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Toshiba Semiconductor and Storage TRS8V65H,LQ

Part No.:
TRS8V65H,LQ
Manufacturer:
Toshiba Semiconductor and Storage
Category:
Single Diodes
Package:
4-VSFN Exposed Pad
Datasheet:
AetrixTRS8V65H,LQ.pdf
Description:
G3 SIC-SBD 650V 8A DFN8X8
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,000

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Product details

Overview

TRS8V65H from Toshiba Electronic Devices & Storage Corporation is a 650 V, 8 A silicon carbide Schottky barrier diode in DFN8x8 package, featuring VF = 1.2 V (typ.) at 4 A, Qc = 22 nC (typ.) at 400 V, and IR = 1.5 µA (typ.) at 650 V, designed for high-efficiency PFC stages in industrial power supplies.

For engineers reviewing the TRS8V65H datasheet, TRS8V65H pinout, TRS8V65H application, or TRS8V65H equivalent, key selection criteria include junction-to-case thermal resistance (2.20 °C/W), repetitive peak reverse voltage rating (650 V), and low capacitive charge for reduced switching losses in hard-switched topologies.

Technical Context

This SiC SBD employs third-generation chip design to minimize conduction and switching losses simultaneously. Its low forward voltage and ultra-low reverse recovery charge enable operation at higher frequencies without significant thermal penalty.

The device uses a heatsink-integrated cathode (Pin 5) and non-connected terminals (Pins 1–2) to support high-current, low-inductance PCB layouts. Thermal performance is specified with Rth(j-c) = 2.20 °C/W at Tc = 25 °C, enabling direct thermal coupling to copper planes or heatsinks.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM650 V - supports DC bus voltages up to 400 VDC with 1.6× safety margin in PFC and solar inverter applications
IF(DC)8 A - continuous forward current rating at Tc = 148 °C, suitable for compact, high-power-density designs
VF (typ.)1.2 V @ 4 A - reduces conduction loss by ~30% vs. comparable Si diodes, improving system efficiency
Qc (typ.)22 nC @ 400 V - minimizes turn-off energy loss and EMI generation in high-frequency switching converters
Rth(j-c)2.20 °C/W - enables direct thermal path to PCB copper or external heatsink, critical for thermal management in sealed enclosures
IR (typ.)1.5 µA @ 650 V - ensures stable blocking behavior at elevated temperatures and high DC link voltages

Pinout & Package

Package: DFN8x8 (Toshiba designation: 2-8T1A), surface-mount, thermally enhanced with exposed cathode pad (Pin 5) for heatsinking. Weight: 0.175 g (typ.).

Pin/TerminalCircuit RoleDesign Meaning
1, 2No ConnectElectrically isolated; must remain unconnected on PCB to avoid parasitic coupling or thermal interference
3, 4AnodeParallel anode terminals reduce current density and package inductance; require symmetrical trace routing
5Cathode (Heatsink)Exposed metal pad serving as primary thermal and electrical cathode connection; must be soldered to large copper area

Key Features

FeatureDesign Value
Third-generation SiC chip designOptimized epitaxial layer and termination structure for balanced VF/Qc trade-off and improved surge robustness
Low forward voltageVF = 1.2 V (typ.) at 4 A reduces conduction loss in continuous conduction mode (CCM) PFC
Low total capacitive chargeQc = 22 nC (typ.) at 400 V lowers switching loss and dV/dt-induced gate ringing in MOSFET/IGBT half-bridges
Low reverse leakageIR = 1.5 µA (typ.) at 650 V ensures stable high-voltage blocking even at 150 °C junction temperature

Applications

Power Factor CorrectionSolar Inverters

Use Scenario: Boost PFC stage in 3–5 kW industrial AC-DC front-ends operating at 100–300 kHz.

IC Role / Device Role / Timing Role: High-frequency rectifier replacing Si fast recovery diodes to reduce losses and improve efficiency.

Use Value: Enables >98.5% PFC efficiency at full load due to low VF and near-zero reverse recovery.

Use Scenario: DC string input stage of transformerless string inverters handling 600–1000 VDC inputs.

IC Role / Device Role / Timing Role: Freewheeling and anti-parallel diode in SiC MOSFET-based H-bridge output stage.

Use Value: Eliminates reverse recovery tail, reducing switching stress and allowing higher PWM frequency for smaller magnetics.

Uninterruptible Power SuppliesDC-DC Converters

Use Scenario: Bidirectional DC-DC isolation stage in online UPS systems with 400 VDC intermediate bus.

IC Role / Device Role / Timing Role: Synchronous rectification diode in LLC resonant converter secondary side.

Use Value: Maintains high efficiency (>96%) across wide load range while minimizing thermal derating at elevated ambient.

Use Scenario: Output rectification in 48 V–12 V isolated DC-DC modules for server and telecom power supplies.

IC Role / Device Role / Timing Role: Primary-side clamp or snubber diode in active clamp forward or ZVS phase-shifted full-bridge topologies.

