Texas Instruments TPS65950A3ZXN
- Part No.:
- TPS65950A3ZXN
- Manufacturer:
- Texas Instruments
- Category:
- Power Management - Specialized
- Package:
- 209-VFBGA
- Datasheet:
-
TPS65950A3ZXN.pdf
- Description:
- IC PWR MGMT 11 LDO TXRX 209NFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,220
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Product details
Overview
TPS65950A3ZXN from Texas Instruments is a highly integrated power management and audio codec IC designed for OMAP™ application processors. It delivers 1.4-A VDD1 buck converter (for 1-GHz operation), 600-mA VDD2, 700-mA VIO, USB 2.0 OTG HS transceiver with ULPI interface, and 15-bit linear audio codec supporting 8/16 kHz sampling - enabling compact smartphone and tablet power/audio subsystems.
For engineers reviewing the TPS65950A3ZXN datasheet, TPS65950A3ZXN pinout, TPS65950A3ZXN application, or TPS65950A3ZXN equivalent, key selection criteria include SmartReflex™ Class-3 dynamic voltage scaling support, dual 32-Ω headset drivers with differential outputs, integrated Li-ion/USB/carkit charging with hardware-controlled linear regulation, and 209-ball nFBGA (7 mm × 7 mm) package compatibility with OMAP3/4 platforms.
Technical Context
The TPS65950A3ZXN integrates three independent buck converters (VDD1/VDD2/VIO), ten external LDOs, and an embedded power controller (EPC) to manage OMAP power sequencing and retention. Its SmartReflex™ Class-3 interface enables real-time adaptive voltage scaling based on processor load and temperature feedback.
The audio subsystem includes stereo 16-bit DACs (96/48/44.1/32 kHz), stereo 16-bit ADCs (48/44.1/32 kHz), five digital microphone inputs, three differential analog mic inputs (main/sub/headset), and dual 8-Ω Class-D drivers - all synchronized via PCM/TDM/I2S interfaces and managed by dedicated audio PLL and digital mixing logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD1 Output Current | 1.4 A - supports 1-GHz OMAP processor core voltage rail with SmartReflex™ Class-3 DVFS control |
| VDD2 Output Current | 600 mA - supplies OMAP memory interface and peripheral domains |
| VIO Output Current | 700 mA - powers I/O banks including USB, I2C, UART, and GPIO at 1.8 V |
| Audio DAC Resolution | 16-bit linear - enables high-fidelity stereo playback with 96 kHz sampling and pop-noise suppression |
| USB Interface | USB 2.0 OTG HS transceiver with 12-bit ULPI - connects directly to OMAP UTMI+ interface without external PHY |
| Package | nFBGA-209, 7.0 mm × 7.0 mm, 0.4-mm pitch - matches OMAP3/4 reference board layouts and thermal requirements |
| Battery Charger | Li-ion/Li-polymer charger supporting AC-regulated, USB host, USB charger, and carkit sources with automatic detection and hardware-controlled precharge |
Pinout & Package
TPS65950A3ZXN uses a 209-ball plastic ball grid array (nFBGA) package with 0.4-mm pitch and 7.0 mm × 7.0 mm body size. Ball mapping follows JEDEC MO-245 standard; corner balls (Test, TestV1, Test.RESET, TestV2) are non-functional.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1.IN / VDD1.SW / VDD1.FB / VDD1.GND | Main core power input/switching node/feedback/GND | Supports 1.4-A buck regulator with external inductor and capacitor; FB pin enables precise output voltage regulation |
| VDD2.IN / VDD2.SW / VDD2.FB / VDD2.GND | Memory/peripheral power input/switching node/feedback/GND | 600-mA buck stage optimized for low-noise operation near DDR and video interfaces |
| VIO.IN / VIO.SW / VIO.FB / VIO.GND | I/O domain power input/switching node/feedback/GND | 700-mA buck regulator delivering stable 1.8-V supply for USB, I2C, UART, and GPIO banks |
| PCM.VCK / PCM.VDX / PCM.VDR / PCM.VFS | Voice port clock/data transmit/receive/frame sync | Full-duplex PCM interface supporting 8/16 kHz voice channels with programmable frame timing |
| I2S.CLK / I2S.SYNC / I2S.DIN / I2S.DOUT | Audiostream clock/sync/data in/out | Standard I2S/TDM interface for stereo audio streaming between OMAP and codec with sample-rate flexibility |
| MIC.MAIN.P/M / MIC.SUB.P/M / HSMIC.P/M | Differential analog microphone inputs | Three independent differential mic paths with dedicated bias generators (MICBIAS1/2, VHSMIC.OUT) |
