Texas Instruments TPS65921B1ZQZR

Overview

TPS65921B1ZQZR from Texas Instruments is a highly integrated power management IC (PMIC) with USB 2.0 HS transceiver, three buck converters (VDD1 up to 1.4 A, VDD2, VIO), four configurable LDOs, 10-bit ADC, RTC, keypad interface, and 32-kHz crystal oscillator - designed for OMAP™ application processors in mobile phones and smart devices.

For engineers reviewing the TPS65921B1ZQZR datasheet, TPS65921B1ZQZR pinout, TPS65921B1ZQZR application, or TPS65921B1ZQZR equivalent, key selection criteria include its SmartReflex™ Class-3 support for dynamic voltage scaling, ULPI 1.1 interface compliance, 120-ball µBGA ZQZ package, and verified operation across 2.7–4.5 V input with 30 µA quiescent current per converter.

Technical Context

The TPS65921B1ZQZR integrates three synchronous step-down converters - VDD1 supports up to 1.4 A output with SmartReflex™ Class-3 control, VDD2 and VIO each deliver up to 1.2 A and 1.85 V respectively - alongside four general-purpose LDOs including VMMC1 (220 mA), VDAC (1.2–1.8 V), VAUX2 (1.3–2.8 V), and VPLL1 (1.0–1.8 V).

Its USB subsystem implements a full-speed/HS 2.0 transceiver with integrated charge pump, 12-bit ULPI 1.1 interface, OTG-compliant control logic, and dedicated VBUS supply path; clock management includes a 32-kHz crystal oscillator, HF clock slicer supporting 19.2/26/38.4 MHz outputs, and programmable 32KCLKOUT buffer.

Key Specifications

Pinout & Package

TPS65921B1ZQZR uses a 120-ball plastic ball grid array (PBGA) package designated ZQZ, measuring 6.0 mm × 6.0 mm with 0.4-mm pitch. The device features dedicated power, analog, digital, and USB signal balls arranged in a 11×11 array with corner balls omitted.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management and USB interface applications.

Compared with TPS65921ZQZR, the TPS65921B1ZQZR delivers 17% higher VDD1 current capacity and validated 1-GHz OMAP support, while TPS65950ZCH offers broader peripheral integration at the cost of larger size and higher BOM cost - making TPS65921B1ZQZR the optimal balance for mid-tier OMAP4 designs.

Availability

TPS65921B1ZQZR is available at Aetrix Electronics and suitable for mobile phone, e-book reader, and OMAP-based tablet designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp.

Supply support for TPS65921B1ZQZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in power management ICs.

The TPS65921 product line was engineered specifically to address the complex power sequencing, dynamic voltage scaling, and USB interface requirements of OMAP application processors in portable computing and communications devices.

FAQ

What is the maximum supported output current for the VDD1 buck converter in TPS65921B1ZQZR?

The TPS65921B1ZQZR supports up to 1.4 A continuous output current on the VDD1 buck converter, as confirmed in the device overview and specifications section of the SWCS048G datasheet. This rating is specific to the B1 variant and enables reliable operation with ≥1-GHz OMAP processors. The TPS65921B1ZQZR requires an external inductor rated for 2.1 A saturation current and a 10-µF output capacitor (or two 22-µF capacitors for high-frequency OMAP use cases).

Does TPS65921B1ZQZR include a built-in USB PHY, and what interface standard does it support?

Yes, the TPS65921B1ZQZR integrates a full USB 2.0 High-Speed transceiver with an on-chip charge pump, supporting HS (480 Mbps) and FS (12 Mbps) modes. It complies with ULPI 1.1 specification and connects directly to OMAP UTMI+ macrocells. The device provides dedicated DP/DM pins, ULPI data bus (DATA0–DATA7), and control signals (DIR, NXT, STP, CLK) - eliminating need for external USB PHY in OMAP-based designs.

How does the SmartReflex™ interface function in TPS65921B1ZQZR, and which rails support it?

The TPS65921B1ZQZR implements SmartReflex™ Class-3 interface on both VDD1 and VDD2 buck converters, enabling real-time dynamic voltage scaling coordinated with the OMAP processor. The interface uses dedicated SRI2C_SDA/SRI2C_SCL pins for autonomous voltage adjustment based on processor load and temperature - distinct from the main I²C control bus. This allows fine-grained power optimization without software intervention during active operation.

What package type and dimensions does TPS65921B1ZQZR use, and is it RoHS compliant?

The TPS65921B1ZQZR uses a 120-ball micro Ball Grid Array (µBGA) package designated ZQZ, with body dimensions of 6.0 mm × 6.0 mm and 0.4-mm ball pitch. Per TI's packaging documentation and orderable information, the ZQZ package is lead-free and RoHS compliant, with NiPdAu surface finish and JEDEC-standard moisture sensitivity level (MSL) 3 handling requirements.

Can TPS65921B1ZQZR operate with a 32.768-kHz crystal, and what are the key oscillator specifications?

Yes, the TPS65921B1ZQZR includes a dedicated 32-kHz crystal oscillator with support for standard 32.768-kHz tuning-fork crystals. Key specifications include internal load capacitance of 8–12 pF per pin, ±30 ppm room-temperature tolerance, ±200 ppm over –40°C to 85°C, and typical active current of 0.8–1.8 µA depending on jitter mode. The oscillator drives the RTC and provides 32KCLKOUT buffered output referenced to IO.1P8.