Texas Instruments TPS75003QRHLREP

Overview

TPS75003QRHLREP from Texas Instruments is a radiation-hardened triple-output power management IC designed for FPGA and DSP core/I/O/auxiliary rail sequencing. It integrates two 3-A non-synchronous buck controllers (94% peak efficiency, 1.22 V feedback reference) and one 300-mA adjustable LDO (250 mV dropout at 300 mA), all operating across –55°C to +125°C in a 20-pin QFN package. It is Xilinx-qualified for Spartan-3, Spartan-3E, and Spartan-3L FPGAs.

For engineers reviewing the TPS75003QRHLREP datasheet, TPS75003QRHLREP pinout, TPS75003QRHLREP application, or TPS75003QRHLREP equivalent, key selection considerations include independent soft-start per channel, adjustable output voltage ranges (1.2–6.5 V for bucks, 1–6.5 V for LDO), input voltage range (2.2–6.5 V), thermal shutdown (175°C), and QFN-20 (4.5 × 3.5 mm) packaging with exposed thermal pad.

Technical Context

The TPS75003QRHLREP implements two identical hysteretic buck controllers using minimum on-time/minimum off-time control, supporting discontinuous and continuous conduction modes. Each buck uses external PMOS switching, current sensing via IS1/IS2 pins (100 mV reference), and independent enable (EN1/EN2) and soft-start (SS1/SS2) pins for precise rail sequencing.

The integrated LDO employs a PMOS pass element with 0.507 V internal reference, stable with ≥2.2 μF ceramic output capacitance, and features ±4% feedback accuracy, 400 μV_RMS output noise, and undervoltage lockout (1.8 V threshold, 100 mV hysteresis). All three regulators support user-programmable output voltages via external resistor dividers.

Key Specifications

Pinout & Package

TPS75003QRHLREP is housed in a thermally enhanced 20-pin QFN package (RHL suffix) measuring 4.5 mm × 3.5 mm × 0.9 mm, featuring an exposed thermal pad (Pin 15) for efficient heat dissipation. DGND pins (6, 15, PAD) must be connected to PCB ground plane via short traces; AGND (Pin 18) is isolated for LDO reference stability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-rail power management applications.

Compared with TPS75003QRHLREP, TPS75003MRHLREP offers identical performance in smaller packaging quantity, while TPS75005QRHLREP delivers higher current capability at the cost of increased thermal design complexity - neither is pin-compatible replacement without validation of thermal margin and layout clearance.

Availability

TPS75003QRHLREP is available at Aetrix Electronics and suitable for FPGA power sequencing, aerospace avionics power distribution, and defense-grade embedded computing requiring stable component supply across extended temperature and long product lifecycles.

Supply support for TPS75003QRHLREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with decades of aerospace and defense qualification experience.

The TPS75003QRHLREP belongs to TI's radiation-tolerant, high-reliability PMIC product line engineered specifically for FPGA/DSP power delivery in mission-critical systems where extended temperature, long-term availability, and Xilinx interoperability are mandatory.

FAQ

What is the maximum output current supported by each buck regulator in the TPS75003QRHLREP?

The TPS75003QRHLREP supports up to 3 A per buck channel (Buck1 and Buck2) when used with appropriately rated external components - including PMOS transistor, Schottky diode, and inductor - and within thermal limits defined by the 42.6°C/W junction-to-ambient thermal resistance. The actual achievable current depends on input voltage, output voltage, ambient temperature, and PCB copper area.

Does the TPS75003QRHLREP require external compensation components for stability?

No, the TPS75003QRHLREP does not require external compensation components. Its hysteretic buck controllers operate without loop compensation, enabling stable operation with ceramic output capacitors and simplifying design. The LDO is internally compensated and stable with ≥2.2 μF ceramic output capacitance, as confirmed in the datasheet's stability testing.

Can the TPS75003QRHLREP power Xilinx Spartan-3E FPGAs?

Yes, the TPS75003QRHLREP is explicitly tested and endorsed by Xilinx for powering Spartan-3, Spartan-3E, and Spartan-3L FPGAs. It meets their strict startup profile requirements including monotonic voltage ramp, minimum rail rise time, and sequencing flexibility - verified in TI's application documentation and Xilinx compatibility reports.

What is the purpose of the SS1, SS2, and SS3 pins on the TPS75003QRHLREP?

The SS1, SS2, and SS3 pins on the TPS75003QRHLREP are soft-start timing inputs that control the voltage ramp rate of Buck1, Buck2, and the LDO respectively. Connecting an external capacitor to each pin programs the startup time - slowing inrush current and enabling controlled, staggered rail sequencing essential for FPGA configuration integrity.

Is the TPS75003QRHLREP compatible with ceramic output capacitors on the LDO output?

Yes, the TPS75003QRHLREP LDO (Channel 3) is fully stable with ceramic output capacitors ≥2.2 μF, as specified in the datasheet. This eliminates the need for bulkier, less reliable tantalum or aluminum electrolytic capacitors and supports compact, high-reliability designs common in aerospace and defense applications.