Use Value: Low Qc prevents voltage overshoot during clamping transitions, improving reliability under transient loads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC Schottky diode applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STPSC8H065DHigher VF (1.45 V typ. @ 8 A); same VRRM and IF(DC); TO-220AC packageRequires mechanical heatsink mounting; less suitable for ultra-thin or high-density layoutsPreferred where board-level thermal mass is limited but mechanical heatsinking is available
IXYS DSSK60-06ASLower IF(DC) (6 A); dual-die configuration; TO-247 package; higher Qc (30 nC)Designed for paralleled operation; larger footprint and higher layout inductanceSelected when redundancy or dual-phase interleaving is required in high-reliability systems

Compared with STPSC8H065D and IXYS DSSK60-06AS, the TRS8V65H offers superior power density and lower switching loss due to its DFN8x8 package and optimized third-generation SiC die, making it ideal for space-constrained, high-frequency PFC and inverter designs where thermal coupling to PCB is prioritized.

Availability

TRS8V65H is available at Aetrix Electronics and suitable for Power Factor Correction, Solar Inverters, and Uninterruptible Power Supplies requiring stable component supply and consistent parametric performance across production batches.

Supply support for TRS8V65H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, with core expertise in SiC and IGBT technologies.

The TRS8V65H belongs to Toshiba's third-generation SiC Schottky diode product line, engineered specifically for high-efficiency, high-frequency power conversion in industrial and renewable energy systems.

FAQ

What is the maximum junction temperature rating for the TRS8V65H?

The TRS8V65H has a maximum junction temperature (Tj) rating of 175 °C, as specified in its Absolute Maximum Ratings table. This allows operation in high-ambient environments such as enclosed power supplies or outdoor solar inverters, provided thermal design maintains Tj ≤ 175 °C under worst-case load and ambient conditions. The TRS8V65H datasheet defines derating curves for power dissipation versus case temperature.

Does the TRS8V65H have a built-in thermal pad, and how should it be mounted?

Yes, the TRS8V65H features an exposed cathode pad (Pin 5) that serves as both electrical cathode and thermal interface. It must be soldered directly to a large copper pour or thermal pad on the PCB, with recommended stencil aperture and solder paste volume per Toshiba's mounting guidelines. Pins 1 and 2 are NC and must remain unconnected to avoid compromising thermal or electrical performance of the TRS8V65H.

How does the TRS8V65H's Qc compare to silicon diodes in the same voltage class?

The TRS8V65H exhibits Qc = 22 nC (typ.) at 400 V, which is approximately 85–90% lower than fast recovery silicon diodes rated for 600 V. This reduction directly lowers turn-off switching loss and EMI in hard-switched converters. Unlike silicon diodes, the TRS8V65H has no reverse recovery tail, eliminating associated voltage spikes and gate drive stress in adjacent MOSFETs or IGBTs.

Is the TRS8V65H RoHS compliant and halogen-free?

Yes, the TRS8V65H complies with the EU RoHS Directive and is halogen-free, as confirmed in Toshiba's official product documentation and environmental compliance statements. Material declarations and test reports are available upon request through Aetrix Electronics' technical support team for the TRS8V65H.

Can the TRS8V65H replace a standard 650 V silicon diode without circuit redesign?

While the TRS8V65H shares the same VRRM rating, its zero reverse recovery and lower VF require review of gate drive strength, snubber sizing, and thermal layout. Direct replacement may cause overvoltage transients in circuits relying on silicon diode recovery for soft switching. Optimal integration of the TRS8V65H typically involves adjusting gate resistors and verifying voltage overshoot with oscilloscope measurements during TRS8V65H evaluation.

TRS8V65H,LQ Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
4-VSFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
SiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max):
650 V
Current - Average Rectified (Io):
8A
Voltage - Forward (Vf) (Max) @ If:
1.35 V @ 8 A
Speed:
No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr):
0 ns
Current - Reverse Leakage @ Vr:
90 µA @ 650 V
Capacitance @ Vr, F:
520pF @ 1V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-DFN-EP (8x8)
Operating Temperature - Junction:
175°C

TRS8V65H,LQ FAQ

1.How can I place an order for TRS8V65H,LQ through Aetrix?

Please submit a Request for Quotation (RFQ) for TRS8V65H,LQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TRS8V65H,LQ reliable?

The price and inventory of TRS8V65H,LQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TRS8V65H,LQ is usually 5 days.

3.What payment methods are accepted for TRS8V65H,LQ?

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TRS8V65H,LQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TRS8V65H,LQ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TRS8V65H,LQ?

For technical support, including TRS8V65H,LQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TRS8V65H,LQ requirements.

6.How does Aetrix verify that TRS8V65H,LQ is sourced from the original manufacturer or authorized distributors?

All TRS8V65H,LQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TRS8V65H,LQ meets industry standards.

7.What is the process for return or replacement of TRS8V65H,LQ?

All TRS8V65H,LQ units undergo pre-shipment inspection (PSI). If there is an issue with TRS8V65H,LQ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TRS8V65H,LQ part is unused and in its original packaging.

Return procedure for TRS8V65H,LQ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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