| IHF.LEFT.P/M / IHF.RIGHT.P/M / EAR.P/M / HSOL/HSOR | Hands-free speaker/earpiece/headset outputs | Class-D and linear amplifier outputs with differential drive capability and DC-blocking capacitor support |
| GPIO0–GPIO17 / KPD.R0–R7 / KPD.C0–C7 | General-purpose I/O / keypad scan rows/columns | 19 configurable GPIOs plus 8×8 keypad interface with built-in scanning engine to reduce CPU overhead |
Key Features
| Feature | Design Value |
|---|---|
| SmartReflex™ Class-3 DVFS | Hardware-managed dynamic voltage scaling for OMAP core domain using real-time activity and temperature feedback |
| Integrated Li-ion Charger | Automatic source detection (AC/USB/carkit) with hardware-controlled linear charging and backup battery recharge |
| Dual 8-Ω Class-D Amplifiers | Stereo differential outputs driving 8-Ω loads directly - eliminates need for external power amplifiers in handheld audio |
| 10-Bit MADC with 8 Inputs | System monitoring of battery voltage, temperature, charger status, and auxiliary analog signals with programmable thresholds |
| RTC with Backup Battery Support | Real-time clock retains time/date during main power loss; coin-cell charger maintains RTC operation indefinitely |
| CEA-936A Carkit Interface | Native analog carkit support per Consumer Electronics Association specification - no external level-shifting required |
Applications
| Smartphone Power & Audio Subsystem | Tablet Baseband Integration |
|---|---|
Use Scenario: Compact mobile device requiring single-chip power management and HD voice/audio processing for cellular and VoIP calls. IC Role / Device Role / Timing Role: Central PMIC and audio codec managing OMAP processor rails, battery charging, headset I/O, and voice path timing via PCM/I2S. Use Value: Reduces BOM count by integrating 3 buck converters, 10 LDOs, USB OTG PHY, and 15-bit audio codec - enabling sub-10 mm² solution area. |
Use Scenario: Mid-size tablet with dual-band Wi-Fi, HDMI output, and multi-mic array requiring coordinated power sequencing and low-latency audio capture. IC Role / Device Role / Timing Role: System-level power controller and audio hub synchronizing OMAP DDR, GPU, and audio subsystem clocks via embedded PLL and RTC. Use Value: Enables simultaneous 48-kHz stereo recording from 3 differential mics and playback through dual Class-D speakers with <50 µs group delay. |
| Industrial Handheld Terminal | Connected Medical Device |
Use Scenario: Ruggedized barcode scanner or field service terminal needing reliable battery charging, keypad interface, and voice-guided UI. IC Role / Device Role / Timing Role: Power manager and audio front-end providing keypad scan engine, LED driver PWM control, and headset-based voice prompt delivery. Use Value: Integrates 8×8 keypad decoder, two LED drivers with PWM dimming, and voice codec - eliminating 4 discrete ICs and reducing firmware complexity. |
Use Scenario: Portable ECG or spirometer with Bluetooth audio streaming, battery-backed data logging, and audible alarm generation. IC Role / Device Role / Timing Role: Power/audio SoC supplying regulated rails to sensor front-end, running RTC-backed data timestamping, and generating calibrated tone alarms via DAC. Use Value: Delivers medical-grade timing accuracy (±5 ppm RTC drift) and isolated audio paths - meeting IEC 60601-1 leakage current and noise immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management and audio codec applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65950A2ZXN | 1.2-A VDD1 buck (vs. 1.4-A in A3); identical pinout, register map, and feature set | Targeted for OMAP systems operating below 1-GHz clock speeds; lower thermal dissipation | Select A2 for cost-sensitive designs where 1.2-A core current suffices and thermal margin is constrained |
| TPS65912ZCVR | Lower integration: no audio codec, no USB OTG PHY, no carkit interface; 1.2-A VDD1 only | Used in OMAP-L1x and Sitara AM335x systems requiring basic PMIC functions without audio/USB | Choose TPS65912 for non-audio applications where footprint and BOM reduction outweigh audio/USB functionality |
Compared with TPS65950A2ZXN and TPS65912ZCVR, the TPS65950A3ZXN uniquely combines 1.4-A SmartReflex™-enabled core power, full audio codec with Class-D drivers, and CEA-936A-compliant carkit interface - making it the only option for high-performance OMAP3/4 smartphones requiring integrated voice and charging.
