Texas Instruments TPS65950A2ZXN
- Part No.:
- TPS65950A2ZXN
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 209-VFBGA
- Datasheet:
-
TPS65950A2ZXN.pdf
- Description:
- IC PWR MGMT W/11 LDO 209-BGA
- Quantity:
- Payment:

- Shipping:

Inventory:792
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Product details
Overview
TPS65950A2ZXN from Texas Instruments is a highly integrated power management and audio codec IC designed for OMAP™ application processors. It integrates three buck converters (VDD1: 1.2 A, VDD2: 600 mA, VIO: 700 mA), a USB 2.0 OTG HS transceiver with ULPI interface, a Li-ion/Li-polymer battery charger supporting AC/USB/carkit sources, and a 15-bit linear audio codec with stereo Class-D drivers and differential microphone inputs - enabling compact smartphone and tablet power/audio subsystems.
For engineers reviewing the TPS65950A2ZXN datasheet, TPS65950A2ZXN pinout, TPS65950A2ZXN application, or TPS65950A2ZXN equivalent, key selection considerations include its 209-ball nFBGA package, SmartReflex™ Class-3 dynamic voltage scaling support, dual I²C interfaces (SmartReflex + general-purpose), integrated RTC with coin-cell backup charging, and hardware-automated charger type detection for AC/USB/carkit sources.
Technical Context
The TPS65950A2ZXN implements a multi-domain power architecture with dedicated buck regulators for core (VDD1), memory (VDD2), and I/O (VIO) rails, each with independent feedback and enable control. Its SmartReflex™ Class-3 interface enables real-time voltage scaling coordinated with OMAP processor activity states via dedicated VMODE1/VMODE2 pins and embedded power controller logic.
The audio subsystem features dual ADC paths (16-bit stereo, 48/44.1/32 kHz) and five DAC channels supporting PCM/TDM/I²S interfaces, with analog signal chains including MICBIAS1/2 outputs, VHSMIC bias, differential headset/earpiece/HSOL/HSOR outputs, and predriver outputs for external Class-D amplifiers - all managed through register-controlled digital mixing and automatic level control (ALC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 Output Current | 1.2 A - supplies OMAP processor core rail with hardware-managed SmartReflex™ Class-3 DVFS |
| VDD2 Output Current | 600 mA - powers memory subsystem; supports independent sequencing and UVLO monitoring |
| VIO Output Current | 700 mA - delivers I/O voltage with dedicated feedback loop and thermal shutdown protection |
| Audio ADC Resolution | 16-bit stereo - supports 48/44.1/32 kHz sampling for voice capture with programmable gain and ALC |
| Audio DAC Resolution | 16-bit stereo - provides 96/48/44.1/32 kHz playback with digital mixing and pop-noise reduction |
| USB Interface | USB 2.0 OTG HS transceiver with ULPI (12-bit) and integrated charge pump - enables direct UTMI+ connection to OMAP without external PHY |
| Package | 209-ball nFBGA, 7.0 mm × 7.0 mm, 0.4-mm pitch - requires controlled-impedance PCB layout for high-speed digital and analog signal integrity |
Pinout & Package
TPS65950A2ZXN uses a 209-ball plastic ball grid array (nFBGA) package with 0.4-mm pitch and 7.0 mm × 7.0 mm body size. Ball mapping follows JEDEC MO-244AC standard; corner balls (Test, TestV1, Test.RESET, TestV2) are non-functional.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1.IN / VDD1.SW / VDD1.FB / VDD1.GND | Buck converter 1 power input, switch node, feedback, ground | Forms complete 1.2-A core power stage; FB pin enables precision output regulation and dynamic voltage scaling |
| VDD2.IN / VDD2.SW / VDD2.FB / VDD2.GND | Buck converter 2 power input, switch node, feedback, ground | Provides 600-mA memory rail with independent sequencing and thermal foldback protection |
| VIO.IN / VIO.SW / VIO.FB / VIO.GND | Buck converter 3 power input, switch node, feedback, ground | Delivers 700-mA I/O voltage with low-noise design for analog and digital peripherals |
| PCM.VCK / PCM.VDX / PCM.VDR / PCM.VFS | PCM voice port clock, transmit, receive, frame sync | Enables synchronous voice data transfer between baseband processor and codec at 8/16 kHz sample rates |
| I2S.CLK / I2S.SYNC / I2S.DIN / I2S.DOUT | I²S audio port clock, word select, receive, transmit | Supports stereo audio streaming at 32–96 kHz with TDM multiplexing capability for multi-channel use |
| MIC.MAIN.P/M / MIC.SUB.P/M / HSMIC.P/M | Differential analog microphone inputs | Accepts electret and MEMS microphones with programmable bias (MICBIAS1/2, VHSMIC) and ALC |
| IHF.LEFT.P/M / IHF.RIGHT.P/M / EAR.P/M | Hands-free speaker and earpiece differential outputs | Drives 32-Ω headsets and 8-Ω speakers directly; supports pop-noise suppression and volume ramping |
