS65921B1ZQZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS65921B1ZQZ requirements.
6.How does Aetrix verify that TPS65921B1ZQZ is sourced from the original manufacturer or authorized distributors?
All TPS65921B1ZQZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS65921B1ZQZ meets industry standards.
7.What is the process for return or replacement of TPS65921B1ZQZ?
All TPS65921B1ZQZ units undergo pre-shipment inspection (PSI). If there is an issue with TPS65921B1ZQZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS65921B1ZQZ part is unused and in its original packaging.
Return procedure for TPS65921B1ZQZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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