Taiwan Semiconductor Corporation TS10P01G-K

Overview

TS10P01G-K from Taiwan Semiconductor is a 10A, 50V standard quad bridge rectifier in TS-6P package, featuring glass-passivated junctions, <10µA reverse current at 25°C, 200A surge capability, and UL recognition (E-326243). It serves as the AC-to-DC front-end in compact SMPS designs requiring high reliability under repetitive surge stress.

For engineers reviewing the TS10P01G-K datasheet, TS10P01G-K pinout, TS10P01G-K application, or TS10P01G-K equivalent, key selection criteria include VRRM=50V, IF=10A, IFSM=200A, RθJC=1.4°C/W, and TS-6P mechanical compatibility with PCB-mount thermal management in space-constrained adapters and lighting drivers.

Technical Context

This device integrates four silicon diodes in a single-phase full-wave bridge configuration with common-cathode/common-anode topology. Its glass-passivated junction ensures stable leakage performance across -55°C to +150°C operating range and supports soldering per J-STD-002.

The TS-6P package provides low thermal resistance (RθJC = 1.4°C/W) and meets UL 94V-0 flammability rating. Matte tin-plated leads pass JESD201 Class 1A whisker testing, enabling reliable long-term interconnect integrity in industrial-grade power supplies.

Key Specifications

Pinout & Package

TS-6P is a molded plastic dual-in-line package with six external terminals: two AC inputs (A1, A2), one positive DC output (+), one negative DC output (–), and two internal tie-points (typically unused or internally connected). Leads are matte tin-plated and compliant with J-STD-002 solderability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU10K and DB107, TS10P01G-K delivers optimal balance of UL compliance, thermal performance (1.4°C/W), and leakage control (<10 µA) for 50V-rated SMPS where safety certification, compact layout, and low standby loss are prioritized.

Availability

TS10P01G-K is available at Aetrix Electronics and suitable for switching mode power supplies, USB-C adapters, and LED lighting drivers requiring stable component supply with consistent parametric performance and traceable sourcing.

Supply support for TS10P01G-K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power electronics and industrial markets since 1979.

The TS10P series was designed specifically for high-reliability, high-surge AC/DC front-end rectification in compact, thermally demanding power supplies-emphasizing UL recognition, low leakage, and robust TS-6P mechanical integration.

FAQ

What is the maximum junction temperature rating for TS10P01G-K?

The TS10P01G-K has a maximum junction temperature (TJ max) of +150°C, verified per absolute maximum ratings in the official datasheet. This rating enables continuous operation in enclosed power supplies with limited airflow. Derating curves confirm usable current capacity down to 0 A at 150°C case temperature. The TS10P01G-K must be mounted with appropriate thermal interface to maintain junction temperature below this limit during full-load operation.

Does TS10P01G-K meet RoHS and halogen-free requirements?

Yes, TS10P01G-K is RoHS compliant and halogen-free per IEC 61249-2-21, as explicitly stated in the product documentation. The TS-6P molding compound contains no brominated flame retardants or chlorine-based additives. This compliance supports market access in EU, China, and other regions with strict environmental regulations. The TS10P01G-K marking includes "G" to denote green compound.

What is the reverse leakage current specification for TS10P01G-K at elevated temperature?

At TJ = 125°C and rated reverse voltage (50 V), the TS10P01G-K exhibits a maximum reverse current (IR) of 500 µA per diode, measured using a 30 ms pulse test. At 25°C, IR is ≤10 µA. This controlled leakage ensures minimal standby power loss in energy-efficient designs. The TS10P01G-K maintains this performance across its full storage temperature range (–55°C to +150°C).

Is TS10P01G-K UL recognized, and what is the file number?

Yes, TS10P01G-K is UL Recognized under File # E-326243, covering the entire TS10P01G-K through TS10P07G-K family. This recognition applies to the TS-6P package and validates dielectric strength, flammability (UL 94V-0), and construction safety for end-product certification. The TS10P01G-K marking includes "G" and "K" suffixes confirming UL listing and green compound compliance.

What is the thermal resistance from junction to case (RθJC) for TS10P01G-K?

The junction-to-case thermal resistance (RθJC) of TS10P01G-K is 1.4°C/W, measured under standard test conditions. This value enables effective heat transfer from the silicon die to an external heatsink or metal-core PCB. When designing thermal management, this RθJC must be combined with heatsink resistance and interface material resistance to calculate total θJA. The TS10P01G-K achieves this low value via optimized die attach and TS-6P package geometry.