Key Features
| Feature | Design Value |
|---|---|
| Triple Buck Converters with Independent Control | Enables precise, sequenced power delivery to OMAP core, memory, and I/O domains - reducing external component count and improving system-level efficiency |
| Hardware-Automated Charger Detection | Identifies AC-regulated, USB host, USB charger, and carkit sources without software intervention - ensuring safe, compliant charging across diverse accessories |
| Dual I²C Interfaces (SmartReflex + General Purpose) | Allows simultaneous DVFS coordination via SmartReflex bus and independent peripheral configuration via separate I²C controller - eliminating bus contention |
| Integrated RTC with Backup Battery Charging | Maintains timekeeping during main power loss and autonomously recharges coin-cell backup using VBAT - critical for always-on connectivity features |
| 10 External Linear LDOs | Supplies clocks, sensors, and peripherals with low-noise, independently enabled outputs - simplifying power tree design and reducing BOM cost |
| USB 2.0 OTG HS Transceiver with CEA-936A Support | Meets Mini-USB analog carkit specification and MCPC UART GL-006 requirements - enabling certified automotive accessory integration |
Applications
| Smartphone Power & Audio Subsystem | Tablet Baseband Integration |
|---|---|
Use Scenario: Compact handheld device requiring single-chip power management and high-fidelity voice/audio processing for cellular calls, VoIP, and media playback. IC Role / Device Role / Timing Role: Central power/audio hub interfacing directly with OMAP processor via SmartReflex, PCM, I²S, and USB OTG - managing voltage scaling, battery charging, and full-duplex audio paths. Use Value: Eliminates discrete PMIC + audio codec + USB PHY, reducing PCB area by >40% and enabling sub-10mm Z-height designs with thermal-aware power sequencing. |
Use Scenario: Mid-size tablet with dual-microphone noise cancellation, stereo speaker output, and USB OTG peripheral support for keyboards/mice. IC Role / Device Role / Timing Role: Audio subsystem controller providing 16-bit stereo ADC/DAC, differential headset/earpiece drivers, and ULPI-connected USB 2.0 host functionality - synchronized via shared 32-kHz RTC clock. Use Value: Delivers SNR >90 dB(A) voice capture and 100-mW/channel Class-D output while supporting CEA-936A carkit compliance and MCPC ME-Universal UART. |
| Industrial Handheld Terminal | Connected Medical Device |
Use Scenario: Ruggedized barcode scanner or field service terminal needing reliable battery charging, keypad scanning, LED indicators, and voice prompt playback. IC Role / Device Role / Timing Role: System power manager and audio prompt engine - using integrated keypad interface (8×8 matrix), LED drivers with PWM dimming, and mono/stereo DAC outputs. Use Value: Reduces bill-of-materials by integrating 19 GPIOs, 10 LDOs, vibrator control, RTC, and MADC - enabling single-board operation without companion ICs. |
Use Scenario: Portable patient monitor requiring low-power operation, audible alerts, biometric sensor power, and secure firmware updates over USB. IC Role / Device Role / Timing Role: Trusted power/audio co-processor - supplying regulated voltages to ECG/SpO₂ sensors via LDOs, generating audible alarms via earpiece DAC, and enabling secure USB firmware loading via OTG transceiver. Use Value: Supports IEC 62304 Class B safety compliance with thermal shutdown, UVLO monitoring on all rails, and hardware-enforced charger isolation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management and audio codec applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65950A3ZXN | VDD1 rated at 1.4 A (vs. 1.2 A); optimized for 1-GHz OMAP speed grade | Required for higher-performance OMAP variants demanding increased core current | Select when target processor operates above 800 MHz and requires >1.2 A VDD1 sustained current |
| TPS65912ZQWR | Lower integration: no audio codec, no USB transceiver, fewer LDOs (6 vs. 10), 128-ball WCSP package | Suitable for cost-sensitive OMAP-based designs where audio/USB handled externally | Choose when audio and USB functions are implemented separately - reduces thermal load and simplifies layout |
Compared with TPS65950A3ZXN, the TPS65950A2ZXN offers lower VDD1 current but identical feature set and pin compatibility; compared with TPS65912ZQWR, it provides full audio/USB integration at the cost of larger package and higher thermal density - making it optimal for space-constrained, feature-complete handhelds.