Availability
TPS65950A3ZXN is available at Aetrix Electronics and suitable for smartphone, tablet, and industrial handheld applications requiring stable component supply, long-term lifecycle support, and TI-authorized traceability.
Supply support for TPS65950A3ZXN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management technologies for industrial, automotive, and consumer markets.
The TPS65950 product line was developed specifically to serve OMAP™ application processor platforms, integrating tightly coupled power sequencing, SmartReflex™ DVFS, and high-fidelity audio I/O in a single chip for mobile computing devices.
FAQ
What distinguishes TPS65950A3ZXN from the TPS65950A2ZXN variant?
The TPS65950A3ZXN provides a 1.4-A VDD1 buck converter optimized for 1-GHz OMAP processor operation, while the TPS65950A2ZXN delivers 1.2 A. Both share identical pinout, register map, and feature set - including USB 2.0 OTG, audio codec, and SmartReflex™ Class-3 support - but the A3 variant enables higher sustained core performance under thermal constraints.
Does TPS65950A3ZXN support USB On-The-Go without an external PHY?
Yes, the TPS65950A3ZXN integrates a full USB 2.0 OTG High-Speed transceiver with 12-bit ULPI interface, enabling direct connection to OMAP UTMI+ macrocells. No external PHY is required - the device handles signal integrity, termination, and protocol handshaking internally, including CEA-2011 and MCPC ME-Universal UART compliance.
Can TPS65950A3ZXN charge batteries from both USB and AC sources simultaneously?
No, the TPS65950A3ZXN automatically detects and selects a single active charging source - AC-regulated adapter, USB host, USB charger, or carkit - based on voltage, current capability, and enumeration status. It does not support concurrent charging from multiple sources to prevent overvoltage or thermal stress on the battery.
What audio sample rates does the TPS65950A3ZXN DAC support?
The TPS65950A3ZXN stereo DAC supports 96 kHz, 48 kHz, 44.1 kHz, and 32 kHz sampling rates - along with integer derivatives - across PCM and TDM interfaces. The DAC resolution is 16-bit linear, with integrated digital filtering, pop-noise suppression, and side-tone generation for hands-free voice communication.
Is the RTC in TPS65950A3ZXN functional when main power is removed?
Yes, the RTC in TPS65950A3ZXN remains fully operational during main power loss by drawing power from a backup battery connected to the VRTC pin. The device includes a dedicated coin-cell charger (VBAT → VRTC) that maintains the backup battery at optimal voltage, ensuring continuous timekeeping and alarm functionality for years.
TPS65950A3ZXN Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 209-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Mobile/OMAP™
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 4.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 209-NFBGA
TPS65950A3ZXN FAQ
1.How can I place an order for TPS65950A3ZXN through Aetrix?
Please submit a Request for Quotation (RFQ) for TPS65950A3ZXN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPS65950A3ZXN reliable?
The price and inventory of TPS65950A3ZXN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPS65950A3ZXN is usually 5 days.
3.What payment methods are accepted for TPS65950A3ZXN?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPS65950A3ZXN transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPS65950A3ZXN?
TPS65950A3ZXN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPS65950A3ZXN order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPS65950A3ZXN?
For technical support, including TPS65950A3ZXN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPS65950A3ZXN requirements.
6.How does Aetrix verify that TPS65950A3ZXN is sourced from the original manufacturer or authorized distributors?
All TPS65950A3ZXN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPS65950A3ZXN meets industry standards.
7.What is the process for return or replacement of TPS65950A3ZXN?
All TPS65950A3ZXN units undergo pre-shipment inspection (PSI). If there is an issue with TPS65950A3ZXN, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPS65950A3ZXN part is unused and in its original packaging.
Return procedure for TPS65950A3ZXN:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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