Availability
TPS65950A2ZXN is available at Aetrix Electronics and suitable for smartphone, tablet, industrial handheld, and connected medical device applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for TPS65950A2ZXN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets since 1930.
The TPS65950 product line was developed specifically to serve OMAP™ application processor platforms - integrating power management, audio, USB, and system control functions into a single die to reduce solution size and accelerate time-to-market for mobile and portable electronics.
FAQ
What is the primary function of the TPS65950A2ZXN in an OMAP-based system?
The TPS65950A2ZXN serves as the central power management and audio subsystem controller for OMAP™ application processors. It delivers regulated voltages to the processor core (VDD1), memory (VDD2), and I/O (VIO) domains, manages Li-ion battery charging from multiple sources, provides full-duplex audio processing via integrated 16-bit ADC/DAC, and hosts a USB 2.0 OTG HS transceiver - all within a single 209-ball nFBGA package. The TPS65950A2ZXN enables compact, thermally efficient designs by consolidating functions previously requiring multiple discrete ICs.
How does the TPS65950A2ZXN handle battery charging from different sources?
The TPS65950A2ZXN automatically detects and configures for AC-regulated chargers, USB host devices, USB chargers, and carkits using dedicated sense pins (PCHGAC, PCHGUSB, VAC, VBATS) and internal state machines. It applies hardware-controlled linear charging for AC/USB/carkit sources and supports software-controlled charging profiles for all types. The TPS65950A2ZXN includes precharge circuitry, thermal regulation, and end-of-charge termination - ensuring safe, compliant charging without host processor intervention.
Does the TPS65950A2ZXN support dynamic voltage scaling (DVS) for OMAP processors?
Yes, the TPS65950A2ZXN supports SmartReflex™ Class-3 dynamic voltage scaling via dedicated VMODE1 and VMODE2 pins that interface directly with OMAP's SmartReflex controller. This enables real-time adjustment of VDD1 and VDD2 output voltages based on processor workload, reducing dynamic power consumption. The TPS65950A2ZXN's embedded power controller (EPC) also manages power sequencing and retention modes - ensuring correct startup/shutdown order and RTC backup during sleep states.
What audio interfaces does the TPS65950A2ZXN provide, and at what sample rates?
The TPS65950A2ZXN provides PCM, I²S, and TDM digital audio interfaces plus analog microphone and speaker connections. Its 16-bit stereo ADC supports 48, 44.1, and 32 kHz sampling for voice capture, while its 16-bit stereo DAC supports 96, 48, 44.1, and 32 kHz playback. Analog inputs include differential main/sub/headset microphones with programmable bias; outputs include differential earpiece, headset, and hands-free speaker drivers - all with integrated pop-noise suppression and automatic level control. These capabilities make the TPS65950A2ZXN suitable for high-fidelity voice communication and media playback.
Is the TPS65950A2ZXN pin-compatible with other members of the TPS65950 family?
Yes, the TPS65950A2ZXN is pin-compatible with the TPS65950A3ZXN and shares the same 209-ball nFBGA package, ball map, and register set. The only functional difference is VDD1 current capability: TPS65950A2ZXN delivers 1.2 A for sub-1-GHz OMAP variants, while TPS65950A3ZXN delivers 1.4 A for 1-GHz speed grades. All other features - including USB transceiver, audio codec, SmartReflex interface, RTC, and LDO count - are identical, enabling drop-in replacement in compatible designs.
TPS65950A2ZXN Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 209-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Mobile/OMAP™
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 4.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 209-NFBGA
TPS65950A2ZXN FAQ
1.How can I place an order for TPS65950A2ZXN through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS65950A2ZXN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS65950A2ZXN reliable?
The price and inventory of TPS65950A2ZXN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS65950A2ZXN is usually 5 days.
3.What payment methods are accepted for TPS65950A2ZXN?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS65950A2ZXN transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS65950A2ZXN?
TPS65950A2ZXN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS65950A2ZXN order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS65950A2ZXN?
For technical support, including TPS65950A2ZXN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS65950A2ZXN requirements.
6.How does Aetrix verify that TPS65950A2ZXN is sourced from the original manufacturer or authorized distributors?
All TPS65950A2ZXN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS65950A2ZXN meets industry standards.
7.What is the process for return or replacement of TPS65950A2ZXN?
All TPS65950A2ZXN units undergo pre-shipment inspection (PSI). If there is an issue with TPS65950A2ZXN, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS65950A2ZXN part is unused and in its original packaging.
Return procedure for TPS65950A2ZXN:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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